KR920007152A - Resin sealing method of semiconductor device - Google Patents

Resin sealing method of semiconductor device Download PDF

Info

Publication number
KR920007152A
KR920007152A KR1019900014912A KR900014912A KR920007152A KR 920007152 A KR920007152 A KR 920007152A KR 1019900014912 A KR1019900014912 A KR 1019900014912A KR 900014912 A KR900014912 A KR 900014912A KR 920007152 A KR920007152 A KR 920007152A
Authority
KR
South Korea
Prior art keywords
semiconductor device
resin sealing
sealing method
insulating film
width
Prior art date
Application number
KR1019900014912A
Other languages
Korean (ko)
Inventor
이규필
박용직
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019900014912A priority Critical patent/KR920007152A/en
Publication of KR920007152A publication Critical patent/KR920007152A/en

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

내용 없음No content

Description

반도체 장치의 수지밀봉방법Resin sealing method of semiconductor device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제3도는 본 발명의 칩의 금속패드와 리드 프레임의 와이어를 본딩한 다음에 수지로 밀본한 상태를 도시한 도면이다.3 is a view showing a state in which the metal pad of the chip of the present invention and the wire of the lead frame are bonded together with resin.

Claims (1)

기판(1)상에 제1절연막(2)이 형성되고 그 위에 금속패드(3), 제2절연막(4), 제3절연막(5) 및 보호층(6)이 형성되어 있는 칩을 패키지하는 방법에 있어서, 상기 보호층(6)의 개구영역(11)의 폭(W3)을 제3절연막(5)의 개구영역(9)의 폭(W2)보다 넓게 형성하여 금속패드(3)에 와이어(7)를 본딩한 후 수지(8)로 밀봉하는 것을 특징으로 하는 반도체 장치의 수지밀봉방법.To package a chip on which a first insulating film 2 is formed on a substrate 1 and a metal pad 3, a second insulating film 4, a third insulating film 5, and a protective layer 6 are formed thereon. In the method, the width W3 of the opening region 11 of the protective layer 6 is formed to be wider than the width W2 of the opening region 9 of the third insulating film 5 so that the wire on the metal pad 3 can be formed. The resin sealing method of the semiconductor device characterized by sealing with (8) after bonding (7). ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900014912A 1990-09-18 1990-09-18 Resin sealing method of semiconductor device KR920007152A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019900014912A KR920007152A (en) 1990-09-18 1990-09-18 Resin sealing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019900014912A KR920007152A (en) 1990-09-18 1990-09-18 Resin sealing method of semiconductor device

Publications (1)

Publication Number Publication Date
KR920007152A true KR920007152A (en) 1992-04-28

Family

ID=67542598

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019900014912A KR920007152A (en) 1990-09-18 1990-09-18 Resin sealing method of semiconductor device

Country Status (1)

Country Link
KR (1) KR920007152A (en)

Similar Documents

Publication Publication Date Title
KR950009988A (en) Resin-sealed semiconductor device
KR970053752A (en) L.O.C (Lead On Chip) Package and Manufacturing Method
KR930006868A (en) Semiconductor package
KR910001956A (en) Semiconductor device
KR910007094A (en) Resin Sealed Semiconductor Device
KR930011318A (en) Semiconductor device and manufacturing method
KR930022527A (en) Resin Sealed Semiconductor Device
KR970008531A (en) Pad design method of semiconductor device
KR920007152A (en) Resin sealing method of semiconductor device
KR960002775A (en) Resin-sealed semiconductor devices
KR920007155A (en) Semiconductor device and manufacturing method thereof
KR850002676A (en) Integrated Circuit Chip Package
KR870009453A (en) Resin Sealed Semiconductor Device
KR910001949A (en) Flagless Leadframes, Packages and Methods
KR920010803A (en) Wire Bonding Semiconductor Device
KR870000753A (en) Resin Sealed Semiconductor Device
KR920010862A (en) Semiconductor devices and leadframes used therein
KR970008537A (en) Leadframes for lead-on chips with extended leads
KR910008830A (en) Resin Sealed Semiconductor Device
KR900007093A (en) Semiconductor heat sinks and encapsulation methods and leadframes
KR930003333A (en) Semiconductor devices
KR910016069A (en) Lead frame and semiconductor device
KR940012551A (en) Semiconductor chip for wire bonding crack prevention
KR940010292A (en) Semiconductor package
KR970023917A (en) Semiconductor package to prevent short circuit of wire

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination