KR920007139A - 와이어 본딩 검사 장치 - Google Patents

와이어 본딩 검사 장치 Download PDF

Info

Publication number
KR920007139A
KR920007139A KR1019910015977A KR910015977A KR920007139A KR 920007139 A KR920007139 A KR 920007139A KR 1019910015977 A KR1019910015977 A KR 1019910015977A KR 910015977 A KR910015977 A KR 910015977A KR 920007139 A KR920007139 A KR 920007139A
Authority
KR
South Korea
Prior art keywords
wire bonding
semiconductor device
bonding inspection
wire
mark
Prior art date
Application number
KR1019910015977A
Other languages
English (en)
Other versions
KR950011564B1 (ko
Inventor
미쯔사다 시바사까
유이찌 미야하라
Original Assignee
아오이 죠이찌
가부시끼가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이찌, 가부시끼가이샤 도시바 filed Critical 아오이 죠이찌
Publication of KR920007139A publication Critical patent/KR920007139A/ko
Application granted granted Critical
Publication of KR950011564B1 publication Critical patent/KR950011564B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

내용 없음.

Description

와이어 본딩 검사장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 와이어 본딩 검사 장치의 한 실시예를 도시한 개략도.
제2도는 상기 실시예의 와이어 파괴 장치를 확대 도시한 정면도.
제3도는 상기 실시예의 불량 마크 부착 장치를 확대 도시한 정면도.
제4도는 불량 마크가 부착된 리드 프레임을 도시한 평면도.
제5도는 와이어 파괴 장치의 다른 구성예를 도시한 사시도.
* 도면의 주요부분에 대한 부호의 설명
2 : 리드 프레임(외우기) 3 : 반도체 장치
5 : 촬상 장치 6 : 화상 처리 장치
7 : 제어기 5, 6, 7 : 판별 수단
8 : 와이어 파괴 장치 13 : 불량 마크

Claims (4)

  1. 반도체 장치(3)과 리드프레임(2)를 와이어 본딩하는 와이어 본딩 공정 및 상기 반도체 장치를 밀봉하는 밀봉 공정 사이의 공정에서 사용되고, 상기 와이어 본딩을 검사하는 와이어 본딩 검사 장치에 있어서, 상기 와이어 본딩의 불량여부를 판별하는 판별수단(5,6 및 7), 판별 수단이 불량으로 판별한 반도체 장치의 와이어를 파괴하는 파괴수단(8), 및 상기 판별수단이 불량으로 판별한 반도체 장치에 불량 마크(17)를 부착하는 불량마크 부착수단(13)을 구비하고, 상기 불량마크 부착수단이 상기 밀봉 공정에서 밀봉재료로 피복되는 영역이외에 상기 불량마크를 부착하는 것을 특징으로 하는 와이어 본딩 검사 장치.
  2. 제1항에 있어서, 상기 불량마크 부착 수단이 상기 파괴수단에 의한 파괴후에 상깅 불량 마크를 부착하는 것을 특징으로 하는 와이어 본딩 검사 장치.
  3. 제1항에 있어서, 상기 파괴수단이 상기 반도체 장치에 본딩된 모든 와이어를 분쇄하는 프레스판(11)을 구비하는 것을 특징으로 하는 와이어 본딩 검사 장치.
  4. 제1항에 있어서, 상기 파괴수단이 모터(18), 이 모터로 회전되는 원판(19), 및 이 원판의 외주부에 식설된 금속선(20)을 가지고, 상기 금속선이 상기 원판의 회전에 의해 상기 반도체 장치에 본딩된 와이어를 절단하는 것을 특징으로 하는 와이어 본딩 검사 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.
KR1019910015977A 1990-09-14 1991-09-13 와이어 본딩 검사장치 KR950011564B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP90-245397 1990-09-14
JP24539790A JPH0715926B2 (ja) 1990-09-14 1990-09-14 ワイヤボンディング検査装置

Publications (2)

Publication Number Publication Date
KR920007139A true KR920007139A (ko) 1992-04-28
KR950011564B1 KR950011564B1 (ko) 1995-10-06

Family

ID=17133048

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910015977A KR950011564B1 (ko) 1990-09-14 1991-09-13 와이어 본딩 검사장치

Country Status (4)

