KR920009566A - 화학적으로 에칭가능한 접착제를 이용한 라미네이트 - Google Patents

화학적으로 에칭가능한 접착제를 이용한 라미네이트 Download PDF

Info

Publication number
KR920009566A
KR920009566A KR1019910021076A KR910021076A KR920009566A KR 920009566 A KR920009566 A KR 920009566A KR 1019910021076 A KR1019910021076 A KR 1019910021076A KR 910021076 A KR910021076 A KR 910021076A KR 920009566 A KR920009566 A KR 920009566A
Authority
KR
South Korea
Prior art keywords
laminate
crosslinked
reactive oligomer
weight
immersed
Prior art date
Application number
KR1019910021076A
Other languages
English (en)
Other versions
KR950004150B1 (ko
Inventor
마노스 필립
Original Assignee
미리암 디. 메코너헤이
이. 아이. 듀우판 드 네모아 앤드 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 미리암 디. 메코너헤이, 이. 아이. 듀우판 드 네모아 앤드 캄파니 filed Critical 미리암 디. 메코너헤이
Publication of KR920009566A publication Critical patent/KR920009566A/ko
Application granted granted Critical
Publication of KR950004150B1 publication Critical patent/KR950004150B1/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C229/00Compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C229/52Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C229/54Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C229/56Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in ortho-position
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C229/00Compounds containing amino and carboxyl groups bound to the same carbon skeleton
    • C07C229/52Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
    • C07C229/54Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
    • C07C229/60Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in meta- or para- positions
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003Preparatory processes
    • C08G73/1007Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/16Polyester-imides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204Di-electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00Metals, their alloys or their compounds
    • B32B2311/12Copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08Polyimides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0154Polyimide
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/91Product with molecular orientation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264Up to 3 mils
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31515As intermediate layer
    • Y10T428/31522Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal
    • Y10T428/31681Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음.

Description

화학적으로 에칭가능한 접착제를 이용한 라미네이트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 금속층, 접착제 조성물층 및 에칭가능한 폴리아미드층의 순서로 이루어지며, 상기 접착제 조성물은 200내지 10,000 당량의 가수분해 가능한 페놀계 에스테르기를 기본구조에 갖는 가교 결합된 반응성 올리고머로 이루어지고, 경화시킨 후의 이 조성물의 50μm 두께의 필름이 이 필름을 수산화 칼륨 13중량% 중류스 11중량% 및 에탄올 76중량%를 함유하는 교반 용액에 60℃에서 1분동안 침지시키고 탑이온수의 교반조 중에 60℃에서 30초 침지시키는 공정을, 에탄올계, 수산화 칼륨 용액에 1회 침지시킨후 이어서 탑이온수에 1회 침지시키는 것을 1사이클로 하여, 50사이클 이내에 분해되어야 하는 요건을 만족시키는 라미네이트.
  2. 제1항에 있어서, 금속 필름이 구리인 라미네이트.
  3. 제1항에 있어서, 가교 결합된 반응성 올리고머가 가교 결합된 애폭시인 라미네이트.
  4. 제1항에 있어서, 가교 결합된 반응성 올리고머가 가교 결합된 올리고이미드인 라미네이트.
  5. 제1항에 있어서, 가교 결합된 반응성 올리고머가 하기 일반식을 갖는 라미네이트.
    R1은 -H, -CH3,-C2H5또는 -CF3이고, R2는 -H -CH3,-C2H5또는 -CF3이고, R3은 적어도 1개의 방향족기를 갖는 2가 라디칼이고, 이 방향족기를 통해 2가의 원자가 중 적어도 하나가 제공되며, R4및 R5는 각각 2가 라디칼이고, R3, R4및 R5는 이동의 합이 2,000 미만인 분자량을 가지며, n은 0내지 1이고, m은 0내지 1이고, 단 m+n=1이고, p는 0내지 15이고, t는 0내지 1이고, t는 0.95 내지 0이고, s는 0.05 내지 1이고, 단 t+s=1이고, q는 10보다 크다.
    ※참고사항:최초출원 내용에 의하여 공개되는 것임.
KR1019910021076A 1990-11-26 1991-11-25 화학적으로 에칭가능한 접착제를 이용한 라미네이트 KR950004150B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US618112 1984-06-07
US618,112 1984-06-07
US07/618,112 US5084345A (en) 1990-11-26 1990-11-26 Laminates utilizing chemically etchable adhesives

Publications (2)

Publication Number Publication Date
KR920009566A true KR920009566A (ko) 1992-06-25
KR950004150B1 KR950004150B1 (ko) 1995-04-27

