KR940014610A - 광반도체 봉지용 에폭시 수지조성물 - Google Patents

광반도체 봉지용 에폭시 수지조성물 Download PDF

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KR940014610A
KR940014610A KR1019920026318A KR920026318A KR940014610A KR 940014610 A KR940014610 A KR 940014610A KR 1019920026318 A KR1019920026318 A KR 1019920026318A KR 920026318 A KR920026318 A KR 920026318A KR 940014610 A KR940014610 A KR 940014610A
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South Korea
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weight
epoxy resin
resin composition
micrometers
optical semiconductor
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KR1019920026318A
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KR0142310B1 (ko
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이은정
진일교
김치구
이재웅
문석환
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김충세
고려화학 주식회사
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Publication of KR940014610A publication Critical patent/KR940014610A/ko
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Publication of KR0142310B1 publication Critical patent/KR0142310B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)

Abstract

본 발명은 (A)에폭시 수지, (B)페놀수지, (C)실란 커플링제, (D)구상실리카 (E)이형제로 구성되어, 전기절연성 및 광투과성이 우수하며 내열성, 내흡수성, 기게적 특성이 매우 우수하여 광반도체 디바이스중 포토커플러와 같은 발광소자 및 수광소자가 일체화 되어 있는 광반도체 장치류에 적용가능한 에폭시 수지 조성물에 관한 것이다.

Description

광반도체 봉지용 에폭시 수지조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제2도는 본 발명의 에폭시수지 조성물로 트랜스퍼성형을 사용한 광반도체를 도시하는 개략도이다.

Claims (5)

  1. (A)에폭시 수지 200중량부, (B)페놀수지 70 내지 150중량부, (C)실란 커플링제 3 내지 10중량부, (D)구상실리카분말 600 내지 700중량부 및 (E)이형제 3 내지 20중량부로 구성되는 것을 특징으로 하는 광반도체 봉지용 에폭수지 조성물.
  2. 제1항에 있어서, 상기 에폭시 수지는 페놀 노볼락 수지 또는 크레졸 노볼락 수지로 1분자내에 에폭시기가 3개이상존재하는 노블락형 에폭시를 포함하는 것을 특징으로 하는 광반도체 봉지용 에폭시수지 조성물,
  3. 제1항에 있어서, 상기 페놀 수지가 노볼락형 페놀수지 및 분자내 이중결합을 갖지 않는 산무수물경화제가 20∼50중량%를 함유하는 것을 특징으로 하는 광반도체 봉지용 에폭시수지 조성물.
  4. 제1항에 있어서, 상기 실리카 분말이 평균입경이 10∼30마이크로미터인 것을 특징으로 하는 광반도체 봉지용 에폭시수지 조성물.
  5. 제1항 또는 제4항에 있어서, 상기 실리카분말이 실리카 총 배합양중 5∼20마이크로미터 25중량%, 20∼40마이크로미터 35중량%, 40∼60마이크로미터 25중량% 60∼80마이크로미터 15중량%의 입도분포를 갖는 구상 실리카인 것을 특징으로 하는 광반도체 봉지용 에폭시수지 조성물.
    ※참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019920026318A 1992-12-29 1992-12-29 광반도체 봉지용 에폭시 수지조성물 KR0142310B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019920026318A KR0142310B1 (ko) 1992-12-29 1992-12-29 광반도체 봉지용 에폭시 수지조성물

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019920026318A KR0142310B1 (ko) 1992-12-29 1992-12-29 광반도체 봉지용 에폭시 수지조성물

Publications (2)

Publication Number Publication Date
KR940014610A true KR940014610A (ko) 1994-07-19
KR0142310B1 KR0142310B1 (ko) 1998-07-01

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ID=19347468

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920026318A KR0142310B1 (ko) 1992-12-29 1992-12-29 광반도체 봉지용 에폭시 수지조성물

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