KR930004251B1 - 전력 반도체 패키지 - Google Patents

전력 반도체 패키지 Download PDF

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Publication number
KR930004251B1
KR930004251B1 KR1019900010757A KR900010757A KR930004251B1 KR 930004251 B1 KR930004251 B1 KR 930004251B1 KR 1019900010757 A KR1019900010757 A KR 1019900010757A KR 900010757 A KR900010757 A KR 900010757A KR 930004251 B1 KR930004251 B1 KR 930004251B1
Authority
KR
South Korea
Prior art keywords
package
semiconductor device
rear body
main body
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019900010757A
Other languages
English (en)
Korean (ko)
Other versions
KR910003792A (ko
Inventor
2세 얼 엠. 에스테스
Original Assignee
휴즈 에어크라프트 캄파니
원다 케이. 덴슨-로우
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 휴즈 에어크라프트 캄파니, 원다 케이. 덴슨-로우 filed Critical 휴즈 에어크라프트 캄파니
Publication of KR910003792A publication Critical patent/KR910003792A/ko
Application granted granted Critical
Publication of KR930004251B1 publication Critical patent/KR930004251B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/38—Cooling arrangements using the Peltier effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1019900010757A 1989-07-18 1990-07-16 전력 반도체 패키지 Expired - Fee Related KR930004251B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US381,559 1989-07-18
US07/381,559 US4922379A (en) 1989-07-18 1989-07-18 Power semiconductor package

Publications (2)

Publication Number Publication Date
KR910003792A KR910003792A (ko) 1991-02-28
KR930004251B1 true KR930004251B1 (ko) 1993-05-22

Family

ID=23505501

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900010757A Expired - Fee Related KR930004251B1 (ko) 1989-07-18 1990-07-16 전력 반도체 패키지

Country Status (9)

Country Link
US (1) US4922379A (enExample)
EP (1) EP0409426A3 (enExample)
JP (1) JPH0358460A (enExample)
KR (1) KR930004251B1 (enExample)
AU (1) AU607367B1 (enExample)
CA (1) CA2018808C (enExample)
EG (1) EG19195A (enExample)
IL (1) IL94761A0 (enExample)
NO (1) NO903097L (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960560B2 (ja) * 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器
KR100887540B1 (ko) * 2008-10-23 2009-03-09 (주) 래트론 박형 수지보호 센서 소자

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568761A (en) * 1969-05-20 1971-03-09 Rca Corp Semiconductor mounting adapter
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4577402A (en) * 1984-06-13 1986-03-25 Penn Engineering & Manufacturing Corp. Stud for mounting and method of mounting heat sinks on printed circuit boards
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
DE3611346A1 (de) * 1986-04-04 1987-10-08 Bbc Brown Boveri & Cie Vorrichtung zur standmontage von halbleiter-bauelementen, insbesondere transistoren
US4695924A (en) * 1986-07-17 1987-09-22 Zenith Electronics Corporation Two piece heat sink with serrated coupling
DE8622759U1 (de) * 1986-08-25 1986-12-18 Siemens AG, 1000 Berlin und 8000 München Baugruppenmagazin mit einer Stromversorgung für einschiebbare elektrische Baugruppen

Also Published As

Publication number Publication date
EG19195A (en) 1994-07-30
CA2018808A1 (en) 1991-01-18
JPH0358460A (ja) 1991-03-13
IL94761A0 (en) 1991-04-15
NO903097D0 (no) 1990-07-11
NO903097L (no) 1991-01-21
JPH0587984B2 (enExample) 1993-12-20
EP0409426A3 (en) 1992-05-13
KR910003792A (ko) 1991-02-28
US4922379A (en) 1990-05-01
EP0409426A2 (en) 1991-01-23
CA2018808C (en) 1993-05-11
AU607367B1 (en) 1991-02-28

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A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

G160 Decision to publish patent application
PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19960523

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19960523

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000