AU607367B1 - Power semiconductor package - Google Patents

Power semiconductor package Download PDF

Info

Publication number
AU607367B1
AU607367B1 AU59068/90A AU5906890A AU607367B1 AU 607367 B1 AU607367 B1 AU 607367B1 AU 59068/90 A AU59068/90 A AU 59068/90A AU 5906890 A AU5906890 A AU 5906890A AU 607367 B1 AU607367 B1 AU 607367B1
Authority
AU
Australia
Prior art keywords
semiconductor device
end surface
device package
heatsink
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU59068/90A
Other languages
English (en)
Inventor
Earl M. Estes Jr.
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Application granted granted Critical
Publication of AU607367B1 publication Critical patent/AU607367B1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10W40/28
    • H10W40/611
    • H10W40/10
    • H10W40/60
    • H10W40/235

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU59068/90A 1989-07-18 1990-07-17 Power semiconductor package Ceased AU607367B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/381,559 US4922379A (en) 1989-07-18 1989-07-18 Power semiconductor package
US381559 1989-07-18

Publications (1)

Publication Number Publication Date
AU607367B1 true AU607367B1 (en) 1991-02-28

Family

ID=23505501

Family Applications (1)

Application Number Title Priority Date Filing Date
AU59068/90A Ceased AU607367B1 (en) 1989-07-18 1990-07-17 Power semiconductor package

Country Status (9)

Country Link
US (1) US4922379A (enExample)
EP (1) EP0409426A3 (enExample)
JP (1) JPH0358460A (enExample)
KR (1) KR930004251B1 (enExample)
AU (1) AU607367B1 (enExample)
CA (1) CA2018808C (enExample)
EG (1) EG19195A (enExample)
IL (1) IL94761A0 (enExample)
NO (1) NO903097L (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2960560B2 (ja) * 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器
KR100887540B1 (ko) * 2008-10-23 2009-03-09 (주) 래트론 박형 수지보호 센서 소자

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3568761A (en) * 1969-05-20 1971-03-09 Rca Corp Semiconductor mounting adapter
US4288839A (en) * 1979-10-18 1981-09-08 Gould Inc. Solid state device mounting and heat dissipating assembly
US4577402A (en) * 1984-06-13 1986-03-25 Penn Engineering & Manufacturing Corp. Stud for mounting and method of mounting heat sinks on printed circuit boards
DE3527208A1 (de) * 1985-07-30 1987-02-12 Bosch Gmbh Robert Elektrisches schaltgeraet
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
DE3611346A1 (de) * 1986-04-04 1987-10-08 Bbc Brown Boveri & Cie Vorrichtung zur standmontage von halbleiter-bauelementen, insbesondere transistoren
US4695924A (en) * 1986-07-17 1987-09-22 Zenith Electronics Corporation Two piece heat sink with serrated coupling
DE8622759U1 (de) * 1986-08-25 1986-12-18 Siemens AG, 1000 Berlin und 8000 München Baugruppenmagazin mit einer Stromversorgung für einschiebbare elektrische Baugruppen

Also Published As

Publication number Publication date
CA2018808C (en) 1993-05-11
US4922379A (en) 1990-05-01
EP0409426A3 (en) 1992-05-13
EP0409426A2 (en) 1991-01-23
EG19195A (en) 1994-07-30
CA2018808A1 (en) 1991-01-18
KR910003792A (ko) 1991-02-28
NO903097D0 (no) 1990-07-11
KR930004251B1 (ko) 1993-05-22
JPH0587984B2 (enExample) 1993-12-20
IL94761A0 (en) 1991-04-15
NO903097L (no) 1991-01-21
JPH0358460A (ja) 1991-03-13

Similar Documents

Publication Publication Date Title
US5396403A (en) Heat sink assembly with thermally-conductive plate for a plurality of integrated circuits on a substrate
US5548481A (en) Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population
US5615086A (en) Apparatus for cooling a plurality of electrical components mounted on a printed circuit board
US6713862B2 (en) Low temperature co-fired ceramic-metal packaging technology
CA2139266C (en) Semiconductor package
US4730232A (en) High density microelectronic packaging module for high speed chips
US5586009A (en) Bus communication system for stacked high density integrated circuit packages
US5747876A (en) Semiconductor device and semiconductor module
TW366575B (en) Semiconductor device and the manufacturing method
US12041755B2 (en) Power semiconductor module arrangement and method for producing a power semiconductor module arrangement
EP1620896A2 (en) Light emitting diodes packaged for high temperature operation
KR19990071661A (ko) 마이크로웨이브 하이브리드 집적회로
US5528079A (en) Hermetic surface mount package for a two terminal semiconductor device
US6008988A (en) Integrated circuit package with a heat spreader coupled to a pair of electrical devices
US6525944B1 (en) Windowed package for electronic circuitry
US4126882A (en) Package for multielement electro-optical devices
AU607367B1 (en) Power semiconductor package
US8395253B2 (en) Hermetic surface mounted power package
JPS63308943A (ja) 半導体装置
JP3555304B2 (ja) 電子装置
JPH0393259A (ja) 半導体装置
US20020189089A1 (en) Mounting electrical devices to circuit boards
US4972043A (en) Multi-lead hermetic power package with high packing density
EP0223475A2 (en) Microcircuit packaging member
JPS61269352A (ja) 半導体装置