KR920022434A - 와이어본딩용 보올 형성방법 및 장치 - Google Patents

와이어본딩용 보올 형성방법 및 장치 Download PDF

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Publication number
KR920022434A
KR920022434A KR1019920006261A KR920006261A KR920022434A KR 920022434 A KR920022434 A KR 920022434A KR 1019920006261 A KR1019920006261 A KR 1019920006261A KR 920006261 A KR920006261 A KR 920006261A KR 920022434 A KR920022434 A KR 920022434A
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KR
South Korea
Prior art keywords
discharge
time
wire
forming
high voltage
Prior art date
Application number
KR1019920006261A
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English (en)
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KR960002994B1 (ko
Inventor
요시미쓰 데라가도
가즈마사 사사꾸라
Original Assignee
아라이 가즈오
가부시끼가이샤 신가와
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 아라이 가즈오, 가부시끼가이샤 신가와 filed Critical 아라이 가즈오
Publication of KR920022434A publication Critical patent/KR920022434A/ko
Application granted granted Critical
Publication of KR960002994B1 publication Critical patent/KR960002994B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음.

Description

와이어본딩용 보올 형성방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예를 도시한 회로도.
제2도는 갭과 방진진압 및 방전시간의 관계를 도시한도.
제3도는 갭과 보올직경과의 관계를 도시한 도면이다.

Claims (2)

  1. 고압진원과 방전전극간에 전류회로를 설치, 와이어의 선단과 방전전극간에 방전시의 방전전류를 일정하게 제어하여 고전압을 인가하고 와이어의 선단에 보올을 형성하는 와이어본딩용 보울형성방법에 있어서, 상기 방전시에 있어서 방전진압을 검출하여 이 검출된 방전전압의 변화에 따라서 상기 정전류회로에 의한 방전시간을 제어하는 것을 특징으로 하는 와이어본딩용 보올 형성방법.
  2. 고전전원과 방전전극간에 정전류회로를 설치, 와이어의 선단과 방전전극간에 방전시의 방전전류를 일정하게 제어하여 고전압을 인가하고 와이어의 선단에 보올을 형성하는 와이어본딩용 보올 형성장치에 있어서, 상기 방전시에 있어서, 방전전압을 검출하는 방전진압검출회로와, 이 검출된 방전진압을 시간으로 변환하는 V-T 컨버어터와 이 변환된 시간에 의하여 방전시간을 보정하는 방전시간설정회로로 되고 방전전압의 변화에 따라서 상기 정전류회로에 의한 방전시간읕 제어하는 것을 특징으로 하는 와이어 본딩용 보올형성장치.
    ※ 참고사항 ; 최초출원 내용에 의하여 공개하는 것임.
KR1019920006261A 1991-05-24 1992-04-15 와이어본딩용 보올형성방법 및 장치 KR960002994B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP91-148125 1991-05-24
JP3148125A JP2835989B2 (ja) 1991-05-24 1991-05-24 ワイヤボンダ用ボール形成装置

Publications (2)

Publication Number Publication Date
KR920022434A true KR920022434A (ko) 1992-12-19
KR960002994B1 KR960002994B1 (ko) 1996-03-02

Family

ID=15445820

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920006261A KR960002994B1 (ko) 1991-05-24 1992-04-15 와이어본딩용 보올형성방법 및 장치

Country Status (3)

Country Link
US (1) US5214259A (ko)
JP (1) JP2835989B2 (ko)
KR (1) KR960002994B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101322474B1 (ko) * 2012-02-02 2013-10-28 현대성우오토모티브코리아 주식회사 이차전지 양전극의 단면적 증가형 러그 연결장치

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0722456A (ja) * 1993-06-30 1995-01-24 Mitsubishi Electric Corp ワイヤボンディングにおけるボール形成装置、その制御方法及びワイヤボンディング装置
US6062462A (en) * 1997-08-12 2000-05-16 Kulicke And Soffa Investments, Inc. Apparatus and method for making predetermined fine wire ball sizes
US20060261132A1 (en) * 1999-02-25 2006-11-23 Reiber Steven F Low range bonding tool
US7389905B2 (en) 1999-02-25 2008-06-24 Reiber Steven F Flip chip bonding tool tip
US20080197172A1 (en) * 1999-02-25 2008-08-21 Reiber Steven F Bonding Tool
US7032802B2 (en) * 1999-02-25 2006-04-25 Reiber Steven F Bonding tool with resistance
US20060071050A1 (en) * 1999-02-25 2006-04-06 Reiber Steven F Multi-head tab bonding tool
US7124927B2 (en) * 1999-02-25 2006-10-24 Reiber Steven F Flip chip bonding tool and ball placement capillary
US6354479B1 (en) 1999-02-25 2002-03-12 Sjm Technologies Dissipative ceramic bonding tip
US6651864B2 (en) 1999-02-25 2003-11-25 Steven Frederick Reiber Dissipative ceramic bonding tool tip
US20070131661A1 (en) * 1999-02-25 2007-06-14 Reiber Steven F Solder ball placement system
JP2003163235A (ja) * 2001-11-29 2003-06-06 Shinkawa Ltd ワイヤボンディング装置
JP4176671B2 (ja) * 2004-03-30 2008-11-05 株式会社新川 ワイヤボンディング装置
US20070085085A1 (en) * 2005-08-08 2007-04-19 Reiber Steven F Dissipative pick and place tools for light wire and LED displays
JP4530984B2 (ja) * 2005-12-28 2010-08-25 株式会社新川 ワイヤボンディング装置、ボンディング制御プログラム及びボンディング方法
TWI562252B (en) * 2014-02-17 2016-12-11 Shinkawa Kk Detecting discharging device, wire bonding device and detecting discharging method
WO2016178285A1 (ja) * 2015-05-03 2016-11-10 株式会社カイジョー ワイヤボンダ用ボール形成装置
CN106405172B (zh) * 2016-08-25 2019-03-12 河南省高压电器研究所 一种放电保护球隙
CN107042351B (zh) * 2017-04-18 2019-04-30 北京工业大学 一种非熔化极气体保护焊焊丝端部位置判定方法

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JPS6146968A (ja) * 1984-08-10 1986-03-07 Fuji Electric Co Ltd 電子写真用感光体の再生方法
US4687897A (en) * 1986-11-24 1987-08-18 Rockwell International Corporation Flame-off limited circuit for wire bonding ball forming apparatus
JPS6454859A (en) * 1987-08-25 1989-03-02 Nec Corp Private automatic branch exchange with absence transfer function
JPS6454858A (en) * 1987-08-25 1989-03-02 Nec Corp Private automatic branch exchange with voice calling function

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101322474B1 (ko) * 2012-02-02 2013-10-28 현대성우오토모티브코리아 주식회사 이차전지 양전극의 단면적 증가형 러그 연결장치

Also Published As

Publication number Publication date
US5214259A (en) 1993-05-25
KR960002994B1 (ko) 1996-03-02
JPH04346448A (ja) 1992-12-02
JP2835989B2 (ja) 1998-12-14

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