KR920022014A - 현미경 - Google Patents
현미경 Download PDFInfo
- Publication number
- KR920022014A KR920022014A KR1019920007758A KR920007758A KR920022014A KR 920022014 A KR920022014 A KR 920022014A KR 1019920007758 A KR1019920007758 A KR 1019920007758A KR 920007758 A KR920007758 A KR 920007758A KR 920022014 A KR920022014 A KR 920022014A
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- microscope
- infrared light
- emitting element
- infrared
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Microscoopes, Condenser (AREA)
- Led Device Packages (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
- Led Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 실시예에 따른 현미경을 도시한 설명도,
제2도는 제1도의 실시예에 따른 현미경광원을 도시한 설명도,
제3도는 제1도의 실시예에 따른 현미경 광원의 다른 실시예를 도시한 설명도,
제4도는 제1도의 실시예에 따른 현미경 광원의 또다른 실시예를 도시한 설명도.
Claims (6)
- 현미경본체의 화상면에 텔레비카메라의 수광면을 배치하여 촬영대상물에 대한 명시야 내지 암시야조명을 행하여 텔레비카메라의 비디오신호를 모니터텔레비로 눈으로 보거나 화상처리하는 현미경에 있어서, 상기 촬영대상물(5)에 대한 조명은 다수의 발광소자(31)를 광원(3)으로 하여 이용하는 것을 특징으로 하는 현미경.
- 제1항에 있어서, 상기 발광소자(31)는 적외발광소자인 것을 특징으로 하는 현미경.
- 제1항에 있어서, 상기 발광소자(31)는 가시광발광소자인 것을 특징으로 하는 현미경.
- 제2항에 있어서, 상기 적외발광소자는 다수의 적외발광다이오드(31)로 구성되고, 상기 적외발광다이오드의 각각의 금속리이드프레임(31a)에 반도체 칩(5)을 설치하여 수지(31c)로 충진한 것을 특징으로 하는 현미경.
- 제2항에 있어서, 상기 적외발광소자는 단일의 금속리이드프레임(31a)상에 다수의 반도체 칩(31b)이 설치되고, 각 반도체(31b)이 패드부(31b)에 와이어본딩되어 수지(31c)로 충진하여 구성된 것을 특징으로 하는 현미경.
- 제2항에 있어서, 상기 적외발광소자는 제1리이드(44), 상기제1리이드상에 다이본딩된 적외 LED칩(41), 상기 적외 LED칩상에 설치된 금전 극패턴(42), 상기 금전극패턴과 금와이어(43)를 개재하여 접속된 제2리이드(45)로 구성되어 있는 것을 특징으로 하는 현미경.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP91-107926 | 1991-05-14 | ||
JP3107926A JPH04336444A (ja) | 1991-05-14 | 1991-05-14 | 顕微鏡 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920022014A true KR920022014A (ko) | 1992-12-19 |
KR960014967B1 KR960014967B1 (ko) | 1996-10-23 |
Family
ID=14471556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019920007758A KR960014967B1 (ko) | 1991-05-14 | 1992-05-08 | 현미경 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH04336444A (ko) |
KR (1) | KR960014967B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2795262B2 (ja) * | 1996-05-23 | 1998-09-10 | 日本電気株式会社 | フリップチップ接合部検査装置 |
JP2001154098A (ja) | 1999-11-30 | 2001-06-08 | Mitsutoyo Corp | 画像プローブ |
JP2001154103A (ja) * | 1999-11-30 | 2001-06-08 | Mitsutoyo Corp | 光学器械の照明装置 |
DE10246889B4 (de) † | 2002-10-08 | 2004-08-19 | Karl Kaps Gmbh & Co. Kg | Beleuchtungseinrichtung für ein optisches Vergrösserungsgerät sowie optisches Vergrösserungsgerät |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122694B2 (ja) * | 1986-10-16 | 1995-12-25 | オリンパス光学工業株式会社 | 顕微鏡用照明装置 |
JPS63237428A (ja) * | 1987-03-26 | 1988-10-03 | Oki Electric Ind Co Ltd | 半導体素子のパタ−ン認識装置 |
-
1991
- 1991-05-14 JP JP3107926A patent/JPH04336444A/ja active Pending
-
1992
- 1992-05-08 KR KR1019920007758A patent/KR960014967B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH04336444A (ja) | 1992-11-24 |
KR960014967B1 (ko) | 1996-10-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19991008 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |