KR910008830A - Resin Sealed Semiconductor Device - Google Patents
Resin Sealed Semiconductor Device Download PDFInfo
- Publication number
- KR910008830A KR910008830A KR1019900016338A KR900016338A KR910008830A KR 910008830 A KR910008830 A KR 910008830A KR 1019900016338 A KR1019900016338 A KR 1019900016338A KR 900016338 A KR900016338 A KR 900016338A KR 910008830 A KR910008830 A KR 910008830A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- sealed semiconductor
- resin
- resin sealed
- heat sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
내용 없음.No content.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명의 1실시예를 나타낸 측단면도.1 is a side cross-sectional view showing an embodiment of the present invention.
Claims (2)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1269663A JP2535623B2 (en) | 1989-10-17 | 1989-10-17 | Resin-sealed semiconductor device |
JP269663/1 | 1989-10-17 | ||
JP1-269663 | 1989-10-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910008830A true KR910008830A (en) | 1991-05-31 |
KR930005488B1 KR930005488B1 (en) | 1993-06-22 |
Family
ID=17475482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900016338A KR930005488B1 (en) | 1989-10-17 | 1990-10-15 | Resin sealed semiconductor device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2535623B2 (en) |
KR (1) | KR930005488B1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020051468A (en) * | 2000-12-22 | 2002-06-29 | 밍 루 | Structure for a radiant heat of power device module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52135670A (en) * | 1976-05-10 | 1977-11-12 | Toshiba Corp | Semiconductor device |
JPS6215850A (en) * | 1985-07-13 | 1987-01-24 | Oki Electric Ind Co Ltd | Multi-chip package substrate |
-
1989
- 1989-10-17 JP JP1269663A patent/JP2535623B2/en not_active Expired - Fee Related
-
1990
- 1990-10-15 KR KR1019900016338A patent/KR930005488B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH03131056A (en) | 1991-06-04 |
KR930005488B1 (en) | 1993-06-22 |
JP2535623B2 (en) | 1996-09-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20060607 Year of fee payment: 14 |
|
LAPS | Lapse due to unpaid annual fee |