KR920005462B1 - Flexible printed wiring board with multilayered pattern and manufacturing process - Google Patents
Flexible printed wiring board with multilayered pattern and manufacturing processInfo
- Publication number
- KR920005462B1 KR920005462B1 KR8712061A KR870012061A KR920005462B1 KR 920005462 B1 KR920005462 B1 KR 920005462B1 KR 8712061 A KR8712061 A KR 8712061A KR 870012061 A KR870012061 A KR 870012061A KR 920005462 B1 KR920005462 B1 KR 920005462B1
- Authority
- KR
- South Korea
- Prior art keywords
- manufacturing process
- wiring board
- printed wiring
- flexible printed
- multilayered pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62-175765 | 1987-07-14 | ||
JP62175765A JPS6419795A (en) | 1987-07-14 | 1987-07-14 | Flexible printed wiring board with multilayered pattern and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890003269A KR890003269A (ko) | 1989-04-13 |
KR920005462B1 true KR920005462B1 (en) | 1992-07-04 |
Family
ID=16001867
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR8712061A KR920005462B1 (en) | 1987-07-14 | 1987-10-30 | Flexible printed wiring board with multilayered pattern and manufacturing process |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6419795A (ja) |
KR (1) | KR920005462B1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03196691A (ja) * | 1989-12-26 | 1991-08-28 | Cmk Corp | プリント配線板の絶縁層の形成方法 |
KR100494679B1 (ko) * | 1998-12-18 | 2005-09-26 | 비오이 하이디스 테크놀로지 주식회사 | 플렉서블 프린티드 서킷 |
KR100395814B1 (ko) * | 2000-11-14 | 2003-08-27 | 삼성에스디아이 주식회사 | 단선 방지형 유연성 프린트 회로 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517518B2 (ja) * | 1972-01-28 | 1980-05-12 | ||
JPS50135559A (ja) * | 1974-04-17 | 1975-10-27 | ||
JPS6149491A (ja) * | 1984-08-18 | 1986-03-11 | 松下電器産業株式会社 | セラミツク多層配線基板 |
JPS6284975U (ja) * | 1985-11-18 | 1987-05-30 |
-
1987
- 1987-07-14 JP JP62175765A patent/JPS6419795A/ja active Granted
- 1987-10-30 KR KR8712061A patent/KR920005462B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH0252432B2 (ja) | 1990-11-13 |
JPS6419795A (en) | 1989-01-23 |
KR890003269A (ko) | 1989-04-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 19980610 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |