KR940008866A - 프레스 다이 - Google Patents

프레스 다이 Download PDF

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Publication number
KR940008866A
KR940008866A KR1019930020935A KR930020935A KR940008866A KR 940008866 A KR940008866 A KR 940008866A KR 1019930020935 A KR1019930020935 A KR 1019930020935A KR 930020935 A KR930020935 A KR 930020935A KR 940008866 A KR940008866 A KR 940008866A
Authority
KR
South Korea
Prior art keywords
die
punch
workpiece
lower die
press die
Prior art date
Application number
KR1019930020935A
Other languages
English (en)
Other versions
KR0134168B1 (ko
Inventor
니시야 유이찌
다까노 요시하루
다까하시 코조
오이마이쭈미 야스
오노 야스히로
Original Assignee
가와이 이사무
후지 주코교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR940008866A publication Critical patent/KR940008866A/ko
Application granted granted Critical
Publication of KR0134168B1 publication Critical patent/KR0134168B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628—Means for adjusting the position of the cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00—Shaping by press-cutting; Perforating
    • B21D28/24—Perforating, i.e. punching holes
    • B21D28/32—Perforating, i.e. punching holes in other articles of special shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/02—Perforating by punching, e.g. with relatively-reciprocating punch and bed
    • B26F1/14—Punching tools; Punching dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D2007/2685—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member flexible mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/202—With product handling means
    • Y10T83/2092—Means to move, guide, or permit free fall or flight of product
    • Y10T83/2096—Means to move product out of contact with tool
    • Y10T83/2135—Moving stripper timed with tool stroke
    • Y10T83/215—Carried by moving tool element or its support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8737—With tool positioning means synchronized with cutting stroke
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8771—Motion direction of tool influenced by resistance of work
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8776—Constantly urged tool or tool support [e.g., spring biased]
    • Y10T83/8785—Through return [noncutting] stroke
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9411—Cutting couple type
    • Y10T83/9423—Punching tool
    • Y10T83/9425—Tool pair

Abstract

본 발명은 하부다이(8 ; 11)로부터 원근이동될 수 있는 상부다이(1 ;13)를 갖춘 천공작업용 프레스다이에 관한 것으로, 상기 상부다이가 하부다이쪽으로 이동될 때에 상·하부 다이사이에 개재된 패드(2 ; 15)로 하부다이쪽으로 가압되어 하부다이에 작업편(w)을 고정시키게 되는데, 이 패드에는 관형상의 탄성부재( 6; 18)가 끼워지는 구멍이 형성되어 있고, 상기 탄성부재는 돌출팁(7d ; 19d)을 갖춘 펀치(7 ; 19)가 관통하는 구멍이 형성됨과 더불어 상기 하부다이에도 돌출팁과 상응하는 구멍이 형성되어 있으며, 상기 상부다이(1 ; 13)가 작업편이 놓여진 하부다이쪽으로 이동될 때에, 상기 패트(2 ; 15)에 의해 작업편이 지지되면서 상부다이가 펀치를 작동시켜 이 펀치의 돌출칩(7d, 19d)이 구멍내로 삽입되어 작업편을 펀칭하게 되며, 상기 탄성부재(16 ; 18)는 변형가능하면서 펀치가 측방향으로 이동될 수 있는 탄성재질로 형성되어 상기 돌출팁과 구멍이 정확하게 동축상으로 정렬될 수 있게 되어 있다.

Description

프레스다이
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
도1은 본 발명에 따른 천공작업용 프레스다이의 부분측면도,
도2의 (a), (b)는 도1에 도시된 프레스다이에 사용되는 서로 다른 탄성 부재의 사시도,
도3은 프레스다이의 작동을 설명하기 위한 확대단면도,
도4는 도3의 차기 단계공정의 설명도,

Claims (4)

  1. 작업편을 천공하기 위해 상부다이와 하부다이로 이루어지고 상기 상·하부다이 사이에 개재된 패드를 갖춤과 더불어 펀치가 설치되어 이루어진 천공용 프레스다이에 있어서, 상기 한쪽 다이에서 작업편(w)을 고정하기 위하여 상부다이(1 ; 13)와 하부다이(8 ; 11) 사이에 설치된 삽입구멍(5 ; 17)을 갖춘 패드(2 ; 15)와, 이 삽입구멍(5 ; 17)에 삽입되는 관통구멍(6a ; 18)을 갖춘 탄성부재(6 ; 18), 소정간격으로 이동하도록 상기 탄성부재(6 ; 18)에 의해 지지되면서 관통구멍(6a ; 18a)에 삽입된 펀치(7 ; 19 ; 21) 및, 천공시 작업편(w)의 파편을 밀때 다이 중공부(9a, 12a)에 정확하게 중심정렬 되도록 펀치에 돌출팁(7d ; 19d)이 설치되어 이루어진 것을 특징으로 하는 프레스다이.
  2. 청구항1에 있어서, 상기 탄성부재(6 ; 18)에는 측방향으로 손쉽게 변형되기 위하여 이 탄성부재의 측벽상에서 펀치(7 ; 19 ; 21)의 축과 평행한 여러개의 길이방향홈(6c)이 형성된 것을 특징으로 하는 프레스다이.
  3. 청구항1에 있어서, 상기 돌출팁(7d)은 작업편(w)의 변형부 위에서 중심에 맞추어지기 위해 다이 중공부(9a ; 12a)의 중앙에 돌출되어지는 것을 특징으로 하는 프레스다이.
  4. 청구항1에 있어서, 상기 상부다이(13)에는 이의 한쪽 선단에서 경사진 면을 갖춘 캠구동기구(16)가 설치되고, 상기 하부다이(11)에는 경사진 상태에서 작업편(w)의 구멍을 뚫기 위해 축의 다른 방향에 있는 펀치(21)를 변위시키면서 어깨부(21b)에 접한 마모판(22)이 설치되어 이루어진 것을 특징으로 하는 프레스다이.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019930020935A 1992-10-09 1993-10-09 프레스다이 KR0134168B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP70625/92 1992-10-09
JP1992070625U JP2592473Y2 (ja) 1992-10-09 1992-10-09 ピアス加工用プレス型
JP7062592 1993-10-09

Publications (2)

Publication Number Publication Date
KR940008866A true KR940008866A (ko) 1994-05-16
KR0134168B1 KR0134168B1 (ko) 1998-06-15

Family

ID=13436994

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019930020935A KR0134168B1 (ko) 1992-10-09 1993-10-09 프레스다이

Country Status (5)

Country Link
US (1) US5471901A (ko)
JP (1) JP2592473Y2 (ko)
KR (1) KR0134168B1 (ko)
DE (1) DE4334417C2 (ko)
TW (1) TW301957U (ko)

Families Citing this family (14)

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Publication number Priority date Publication date Assignee Title
JP3452491B2 (ja) * 1998-08-04 2003-09-29 株式会社アマダ パンチホルダ装置
JP3757635B2 (ja) * 1998-08-26 2006-03-22 オイレス工業株式会社 カム装置
DE60000210T2 (de) * 1999-03-04 2003-02-20 Murata Machinery Ltd Einrichtung zur Zentrierung der Werkzeuge einer Stanzpresse
DE50114633D1 (de) * 2001-11-07 2009-02-12 Xaver Kuoni Verfahren zur herstellung einer künstlichen gelenkprothese mit deckel
EP1384535A1 (de) * 2002-07-25 2004-01-28 Harald Weigelt Abstreifeinrichtung
BE1015113A3 (nl) * 2002-09-17 2004-10-05 Artilat Nv Verbeterde bovenmatras.
KR100636619B1 (ko) * 2006-08-01 2006-10-23 주식회사 한텍테크놀로지 프레스의 경사천공장치
JP5913989B2 (ja) * 2012-01-10 2016-05-11 株式会社アマダホールディングス プレス機械
DE102014101349A1 (de) * 2014-02-04 2015-08-06 Benteler Automobiltechnik Gmbh Umformwerkzeug mit Lochstempel
CN105751273B (zh) * 2016-04-30 2018-06-29 平阳县力泰机械有限公司 塑料容器裁边机
EP3246139B1 (en) * 2016-05-16 2020-09-30 Tetra Laval Holdings & Finance S.A. A cutting tool and a method for cutting a web or sheet of material
EP3246138B1 (en) * 2016-05-16 2020-05-06 Tetra Laval Holdings & Finance S.A. A cutting system, and a method for cutting a web or sheet of material
EP3246140B1 (en) * 2016-05-16 2019-06-26 Tetra Laval Holdings & Finance S.A. Cutting unit and method for cutting
CN112207182B (zh) * 2020-10-14 2023-08-29 东风汽车零部件(集团)有限公司通用铸锻分公司 一种有耳挡圈加工线的耳孔冲切模具

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Also Published As

Publication number Publication date
DE4334417A1 (de) 1994-04-14
DE4334417C2 (de) 1998-09-03
TW301957U (en) 1997-04-01
JP2592473Y2 (ja) 1999-03-24
JPH0634818U (ja) 1994-05-10
US5471901A (en) 1995-12-05
KR0134168B1 (ko) 1998-06-15

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