KR910021457A - 은으로 충전된 다이 부착 조성물 및 이의 용도 - Google Patents

은으로 충전된 다이 부착 조성물 및 이의 용도 Download PDF

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Publication number
KR910021457A
KR910021457A KR1019910002706A KR910002706A KR910021457A KR 910021457 A KR910021457 A KR 910021457A KR 1019910002706 A KR1019910002706 A KR 1019910002706A KR 910002706 A KR910002706 A KR 910002706A KR 910021457 A KR910021457 A KR 910021457A
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KR
South Korea
Prior art keywords
composition
siloxane
flakes
silver
die attach
Prior art date
Application number
KR1019910002706A
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English (en)
Inventor
엔. 뉴엔 마이
Original Assignee
원본미기재
죤슨 마테이 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 원본미기재, 죤슨 마테이 인코포레이티드 filed Critical 원본미기재
Publication of KR910021457A publication Critical patent/KR910021457A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

은으로 충전된 다이 부착 조성물 및 이의 용도
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (6)

  1. 표면적 0.4-1.3m2/g및 탭밀도 2.5-4.0g/cc를 갖는 은플레이크; 플리이미드 실록산 및 120-220℃의 범위의 비등점을 갖는 액체 비히클로 이루어지는 다이 부착을 위한 페이스트 조성물.
  2. 제1항에 있어서, 액체 비히클이 아세토페논, 디글림, 트리글림, 1-메틸 2-피롤리디논, 아세틸 아세톤 또는 이들의 혼합물로 된 그룹으로 부터 선택된 조성물.
  3. 제2항에 있어서, 폴리이미드 실록산이 결징 이미드 조각 및 200℃이상의 유리 전이 온도를 갖는 연질 실록산 조각으로 된 블록 코폴리머인 조성물.
  4. 제3항에 있어서, 폴리이미드 실록산이 125-145정도의 모듈러스 G(Kpsi)를 갖는 조성물.
  5. 제3항에 있어서, 50-90%의 은 플레이크; 7-20% 플리이미드 실록산, 필수적인 비히클 잔여분을 함유하는 조성물.
  6. 기질에 다이를 접착시키는 방법에 있어서, 정착매체로서, 1항의 조성물을 사용하는 것을 특징으로 하는 접착방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019910002706A 1990-02-21 1991-02-20 은으로 충전된 다이 부착 조성물 및 이의 용도 KR910021457A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48305090A 1990-02-21 1990-02-21
US483050 1990-02-21

Publications (1)

Publication Number Publication Date
KR910021457A true KR910021457A (ko) 1991-12-20

Family

ID=23918448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910002706A KR910021457A (ko) 1990-02-21 1991-02-20 은으로 충전된 다이 부착 조성물 및 이의 용도

Country Status (4)

Country Link
EP (1) EP0443841A2 (ko)
JP (1) JPH0645376A (ko)
KR (1) KR910021457A (ko)
CN (1) CN1063888A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW301843B (en) 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
EP0805616A1 (en) * 1996-05-03 1997-11-05 International Business Machines Corporation Electrically conductive compositions
CN1081212C (zh) * 1996-11-20 2002-03-20 国际商业机器公司 用于电互连的无线导电复合物
CN1053516C (zh) * 1996-12-24 2000-06-14 广东肇庆风华电子工程开发有限公司 表面贴装用片式多层瓷介电容器全银可镀端头浆料

Also Published As

Publication number Publication date
CN1063888A (zh) 1992-08-26
JPH0645376A (ja) 1994-02-18
EP0443841A2 (en) 1991-08-28

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