KR910008830A - Resin Sealed Semiconductor Device - Google Patents

Resin Sealed Semiconductor Device Download PDF

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Publication number
KR910008830A
KR910008830A KR1019900016338A KR900016338A KR910008830A KR 910008830 A KR910008830 A KR 910008830A KR 1019900016338 A KR1019900016338 A KR 1019900016338A KR 900016338 A KR900016338 A KR 900016338A KR 910008830 A KR910008830 A KR 910008830A
Authority
KR
South Korea
Prior art keywords
semiconductor device
sealed semiconductor
resin
resin sealed
heat sink
Prior art date
Application number
KR1019900016338A
Other languages
Korean (ko)
Other versions
KR930005488B1 (en
Inventor
시게키 사카이
Original Assignee
아오이 죠이치
가부시키가이샤 도시바
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아오이 죠이치, 가부시키가이샤 도시바 filed Critical 아오이 죠이치
Publication of KR910008830A publication Critical patent/KR910008830A/en
Application granted granted Critical
Publication of KR930005488B1 publication Critical patent/KR930005488B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음.No content.

Description

수지밀봉 반도체장치Resin Sealed Semiconductor Device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 1실시예를 나타낸 측단면도.1 is a side cross-sectional view showing an embodiment of the present invention.

Claims (2)

히이트 싱크(11)상에 복수의 반도체소자(15a, 15b)가 설치되는 수지밀봉 반도체장치에 있어서, 상기 히이트 싱크와 반도체소자의 상호간에 각각 설치되며 표면에 절연층(13d)을 매개하여 도전층(13e)이 형성된 실리콘 칩(13a, 13b)을 구비하여 구성된 것을 특징으로 하는 수지밀봉 반도체장치.In the resin-sealed semiconductor device in which a plurality of semiconductor elements 15a and 15b are provided on the heat sink 11, the heat sink and the semiconductor elements are respectively provided between the heat sinks and the surface of the heat sink 11 by an insulating layer 13d. A resin-sealed semiconductor device comprising silicon chips (13a, 13b) having conductive layers (13e) formed thereon. 제1항에 있어서, 상기 실리콘 칩의 두께가 0.4~0.13mm로 되어 있는 것을 특징으로 하는 수지밀봉 반도체장치.The resin sealing semiconductor device according to claim 1, wherein the silicon chip has a thickness of 0.4 to 0.13 mm. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900016338A 1989-10-17 1990-10-15 Resin sealed semiconductor device KR930005488B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1269663A JP2535623B2 (en) 1989-10-17 1989-10-17 Resin-sealed semiconductor device
JP269663/1 1989-10-17
JP1-269663 1989-10-17

Publications (2)

Publication Number Publication Date
KR910008830A true KR910008830A (en) 1991-05-31
KR930005488B1 KR930005488B1 (en) 1993-06-22

Family

ID=17475482

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900016338A KR930005488B1 (en) 1989-10-17 1990-10-15 Resin sealed semiconductor device

Country Status (2)

Country Link
JP (1) JP2535623B2 (en)
KR (1) KR930005488B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020051468A (en) * 2000-12-22 2002-06-29 밍 루 Structure for a radiant heat of power device module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52135670A (en) * 1976-05-10 1977-11-12 Toshiba Corp Semiconductor device
JPS6215850A (en) * 1985-07-13 1987-01-24 Oki Electric Ind Co Ltd Multi-chip package substrate

Also Published As

Publication number Publication date
JPH03131056A (en) 1991-06-04
KR930005488B1 (en) 1993-06-22
JP2535623B2 (en) 1996-09-18

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