KR920001692A - 제로 전력 ic 모듈 - Google Patents
제로 전력 ic 모듈 Download PDFInfo
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- KR920001692A KR920001692A KR1019910009440A KR910009440A KR920001692A KR 920001692 A KR920001692 A KR 920001692A KR 1019910009440 A KR1019910009440 A KR 1019910009440A KR 910009440 A KR910009440 A KR 910009440A KR 920001692 A KR920001692 A KR 920001692A
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예의 따라 백업 배터리의 음극 단자상에 집적회로 칩이 장착되어 있는 리이드 프레임 조립체의 평면도.
제2도는 단일 모울딩 패키지 내의 반도체 집적회로와 라이드 프레임의 부분 파단 측면도.
제3도는 제2도의 집적회로, 백업 배터리 및 핑거 리이드 조립체의 부분 파단평면도.
Claims (11)
- 전자회로 소자에 전력을 공급하는 소자 패키지에 있어서; 비-전도성 재료의 본체와; 상기 비-전도성 재료의 본체내에 캡슐화되고, 핑거 리이드들중 하나는 전력 리이드를형성하는 다수의 전도성 핑거 리이드들을 포함하는 핑거 리이드 조립체와; 양극 전력 단자와 음극 전력 단자를 가지며, 상기 단자들중의 하나는 상기 전력 리이드상에 설치되는 배터리와; 상기 비-전도성 재료의 본체내에 캡슐화되고 상기 다른 배터리 전력 단자상에서 장착되는 전자회로 소자들로 구성되며; 상기 전력 리이드는 상기 전력 리이드 조립체에 대하여 어긋난 관계로 오프셋 되어 있으며, 상기 배터리는 상기 오프셋 전력 라이드상에 장착됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 전도성 리이드는 기다란 간격으로 분리되는 제1, 제2연결 바아 부분들로 구성되고 상기 배터리는 상기 연결 바아 부분들중 적어도 하나에 장착됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 전도성 핑거 리이드들은 상호 접속 영역 주변에 이격되어 있고, 상기 전력 리이드는 상기 상호 접속 영역을 가로지르는 오프셋 베이스판 지지부를 포함하며, 상기 배터리 단자들중의 하나는 상기 베이스판 지지부상에 설치되어 전기적으로 연결됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 전자회로 소자는 반도체 칩상에서 수행되는 집적회로이고; 상기 칩은 상기 다른 배터리 단자에 스태크된 관계로 기계적으로 잗착되어 전기적으로 연결되며; 상기 집적회는 다수의 입력/출력 노드들과 상기 입력/출력 노드들을 상기 전도성 핑거 리이드들에 연결하는 다수의 와이어 도체들과, 상기 칩이 장착된 배터리 단자와 상기 오프셋베이스 지지부 각각에 상기 와이어 도체들에 의해 전기적으로 연결되는 양극 및 음극 전력 노드들을 갖는 것을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 배터리에는 양극 및 음극 접촉 단자들이 있고, 상기 음극 접촉 단자는 상기 오프셋 전력 리이드에 장착되어 전기적으로 연결됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 배터리에는 양극 및 음극 접촉 단자들이 있고, 상기 양극 접촉 단자는 상기 오프셋 전력 리이드에 장착되어 전기적으로 연결됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 소자 패키지는 상기 칩과 상기 다른 배터리 전력 단자 사이에 삽입된 비-전도성 결합기판을 포함함을 특징으로 하는 소자 패키지.
- 제7항에 있어서, 상기 결합 기판에는 연결 구멍이 뚫려있고; 상기 전자회로 소자는 반도체 칩상에서 수행되는 집적회로이며; 상기 칩은 스테크된 관계로 상기 결합 기판상에 장착되고; 상기 집적회로 소자는 다수의 입력/출력 노드들과 상기 입력/출력 노드들을 상기 전도성 핑거 리이드들에 연결하는 다수의 와이어 도체들과, 상기 결합 기판이 장착되는 배터리 단자와 상기 오프셋 전력 리이드에 각각 상기 와이어 도체들에 의해 전기적으로 연결되는 양극 및 음극 전력 노드들을 갖으며; 상기 와이어 도체들중 하나는 상기 집적회로 소자로부터 상기 연결 구멍을 통해 상기 결합기판이 장착된 배터리 단자까지 연장됨을 특징으로 하는 소자 패키지.
- 제1항에 있어서, 상기 배터리는 기밀 봉지됨을 특징으로 하는 소자 패키지.
- 비-전도성 재료의 본체내에 캡슐화된 다수의 입력/출력 노드들과 상기 비-전도성 재료의 본체위에 장착되어 본체 외부로 돌출하는 다수의 커넥터 리이드들과, 상기 비-전도성 재료의 본체내에 캡슐화되어 상기 입력/출력 노드들을 상기 커넥터 리이드들에 전기적으로 연결하는 다수의 전도성 핑거 리이드로 이루어지는 핑거 리이드 조립체를 포함하는 회로 소자를 갖는 형태의 전자회로 패키지에 있어서; 다수의 상기 전도성 핑거 리이드들에는 상기 상호 접속 영역에 대하여 이격되어 있는 내단부들이 있고; 상기 전도성 핑거 리이드들중의 하나는 전력 리이드를 이루고 상기 상호 접속영역을 가로지르는 베이스 지지부를 가지며, 상기 베이스 지지부는 상기 핑거리이드 조립체 평면에 어긋난 관계로 오프셋되어 있고; 배터리에는 양극 및 음극 단자들이 있으며, 상기 전력 단자들중의 하나는 상기 전력 리이드의 베이스 지지부에 장착되어 전기적으로 연결되며, 상기 회로 소자는 다른 배터리 전력 단자에 장착됨을 특징으로 하는 전자회로 패키지.
- 전자회로 소자에 전력을 공급하는 배터리와 전자 회로 소자를 패키지하는 방법에 있어서: 동일 평면상의 핑거 리이드 조립체의 핑거 리이드들을 상호 접속 영역에 대하여 이격되게 배열하는 단계와; 상기 핑거 리이드 조립체 평면에 어긋난 오프셋된 관계로 상기 상호 접속 영역내에 전력 핑거 리이드를 지지하는 단계와; 상기 오프셋 전력 핑거 리이드에 배터리의 전력 단자를 장착하는 단계와; 상기 배터리의 다른 전력 단자에 상기 전자회로를 설치하는 단계와; 상기 전자회로 소자, 배터리 전력 리이드 및 핑거 리이드 조립체의 상기 스테크된 조립체를 비-전도성 재료의 본체내에 캡슐화하는 단계들로 구성됨을 특징으로 하는 패키지 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7/534.151 | 1990-06-06 | ||
US07/534,151 US5089877A (en) | 1990-06-06 | 1990-06-06 | Zero power ic module |
US07/534.151 | 1990-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR920001692A true KR920001692A (ko) | 1992-01-30 |
KR100206533B1 KR100206533B1 (ko) | 1999-07-01 |
Family
ID=24128888
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910009440A KR100206533B1 (ko) | 1990-06-06 | 1991-06-05 | 제로 전력 아이씨 모듈 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5089877A (ko) |
EP (1) | EP0460801A3 (ko) |
JP (1) | JPH0738028A (ko) |
KR (1) | KR100206533B1 (ko) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US5008776A (en) * | 1990-06-06 | 1991-04-16 | Sgs-Thomson Microelectronics, Inc. | Zero power IC module |
US5323150A (en) * | 1992-06-11 | 1994-06-21 | Micron Technology, Inc. | Method for reducing conductive and convective heat loss from the battery in an RFID tag or other battery-powered devices |
US20050062492A1 (en) * | 2001-08-03 | 2005-03-24 | Beaman Brian Samuel | High density integrated circuit apparatus, test probe and methods of use thereof |
US5371654A (en) * | 1992-10-19 | 1994-12-06 | International Business Machines Corporation | Three dimensional high performance interconnection package |
TW270213B (ko) * | 1993-12-08 | 1996-02-11 | Matsushita Electric Ind Co Ltd | |
US6331273B1 (en) | 1995-04-25 | 2001-12-18 | Discovery Partners International | Remotely programmable matrices with memories |
US6416714B1 (en) | 1995-04-25 | 2002-07-09 | Discovery Partners International, Inc. | Remotely programmable matrices with memories |
US5751629A (en) * | 1995-04-25 | 1998-05-12 | Irori | Remotely programmable matrices with memories |
US6017496A (en) | 1995-06-07 | 2000-01-25 | Irori | Matrices with memories and uses thereof |
US6329139B1 (en) | 1995-04-25 | 2001-12-11 | Discovery Partners International | Automated sorting system for matrices with memory |
US5874214A (en) | 1995-04-25 | 1999-02-23 | Irori | Remotely programmable matrices with memories |
EP0895287A3 (en) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and lead frame for the same |
US6075742A (en) * | 1997-12-31 | 2000-06-13 | Stmicroelectronics, Inc. | Integrated circuit for switching from power supply to battery, integrated latch lock, and associated method for same |
US6109530A (en) * | 1998-07-08 | 2000-08-29 | Motorola, Inc. | Integrated circuit carrier package with battery coin cell |
DE19927285C2 (de) * | 1999-06-15 | 2003-05-22 | Eupec Gmbh & Co Kg | Niederinduktives Halbleiterbauelement |
US7034402B1 (en) * | 2000-06-28 | 2006-04-25 | Intel Corporation | Device with segmented ball limiting metallurgy |
US7230321B2 (en) * | 2003-10-13 | 2007-06-12 | Mccain Joseph | Integrated circuit package with laminated power cell having coplanar electrode |
US7557433B2 (en) | 2004-10-25 | 2009-07-07 | Mccain Joseph H | Microelectronic device with integrated energy source |
US7180171B1 (en) | 2004-01-08 | 2007-02-20 | Smart Modular Technologies, Inc. | Single IC packaging solution for multi chip modules |
JP2011140365A (ja) * | 2010-01-05 | 2011-07-21 | Asahi Organic Chemicals Industry Co Ltd | 搬送用ローラ及びこれを用いたベルトコンベア |
TWI791200B (zh) * | 2021-03-12 | 2023-02-01 | 華東科技股份有限公司 | 薄型系統級封裝 |
TW202236570A (zh) * | 2021-03-12 | 2022-09-16 | 華東科技股份有限公司 | 系統級封裝 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
JPS57109183A (en) * | 1980-12-26 | 1982-07-07 | Hitachi Ltd | Non-volatile memory |
US4616655A (en) * | 1984-01-20 | 1986-10-14 | Cordis Corporation | Implantable pulse generator having a single printed circuit board and a chip carrier |
JPS61108160A (ja) * | 1984-11-01 | 1986-05-26 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
US5008776A (en) * | 1990-06-06 | 1991-04-16 | Sgs-Thomson Microelectronics, Inc. | Zero power IC module |
-
1990
- 1990-06-06 US US07/534,151 patent/US5089877A/en not_active Expired - Lifetime
-
1991
- 1991-04-30 EP EP19910303899 patent/EP0460801A3/en not_active Withdrawn
- 1991-06-05 KR KR1019910009440A patent/KR100206533B1/ko not_active IP Right Cessation
- 1991-06-05 JP JP13440991A patent/JPH0738028A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0460801A3 (en) | 1993-03-03 |
KR100206533B1 (ko) | 1999-07-01 |
US5089877A (en) | 1992-02-18 |
JPH0738028A (ja) | 1995-02-07 |
EP0460801A2 (en) | 1991-12-11 |
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