KR920009566A - 화학적으로 에칭가능한 접착제를 이용한 라미네이트 - Google Patents
화학적으로 에칭가능한 접착제를 이용한 라미네이트 Download PDFInfo
- Publication number
- KR920009566A KR920009566A KR1019910021076A KR910021076A KR920009566A KR 920009566 A KR920009566 A KR 920009566A KR 1019910021076 A KR1019910021076 A KR 1019910021076A KR 910021076 A KR910021076 A KR 910021076A KR 920009566 A KR920009566 A KR 920009566A
- Authority
- KR
- South Korea
- Prior art keywords
- laminate
- crosslinked
- reactive oligomer
- weight
- immersed
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims 3
- 230000001070 adhesive effect Effects 0.000 title claims 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 4
- 125000003118 aryl group Chemical group 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- ROHFNLRQFUQHCH-YFKPBYRVSA-N L-leucine Chemical compound CC(C)C[C@H](N)C(O)=O ROHFNLRQFUQHCH-YFKPBYRVSA-N 0.000 claims 1
- ROHFNLRQFUQHCH-UHFFFAOYSA-N Leucine Natural products CC(C)CC(N)C(O)=O ROHFNLRQFUQHCH-UHFFFAOYSA-N 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 125000004185 ester group Chemical group 0.000 claims 1
- 238000007654 immersion Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C229/00—Compounds containing amino and carboxyl groups bound to the same carbon skeleton
- C07C229/52—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
- C07C229/54—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
- C07C229/56—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in ortho-position
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C229/00—Compounds containing amino and carboxyl groups bound to the same carbon skeleton
- C07C229/52—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton
- C07C229/54—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring
- C07C229/60—Compounds containing amino and carboxyl groups bound to the same carbon skeleton having amino and carboxyl groups bound to carbon atoms of six-membered aromatic rings of the same carbon skeleton with amino and carboxyl groups bound to carbon atoms of the same non-condensed six-membered aromatic ring with amino and carboxyl groups bound in meta- or para- positions
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/91—Product with molecular orientation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
- Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
- Y10T428/264—Up to 3 mils
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (5)
- 금속층, 접착제 조성물층 및 에칭가능한 폴리아미드층의 순서로 이루어지며, 상기 접착제 조성물은 200내지 10,000 당량의 가수분해 가능한 페놀계 에스테르기를 기본구조에 갖는 가교 결합된 반응성 올리고머로 이루어지고, 경화시킨 후의 이 조성물의 50μm 두께의 필름이 이 필름을 수산화 칼륨 13중량% 중류스 11중량% 및 에탄올 76중량%를 함유하는 교반 용액에 60℃에서 1분동안 침지시키고 탑이온수의 교반조 중에 60℃에서 30초 침지시키는 공정을, 에탄올계, 수산화 칼륨 용액에 1회 침지시킨후 이어서 탑이온수에 1회 침지시키는 것을 1사이클로 하여, 50사이클 이내에 분해되어야 하는 요건을 만족시키는 라미네이트.
- 제1항에 있어서, 금속 필름이 구리인 라미네이트.
- 제1항에 있어서, 가교 결합된 반응성 올리고머가 가교 결합된 애폭시인 라미네이트.
- 제1항에 있어서, 가교 결합된 반응성 올리고머가 가교 결합된 올리고이미드인 라미네이트.
- 제1항에 있어서, 가교 결합된 반응성 올리고머가 하기 일반식을 갖는 라미네이트.R1은 -H, -CH3,-C2H5또는 -CF3이고, R2는 -H -CH3,-C2H5또는 -CF3이고, R3은 적어도 1개의 방향족기를 갖는 2가 라디칼이고, 이 방향족기를 통해 2가의 원자가 중 적어도 하나가 제공되며, R4및 R5는 각각 2가 라디칼이고, R3, R4및 R5는 이동의 합이 2,000 미만인 분자량을 가지며, n은 0내지 1이고, m은 0내지 1이고, 단 m+n=1이고, p는 0내지 15이고, t는 0내지 1이고, t는 0.95 내지 0이고, s는 0.05 내지 1이고, 단 t+s=1이고, q는 10보다 크다.※참고사항:최초출원 내용에 의하여 공개되는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US618112 | 1984-06-07 | ||
US618,112 | 1984-06-07 | ||
US07/618,112 US5084345A (en) | 1990-11-26 | 1990-11-26 | Laminates utilizing chemically etchable adhesives |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920009566A true KR920009566A (ko) | 1992-06-25 |
KR950004150B1 KR950004150B1 (ko) | 1995-04-27 |
Family
ID=24476367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910021076A KR950004150B1 (ko) | 1990-11-26 | 1991-11-25 | 화학적으로 에칭가능한 접착제를 이용한 라미네이트 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5084345A (ko) |
EP (1) | EP0488062A1 (ko) |
JP (1) | JPH04331143A (ko) |
KR (1) | KR950004150B1 (ko) |
CA (1) | CA2055878A1 (ko) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5272245A (en) * | 1990-11-26 | 1993-12-21 | E. I. Du Pont De Nemours And Company | Chemically etchable adhesives |
US5584956A (en) * | 1992-12-09 | 1996-12-17 | University Of Iowa Research Foundation | Method for producing conductive or insulating feedthroughs in a substrate |
KR0126792B1 (ko) * | 1994-04-11 | 1998-04-01 | 김광호 | 폴리이미드(Polyimide) 표면 처리방법 |
CN1269637C (zh) * | 2000-09-18 | 2006-08-16 | 帕尔技术有限责任公司 | 一种压电致动器和使用压电致动器的泵 |
US7198250B2 (en) * | 2000-09-18 | 2007-04-03 | Par Technologies, Llc | Piezoelectric actuator and pump using same |
US20060037674A1 (en) * | 2002-11-26 | 2006-02-23 | Kazuto Okamura | Laminate for HDD Suspension With the use of Thin Copper Foil and Method for Manufacturing the same |
US7312554B2 (en) | 2004-04-02 | 2007-12-25 | Adaptivenergy, Llc | Piezoelectric devices and methods and circuits for driving same |
US20050225201A1 (en) * | 2004-04-02 | 2005-10-13 | Par Technologies, Llc | Piezoelectric devices and methods and circuits for driving same |
US7290993B2 (en) * | 2004-04-02 | 2007-11-06 | Adaptivenergy Llc | Piezoelectric devices and methods and circuits for driving same |
US7287965B2 (en) * | 2004-04-02 | 2007-10-30 | Adaptiv Energy Llc | Piezoelectric devices and methods and circuits for driving same |
US7258533B2 (en) * | 2004-12-30 | 2007-08-21 | Adaptivenergy, Llc | Method and apparatus for scavenging energy during pump operation |
US20060147329A1 (en) * | 2004-12-30 | 2006-07-06 | Tanner Edward T | Active valve and active valving for pump |
US20060232166A1 (en) * | 2005-04-13 | 2006-10-19 | Par Technologies Llc | Stacked piezoelectric diaphragm members |
JP2008537461A (ja) * | 2005-04-13 | 2008-09-11 | アダプティブエナジー・リミテッド・ライアビリティー・カンパニー | フレキシブル膜上に導体を備える圧電ダイヤフラムアセンブリ |
US7749350B2 (en) * | 2005-04-27 | 2010-07-06 | Avery Dennison Retail Information Services | Webs and methods of making same |
US7842156B2 (en) * | 2005-04-27 | 2010-11-30 | Avery Dennison Corporation | Webs and methods of making same |
US20070075286A1 (en) * | 2005-10-04 | 2007-04-05 | Par Technologies, Llc | Piezoelectric valves drive |
US20070129681A1 (en) * | 2005-11-01 | 2007-06-07 | Par Technologies, Llc | Piezoelectric actuation of piston within dispensing chamber |
WO2007061610A1 (en) * | 2005-11-18 | 2007-05-31 | Par Technologies, Llc | Human powered piezoelectric power generating device |
US7568285B2 (en) * | 2006-05-11 | 2009-08-04 | Eastman Kodak Company | Method of fabricating a self-aligned print head |
US20080246367A1 (en) * | 2006-12-29 | 2008-10-09 | Adaptivenergy, Llc | Tuned laminated piezoelectric elements and methods of tuning same |
KR20140143430A (ko) * | 2007-07-26 | 2014-12-16 | 헨켈 아게 운트 코. 카게아아 | 이미드 부분을 함유하는 알콜, 및 이로부터 제조된 반응성 올리고머 |
EP2116366B1 (en) * | 2008-05-06 | 2015-08-12 | HID Global GmbH | Functional laminate |
CA2736165C (en) * | 2008-09-05 | 2016-11-01 | Bell Helicopter Textron Inc. | Method and apparatus for reticulating an adhesive to the surface network of a cellular core structure |
US11382210B1 (en) | 2020-12-17 | 2022-07-05 | International Business Machines Corporation | Dielectric material change to optimize electrical and mechanical properties of flex circuit |
WO2022239534A1 (ja) * | 2021-05-14 | 2022-11-17 | セイカ株式会社 | メタ型エステル系芳香族ジアミン、およびその製造方法、並びにそれらのメタ型エステル系芳香族ジアミンを原料とするポリイミド |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4064192A (en) * | 1971-02-24 | 1977-12-20 | Rhone-Poulenc S.A. | Heat-stable polyimide resins |
US3728150A (en) * | 1971-07-12 | 1973-04-17 | Du Pont | Bondable adhesive coated polyimide film |
US3900662A (en) * | 1973-01-17 | 1975-08-19 | Du Pont | Bondable adhesive coated polyimide film and laminates |
JPS57181857A (en) * | 1981-05-06 | 1982-11-09 | Ube Industries | Polyimide laminated material and its manufacture |
US4851495A (en) * | 1987-02-20 | 1989-07-25 | The Boeing Company | Polyetherimide oligomer |
US4528373A (en) * | 1982-03-02 | 1985-07-09 | Plastics Engineering Company | Vinylacetylene-terminated polyimide derivatives |
US4842949A (en) * | 1982-06-21 | 1989-06-27 | John Gagliani | Methods and compositions for producing polyimide adhesive bonds |
US4517321A (en) * | 1983-05-20 | 1985-05-14 | Union Carbide Corporation | Preimpregnated reinforcements and high strength composites therefrom |
US4579885A (en) * | 1983-09-22 | 1986-04-01 | Union Carbide Corporation | Epoxy compositions containing substituted diamine hardeners |
US4626474A (en) * | 1985-06-21 | 1986-12-02 | Stauffer Chemical Company | Polyimide film/metal foil lamination |
US4711964A (en) * | 1986-05-08 | 1987-12-08 | University Of Dayton | Bisdiene from bis-benzocyclobutene compound |
US4801682A (en) * | 1986-05-27 | 1989-01-31 | United Technologies Corporation | High temperature fluorinated polymer |
US4859530A (en) * | 1987-07-09 | 1989-08-22 | Ethyl Corporation | High temperature adhesive for polymide films |
US4937133A (en) * | 1988-03-28 | 1990-06-26 | Nippon Steel Chemical Co., Ltd. | Flexible base materials for printed circuits |
US4816493A (en) * | 1988-04-28 | 1989-03-28 | Ethyl Corporation | Polyimide foams and their preparation |
US4814357A (en) * | 1988-04-28 | 1989-03-21 | Ethyl Corporation | Polyimide foams and their preparation |
US4898971A (en) * | 1989-01-23 | 1990-02-06 | Mobay Corporation | Liquid isocyanate prepolymers |
-
1990
- 1990-11-26 US US07/618,112 patent/US5084345A/en not_active Expired - Fee Related
-
1991
- 1991-11-20 CA CA002055878A patent/CA2055878A1/en not_active Abandoned
- 1991-11-22 EP EP91119898A patent/EP0488062A1/en not_active Withdrawn
- 1991-11-25 JP JP3308901A patent/JPH04331143A/ja active Pending
- 1991-11-25 KR KR1019910021076A patent/KR950004150B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR950004150B1 (ko) | 1995-04-27 |
EP0488062A1 (en) | 1992-06-03 |
CA2055878A1 (en) | 1992-05-27 |
JPH04331143A (ja) | 1992-11-19 |
US5084345A (en) | 1992-01-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR920009566A (ko) | 화학적으로 에칭가능한 접착제를 이용한 라미네이트 | |
KR920006408A (ko) | 퍼플루오로사이클로부탄 환을 함유하는 폴리벤즈아졸중합체 | |
GB913650A (en) | Coating metals with amino-alkyl silicon compounds | |
KR830010402A (ko) | 감광성 중합체 조성물 | |
GB872929A (en) | Amino alkyl silicon compounds as bonding agents for polymeric coatings to metals | |
KR860008477A (ko) | 경화성 조성물 | |
KR900004805A (ko) | 입체 장애된 헤테로 사이클릭 잔기를 함유하는 폴리 실옥산 | |
KR950703017A (ko) | 열가소성 폴리이미드중합체 및 열가소성 폴리이미드필름 및 폴리이미드 적층체 및 그 적층체의 제조방법 | |
KR950011582A (ko) | 라 벨 | |
AR026110A1 (es) | Un aditivo polimerico para un bano para electrodepositar zinc y/o aleaciones de zinc, un bano que lo incorpora y un proceso para electrodepositar zinc yaleaciones de zinc en dicho bano | |
KR890014783A (ko) | 금속표면 처리방법 | |
KR920008112A (ko) | 반응성 올리고이미드 접착제, 적층물 및 그 적층물의 제조 방법 | |
KR970033820A (ko) | 폴리이미드 금속 박막 복합 필름 | |
KR920006392A (ko) | 에폭시 수지, 에폭시 수지 조성물 및 그의 경화제품 | |
KR920009888A (ko) | 화학적으로 에칭가능한 접착제 | |
KR880009879A (ko) | 연무에 대한 저항성을 갖는 투명한 폴리우레탄층, 이의 제조방법 및 이층으로 피복된 창유리 | |
JPS5643352A (en) | Photocurable organopolysiloxane composition | |
KR920016551A (ko) | 폴리아릴렌 에테르/에폭사이드 조성물 및 이로부터 제조된 가요성 적층물 | |
KR830005025A (ko) | 가열 살균이 가능한 접착 캔 | |
JPS52132085A (en) | Lamination for giving products with excellent resistance to peeling in saline solutions | |
KR950000818A (ko) | 전착도료 조성물 | |
KR890014673A (ko) | 열가소성 폴리에스테르 수지 조성물 | |
JPS5767195A (en) | Surface treated steel plate with high corrision resistance | |
KR940019807A (ko) | 시아네이트수지조성물 및 구리피복적층판 | |
SU662625A1 (ru) | Композици дл получени покрыти методом электроосаждени на металлической поверхности |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
NORF | Unpaid initial registration fee |