Country Link
US (1) US5156319A (ko)
EP (1) EP0475432A3 (ko)
JP (1) JPH0715926B2 (ko)
KR (1) KR950011564B1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960000793B1 (ko) * 1993-04-07 1996-01-12 삼성전자주식회사 노운 굳 다이 어레이 및 그 제조방법
US5532739A (en) * 1993-10-06 1996-07-02 Cognex Corporation Automated optical inspection apparatus
US5640199A (en) * 1993-10-06 1997-06-17 Cognex Corporation Automated optical inspection apparatus
US5548326A (en) * 1993-10-06 1996-08-20 Cognex Corporation Efficient image registration
US5642158A (en) * 1994-05-02 1997-06-24 Cognex Corporation Method and apparatus to detect capillary indentations
US5581632A (en) * 1994-05-02 1996-12-03 Cognex Corporation Method and apparatus for ball bond inspection system
US5550763A (en) * 1994-05-02 1996-08-27 Michael; David J. Using cone shaped search models to locate ball bonds on wire bonded devices
US6061467A (en) * 1994-05-02 2000-05-09 Cognex Corporation Automated optical inspection apparatus using nearest neighbor interpolation
US5598096A (en) * 1994-12-02 1997-01-28 Ford Motor Company Method and apparatus for testing an integrated circuit using controlled wirebonding and wirebonding removal
US5566877A (en) * 1995-05-01 1996-10-22 Motorola Inc. Method for inspecting a semiconductor device
US6035066A (en) * 1995-06-02 2000-03-07 Cognex Corporation Boundary tracking method and apparatus to find leads
US5676302A (en) * 1995-06-02 1997-10-14 Cognex Corporation Method and apparatus for crescent boundary thresholding on wire-bonded leads
JP2001338933A (ja) * 2000-05-29 2001-12-07 Citizen Watch Co Ltd 半導体パッケージの製造方法
TW522532B (en) * 2000-11-07 2003-03-01 Siliconware Precision Industries Co Ltd Schemes for detecting bonding status of bonding wire of semiconductor package
JP7042179B2 (ja) * 2018-07-19 2022-03-25 セイコータイムクリエーション株式会社 リードフレームの検査装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1584343A (en) * 1977-06-07 1981-02-11 Tokyo Shibaura Electric Co Apparatus for marking identification symbols on wafer
US4255851A (en) * 1978-12-06 1981-03-17 Western Electric Company, Inc. Method and apparatus for indelibly marking articles during a manufacturing process
JPH02106049A (ja) * 1988-10-14 1990-04-18 Matsushita Electron Corp ワイヤボンデング装置
US5029747A (en) * 1989-12-20 1991-07-09 Microelectronics And Computer Technology Corporation Apparatus for replacing defective electronic components
US5007576A (en) * 1989-12-26 1991-04-16 Hughes Aircraft Company Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication

Also Published As

Publication number Publication date
US5156319A (en) 1992-10-20
JPH04124848A (ja) 1992-04-24
JPH0715926B2 (ja) 1995-02-22
KR950011564B1 (ko) 1995-10-06
EP0475432A3 (en) 1992-04-15
EP0475432A2 (en) 1992-03-18

Similar Documents

Publication Publication Date Title
KR920007139A (ko) 와이어 본딩 검사 장치
US20020125043A1 (en) Semiconductor packaging structure, packaging board and inspection method of packaging conditions
IT1190152B (it) Provino per la valutazione dei risultati di esami non distruttivi di materiali,nonche' elementi di difetto e procedimento per preparare provini
DE69024412D1 (de) Ultraschallinspektionsgerät zum Nachweisen von Fehlern in Festkörpern
KR960012393A (ko) 본딩 와이어 검사방법
JPS60124834A (ja) 半導体装置の検査方法
JPH0814544B2 (ja) フロッピーディスクの検査方法
KR910001907A (ko) 기판위에 규칙적으로 배열된 동일 패턴들을 제조하기 위한 스텝-앤-리피트 공정에 사용된 패턴 데이타 검증용 장치
KR960008274A (ko) 표면 검사 시스템
ATE13097T1 (de) Feststellen der identitaet und der unversehrtheit eines geschlossenen behaelters.
JP2839411B2 (ja) 不良ｉｃの検査装置
KR910010660A (ko) 내부리드본딩 검사방법
US901393A (en) Device for testing cans.
JPH02285665A (ja) リードフレーム
KR960025942A (ko) 화상표시장치의 블랙매트릭스층 검사방법 및 그 장치
JP2523878B2 (ja) 半導体デバイスの評価装置
JP2003004658A (ja) 半導体装置の製造方法
JPS63179534A (ja) 樹脂封止半導体集積回路装置のスクリ−ニング方法
JPH0325737B2 (ko)
JPS61258442A (ja) Ｉｃの組立不良品識別方法
KR970072243A (ko) 반도체 검사 장치
JPH03190259A (ja) 半導体装置
JPH0129255B2 (ko)
KR970053699A (ko) 패드마운터를 구비한 히터블럭
KR970071055A (ko) 셀의 이물 검사 방법 및 장치

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030930

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee