KR930010971B1 - 기판을 열처리하기 위한 장치 - Google Patents

기판을 열처리하기 위한 장치 Download PDF

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Publication number
KR930010971B1
KR930010971B1 KR1019900008438A KR900008438A KR930010971B1 KR 930010971 B1 KR930010971 B1 KR 930010971B1 KR 1019900008438 A KR1019900008438 A KR 1019900008438A KR 900008438 A KR900008438 A KR 900008438A KR 930010971 B1 KR930010971 B1 KR 930010971B1
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KR
South Korea
Prior art keywords
substrate
heat treatment
storage device
board
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019900008438A
Other languages
English (en)
Korean (ko)
Other versions
KR910001897A (ko
Inventor
마사미 오타니
켄지 카메이
Original Assignee
다이닛뽕스쿠린세이소오 가부시키가이샤
이시다아키라
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이닛뽕스쿠린세이소오 가부시키가이샤, 이시다아키라 filed Critical 다이닛뽕스쿠린세이소오 가부시키가이샤
Publication of KR910001897A publication Critical patent/KR910001897A/ko
Application granted granted Critical
Publication of KR930010971B1 publication Critical patent/KR930010971B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1019900008438A 1989-06-09 1990-06-08 기판을 열처리하기 위한 장치 Expired - Lifetime KR930010971B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1-67814 1989-06-09
JP1989067814U JPH0536269Y2 (enrdf_load_stackoverflow) 1989-06-09 1989-06-09
JP89-67814(U) 1989-06-09

Publications (2)

Publication Number Publication Date
KR910001897A KR910001897A (ko) 1991-01-31
KR930010971B1 true KR930010971B1 (ko) 1993-11-18

Family

ID=13355791

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900008438A Expired - Lifetime KR930010971B1 (ko) 1989-06-09 1990-06-08 기판을 열처리하기 위한 장치

Country Status (2)

Country Link
JP (1) JPH0536269Y2 (enrdf_load_stackoverflow)
KR (1) KR930010971B1 (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59211243A (ja) * 1983-05-17 1984-11-30 Toshiba Corp 半導体基板処理装置

Also Published As

Publication number Publication date
KR910001897A (ko) 1991-01-31
JPH0536269Y2 (enrdf_load_stackoverflow) 1993-09-14
JPH038424U (enrdf_load_stackoverflow) 1991-01-28

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Legal Events

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A201 Request for examination
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19900608

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19900608

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 19930416

Patent event code: PE09021S01D

AMND Amendment
G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

Comment text: Decision on Publication of Application

Patent event code: PG16051S01I

Patent event date: 19931025

O035 Opposition [patent]: request for opposition

Free format text: OPPOSITION NUMBER: 001994001558; OPPOSITION DATE: 19940118

PO0301 Opposition

Comment text: Request for Opposition

Patent event code: PO03011R01D

Patent event date: 19940118

Opposition date: 19940118

Opposition identifier: 001994001558

E601 Decision to refuse application
O063 Decision on refusal after opposition [patent]: decision to refuse application
PO0601 Decision on refusal after opposition

Comment text: Decision to Refuse Application

Patent event date: 19940825

Patent event code: PO06011S01D

J2X1 Appeal (before the patent court)

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Free format text: TRIAL NUMBER: 1994201001885; APPEAL AGAINST DECISION TO DECLINE REFUSAL

PJ2001 Appeal

Appeal kind category: Appeal against decision to decline refusal

Decision date: 19970331

Appeal identifier: 1994201001885

Request date: 19940926

PB0901 Examination by re-examination before a trial

Comment text: Request for Trial against Decision on Refusal

Patent event date: 19940926

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 19930812

Patent event code: PB09011R02I