KR950000219B1 - 도금층 형성용 수지성형품 - Google Patents

도금층 형성용 수지성형품 Download PDF

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Publication number
KR950000219B1
KR950000219B1 KR1019900010276A KR900010276A KR950000219B1 KR 950000219 B1 KR950000219 B1 KR 950000219B1 KR 1019900010276 A KR1019900010276 A KR 1019900010276A KR 900010276 A KR900010276 A KR 900010276A KR 950000219 B1 KR950000219 B1 KR 950000219B1
Authority
KR
South Korea
Prior art keywords
molded article
polyamide
plating
resin molded
acid component
Prior art date
Application number
KR1019900010276A
Other languages
English (en)
Korean (ko)
Other versions
KR910003016A (ko
Inventor
후미또시 이께지리
사네히로 야마모또
게이지 가와모또
Original Assignee
미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤
다께바야시 쇼오고
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤, 다께바야시 쇼오고 filed Critical 미쓰이 세끼유 가가꾸 고오교오 가부시끼가이샤
Publication of KR910003016A publication Critical patent/KR910003016A/ko
Application granted granted Critical
Publication of KR950000219B1 publication Critical patent/KR950000219B1/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemically Coating (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
KR1019900010276A 1989-07-07 1990-07-07 도금층 형성용 수지성형품 KR950000219B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP1-176059 1989-07-07
JP17605989 1989-07-07
JP1-232404 1989-09-07
JP23240489 1989-09-07
JP2-161569 1990-06-20
JP02161569A JP3009707B2 (ja) 1989-07-07 1990-06-20 メッキ層形成用樹脂組成物およびその用途

Publications (2)

Publication Number Publication Date
KR910003016A KR910003016A (ko) 1991-02-26
KR950000219B1 true KR950000219B1 (ko) 1995-01-12

Family

ID=26497129

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010276A KR950000219B1 (ko) 1989-07-07 1990-07-07 도금층 형성용 수지성형품

Country Status (2)

Country Link
JP (1) JP3009707B2 (ja)
KR (1) KR950000219B1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060292385A1 (en) * 2004-07-27 2006-12-28 Andreas Renekn Method of plating mineral filled polyamide compositions and articles formed thereby
JP6841588B2 (ja) * 2014-10-31 2021-03-10 花王株式会社 制振材料用のポリアミド樹脂組成物
WO2021054050A1 (ja) * 2019-09-17 2021-03-25 東洋紡株式会社 めっき成形品用半芳香族ポリアミド樹脂組成物、及びめっき成形品

Also Published As

Publication number Publication date
KR910003016A (ko) 1991-02-26
JP3009707B2 (ja) 2000-02-14
JPH03197558A (ja) 1991-08-28

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