KR920010261A - 3차원계측방법 - Google Patents

3차원계측방법 Download PDF

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Publication number
KR920010261A
KR920010261A KR1019910020873A KR910020873A KR920010261A KR 920010261 A KR920010261 A KR 920010261A KR 1019910020873 A KR1019910020873 A KR 1019910020873A KR 910020873 A KR910020873 A KR 910020873A KR 920010261 A KR920010261 A KR 920010261A
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KR
South Korea
Prior art keywords
image information
measurement
imaging
measurement method
image pickup
Prior art date
Application number
KR1019910020873A
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English (en)
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KR950010701B1 (ko
Inventor
가즈유키 야마나카
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
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Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR920010261A publication Critical patent/KR920010261A/ko
Application granted granted Critical
Publication of KR950010701B1 publication Critical patent/KR950010701B1/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N7/00—Television systems
    • H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
    • H04N7/181—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast for receiving images from a plurality of remote sources
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/245—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using a plurality of fixed, simultaneously operating transducers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)

Abstract

내용 없음

Description

3차원 계측방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 1실시예에 따른 3차원 계측방법을 실시하기 위한 장치의 구성도.
제2도는 제1도에 도시된 3대의 카메라로부터 2대의 카메라를 선택할 때의 선택기준으로 되는 에피폴라 라인(epipolar line)의 방향성과 와이어의 방향성의 관계를 각 카메라에 의한 화상평면에서 나타낸 평면도.

Claims (2)

  1. 계측대상물체(5-1)를 촬상장치로 촬상하고, 그 화상정보를 사용해서 계측대상물체의 3차원형상을 계측함에 있어서, 3대이상의 촬상장치(5-4,5-5,5-6)를 사용해서 각각 다른 방향으로부터 상기 계측대상물체(5-1)를 촬상하고, 상기 제3대이상의 촬상장치중 적어도 2대의 촬상장치에 의한 화상정보를 계측용 화상정보로서 사용하는 것을 특징으로 하는 3차원 계측방법.
  2. 제1항에 있어서, 3대이상의 촬상장치 각각의 계측대상물체에 대한 방향과 그 계측대상물체의 방향성의 관계에 의해 그 출력화상정보를 계측용 화상정보로서 사용하는 적어도 2대의 촬상장치를 선택하는 것을 특징으로 하는 3차원계측방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910020873A 1990-11-26 1991-11-22 3차원 계측방법 KR950010701B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-321921 1990-11-26
JP2321921A JP2941412B2 (ja) 1990-11-26 1990-11-26 ３次元計測方法

Publications (2)

Publication Number Publication Date
KR920010261A true KR920010261A (ko) 1992-06-26
KR950010701B1 KR950010701B1 (ko) 1995-09-21

Family

ID=18137899

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910020873A KR950010701B1 (ko) 1990-11-26 1991-11-22 3차원 계측방법

Country Status (3)

Country Link
US (1) US5249035A (ko)
JP (1) JP2941412B2 (ko)
KR (1) KR950010701B1 (ko)

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KR100361928B1 (ko) * 1998-11-10 2002-11-23 석미수 천연물을 사용한 원사의 제조방법
KR101226000B1 (ko) * 2010-11-12 2013-01-25 삼성중공업 주식회사 Ｉｇｐｓ를 이용한 3차원 대형 부재 계측 시스템 및 이를 이용한 계측 방법
KR20190104355A (ko) * 2017-01-24 2019-09-09 엔제루 프레잉구 카도 가부시키가이샤 칩 인식 시스템

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
KR100361928B1 (ko) * 1998-11-10 2002-11-23 석미수 천연물을 사용한 원사의 제조방법
KR101226000B1 (ko) * 2010-11-12 2013-01-25 삼성중공업 주식회사 Ｉｇｐｓ를 이용한 3차원 대형 부재 계측 시스템 및 이를 이용한 계측 방법
KR20190104355A (ko) * 2017-01-24 2019-09-09 엔제루 프레잉구 카도 가부시키가이샤 칩 인식 시스템
KR20220116586A (ko) * 2017-01-24 2022-08-23 엔제루 구루푸 가부시키가이샤 칩 인식 시스템
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Also Published As

Publication number Publication date
JP2941412B2 (ja) 1999-08-25
KR950010701B1 (ko) 1995-09-21
US5249035A (en) 1993-09-28
JPH04191607A (ja) 1992-07-09

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