KR920005462B1 - Flexible printed wiring board with multilayered pattern and manufacturing process - Google Patents

Flexible printed wiring board with multilayered pattern and manufacturing process

Info

Publication number
KR920005462B1
KR920005462B1 KR8712061A KR870012061A KR920005462B1 KR 920005462 B1 KR920005462 B1 KR 920005462B1 KR 8712061 A KR8712061 A KR 8712061A KR 870012061 A KR870012061 A KR 870012061A KR 920005462 B1 KR920005462 B1 KR 920005462B1
Authority
KR
South Korea
Prior art keywords
manufacturing process
wiring board
printed wiring
flexible printed
multilayered pattern
Prior art date
Application number
KR8712061A
Other languages
English (en)
Korean (ko)
Other versions
KR890003269A (ko
Inventor
Minoru Dakuma
Original Assignee
Midori Mark Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Midori Mark Seisakusho Kk filed Critical Midori Mark Seisakusho Kk
Publication of KR890003269A publication Critical patent/KR890003269A/ko
Application granted granted Critical
Publication of KR920005462B1 publication Critical patent/KR920005462B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR8712061A 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process KR920005462B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP62-175765 1987-07-14
JP62175765A JPS6419795A (en) 1987-07-14 1987-07-14 Flexible printed wiring board with multilayered pattern and manufacture thereof

Publications (2)

Publication Number Publication Date
KR890003269A KR890003269A (ko) 1989-04-13
KR920005462B1 true KR920005462B1 (en) 1992-07-04

Family

ID=16001867

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8712061A KR920005462B1 (en) 1987-07-14 1987-10-30 Flexible printed wiring board with multilayered pattern and manufacturing process

Country Status (2)

Country Link
JP (1) JPS6419795A (ja)
KR (1) KR920005462B1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03196691A (ja) * 1989-12-26 1991-08-28 Cmk Corp プリント配線板の絶縁層の形成方法
KR100494679B1 (ko) * 1998-12-18 2005-09-26 비오이 하이디스 테크놀로지 주식회사 플렉서블 프린티드 서킷
KR100395814B1 (ko) * 2000-11-14 2003-08-27 삼성에스디아이 주식회사 단선 방지형 유연성 프린트 회로

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5517518B2 (ja) * 1972-01-28 1980-05-12
JPS50135559A (ja) * 1974-04-17 1975-10-27
JPS6149491A (ja) * 1984-08-18 1986-03-11 松下電器産業株式会社 セラミツク多層配線基板
JPS6284975U (ja) * 1985-11-18 1987-05-30

Also Published As

Publication number Publication date
JPH0252432B2 (ja) 1990-11-13
JPS6419795A (en) 1989-01-23
KR890003269A (ko) 1989-04-13

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19980610

Year of fee payment: 7

LAPS Lapse due to unpaid annual fee