Family

ID=24476367

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910021076A KR950004150B1 (ko) 1990-11-26 1991-11-25 화학적으로 에칭가능한 접착제를 이용한 라미네이트

Country Status (5)

Country Link
US (1) US5084345A (ko)
EP (1) EP0488062A1 (ko)
JP (1) JPH04331143A (ko)
KR (1) KR950004150B1 (ko)
CA (1) CA2055878A1 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5272245A (en) * 1990-11-26 1993-12-21 E. I. Du Pont De Nemours And Company Chemically etchable adhesives
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
KR0126792B1 (ko) * 1994-04-11 1998-04-01 김광호 폴리이미드(Polyimide) 표면 처리방법
CN1269637C (zh) * 2000-09-18 2006-08-16 帕尔技术有限责任公司 一种压电致动器和使用压电致动器的泵
US7198250B2 (en) * 2000-09-18 2007-04-03 Par Technologies, Llc Piezoelectric actuator and pump using same
US20060037674A1 (en) * 2002-11-26 2006-02-23 Kazuto Okamura Laminate for HDD Suspension With the use of Thin Copper Foil and Method for Manufacturing the same
US7312554B2 (en) 2004-04-02 2007-12-25 Adaptivenergy, Llc Piezoelectric devices and methods and circuits for driving same
US20050225201A1 (en) * 2004-04-02 2005-10-13 Par Technologies, Llc Piezoelectric devices and methods and circuits for driving same
US7290993B2 (en) * 2004-04-02 2007-11-06 Adaptivenergy Llc Piezoelectric devices and methods and circuits for driving same
US7287965B2 (en) * 2004-04-02 2007-10-30 Adaptiv Energy Llc Piezoelectric devices and methods and circuits for driving same
US7258533B2 (en) * 2004-12-30 2007-08-21 Adaptivenergy, Llc Method and apparatus for scavenging energy during pump operation
US20060147329A1 (en) * 2004-12-30 2006-07-06 Tanner Edward T Active valve and active valving for pump
US20060232166A1 (en) * 2005-04-13 2006-10-19 Par Technologies Llc Stacked piezoelectric diaphragm members
JP2008537461A (ja) * 2005-04-13 2008-09-11 アダプティブエナジー・リミテッド・ライアビリティー・カンパニー フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ
US7749350B2 (en) * 2005-04-27 2010-07-06 Avery Dennison Retail Information Services Webs and methods of making same
US7842156B2 (en) * 2005-04-27 2010-11-30 Avery Dennison Corporation Webs and methods of making same
US20070075286A1 (en) * 2005-10-04 2007-04-05 Par Technologies, Llc Piezoelectric valves drive
US20070129681A1 (en) * 2005-11-01 2007-06-07 Par Technologies, Llc Piezoelectric actuation of piston within dispensing chamber
WO2007061610A1 (en) * 2005-11-18 2007-05-31 Par Technologies, Llc Human powered piezoelectric power generating device
US7568285B2 (en) * 2006-05-11 2009-08-04 Eastman Kodak Company Method of fabricating a self-aligned print head
US20080246367A1 (en) * 2006-12-29 2008-10-09 Adaptivenergy, Llc Tuned laminated piezoelectric elements and methods of tuning same
KR20140143430A (ko) * 2007-07-26 2014-12-16 헨켈 아게 운트 코. 카게아아 이미드 부분을 함유하는 알콜, 및 이로부터 제조된 반응성 올리고머
EP2116366B1 (en) * 2008-05-06 2015-08-12 HID Global GmbH Functional laminate
CA2736165C (en) * 2008-09-05 2016-11-01 Bell Helicopter Textron Inc. Method and apparatus for reticulating an adhesive to the surface network of a cellular core structure
US11382210B1 (en) 2020-12-17 2022-07-05 International Business Machines Corporation Dielectric material change to optimize electrical and mechanical properties of flex circuit
WO2022239534A1 (ja) * 2021-05-14 2022-11-17 セイカ株式会社 メタ型エステル系芳香族ジアミン、およびその製造方法、並びにそれらのメタ型エステル系芳香族ジアミンを原料とするポリイミド

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4064192A (en) * 1971-02-24 1977-12-20 Rhone-Poulenc S.A. Heat-stable polyimide resins
US3728150A (en) * 1971-07-12 1973-04-17 Du Pont Bondable adhesive coated polyimide film
US3900662A (en) * 1973-01-17 1975-08-19 Du Pont Bondable adhesive coated polyimide film and laminates
JPS57181857A (en) * 1981-05-06 1982-11-09 Ube Industries Polyimide laminated material and its manufacture
US4851495A (en) * 1987-02-20 1989-07-25 The Boeing Company Polyetherimide oligomer
US4528373A (en) * 1982-03-02 1985-07-09 Plastics Engineering Company Vinylacetylene-terminated polyimide derivatives
US4842949A (en) * 1982-06-21 1989-06-27 John Gagliani Methods and compositions for producing polyimide adhesive bonds
US4517321A (en) * 1983-05-20 1985-05-14 Union Carbide Corporation Preimpregnated reinforcements and high strength composites therefrom
US4579885A (en) * 1983-09-22 1986-04-01 Union Carbide Corporation Epoxy compositions containing substituted diamine hardeners
US4626474A (en) * 1985-06-21 1986-12-02 Stauffer Chemical Company Polyimide film/metal foil lamination
US4711964A (en) * 1986-05-08 1987-12-08 University Of Dayton Bisdiene from bis-benzocyclobutene compound
US4801682A (en) * 1986-05-27 1989-01-31 United Technologies Corporation High temperature fluorinated polymer
US4859530A (en) * 1987-07-09 1989-08-22 Ethyl Corporation High temperature adhesive for polymide films
US4937133A (en) * 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US4816493A (en) * 1988-04-28 1989-03-28 Ethyl Corporation Polyimide foams and their preparation
US4814357A (en) * 1988-04-28 1989-03-21 Ethyl Corporation Polyimide foams and their preparation
US4898971A (en) * 1989-01-23 1990-02-06 Mobay Corporation Liquid isocyanate prepolymers

Also Published As

Publication number Publication date
KR950004150B1 (ko) 1995-04-27
EP0488062A1 (en) 1992-06-03
CA2055878A1 (en) 1992-05-27
JPH04331143A (ja) 1992-11-19
US5084345A (en) 1992-01-28

Similar Documents

Publication Publication Date Title
KR920009566A (ko) 화학적으로 에칭가능한 접착제를 이용한 라미네이트
KR920006408A (ko) 퍼플루오로사이클로부탄 환을 함유하는 폴리벤즈아졸중합체
GB913650A (en) Coating metals with amino-alkyl silicon compounds
KR830010402A (ko) 감광성 중합체 조성물
GB872929A (en) Amino alkyl silicon compounds as bonding agents for polymeric coatings to metals
KR860008477A (ko) 경화성 조성물
KR900004805A (ko) 입체 장애된 헤테로 사이클릭 잔기를 함유하는 폴리 실옥산
KR950703017A (ko) 열가소성 폴리이미드중합체 및 열가소성 폴리이미드필름 및 폴리이미드 적층체 및 그 적층체의 제조방법
KR950011582A (ko) 라 벨
AR026110A1 (es) Un aditivo polimerico para un bano para electrodepositar zinc y/o aleaciones de zinc, un bano que lo incorpora y un proceso para electrodepositar zinc yaleaciones de zinc en dicho bano
KR890014783A (ko) 금속표면 처리방법
KR920008112A (ko) 반응성 올리고이미드 접착제, 적층물 및 그 적층물의 제조 방법
KR970033820A (ko) 폴리이미드 금속 박막 복합 필름
KR920006392A (ko) 에폭시 수지, 에폭시 수지 조성물 및 그의 경화제품
KR920009888A (ko) 화학적으로 에칭가능한 접착제
KR880009879A (ko) 연무에 대한 저항성을 갖는 투명한 폴리우레탄층, 이의 제조방법 및 이층으로 피복된 창유리
JPS5643352A (en) Photocurable organopolysiloxane composition
KR920016551A (ko) 폴리아릴렌 에테르/에폭사이드 조성물 및 이로부터 제조된 가요성 적층물
KR830005025A (ko) 가열 살균이 가능한 접착 캔
JPS52132085A (en) Lamination for giving products with excellent resistance to peeling in saline solutions
KR950000818A (ko) 전착도료 조성물
KR890014673A (ko) 열가소성 폴리에스테르 수지 조성물
JPS5767195A (en) Surface treated steel plate with high corrision resistance
KR940019807A (ko) 시아네이트수지조성물 및 구리피복적층판
SU662625A1 (ru) Композици дл получени покрыти методом электроосаждени на металлической поверхности

Legal Events

Date Code Title Description
A201 Request for examination
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
NORF Unpaid initial registration fee