KR20020051468A - Structure for a radiant heat of power device module - Google Patents

Abstract

PURPOSE: A heatsink structure of a power device module is provided to minimize a thermoresistance of an insulating thermal transfer layer and to prevent a damage due to a temperature rise by maximizing a heat transferring surface of the insulating thermal transfer layer and additionally forming an inter-heatsink. CONSTITUTION: A heatsink structure of a power device module comprises an insulating thermal transfer layer(224) sticked to an entire surface of an outer heatsink(28), a first and a second inter-heatsinks(27a,27b) separately sticked on the insulating thermal transfer layer(224), and a pull-up power device(22) and a pull-down power device(24) respectively sticked to the first and second inter-heatsinks(27a,27b) through built-in heatsinks(222).

Description

Heat dissipation structure of power device module {STRUCTURE FOR A RADIANT HEAT OF POWER DEVICE MODULE}

The present invention relates to a power device module, and more particularly, to a heat dissipation structure of a power drive circuit for operating a load with pull-down and pull-up drive voltages in various electronic controllers.

In general, a device for electrically controlling various electronic devices may be generally classified into a controller and a power driver. The controller implements the necessary control logic using a microcomputer and outputs a control command signal. On the other hand, the power driver supplies power to a load such as a relay, a solenoid, and a motor according to a control command signal from the controller.

1 is a circuit diagram illustrating a general power driving circuit.

Referring to FIG. 1, an example of a half-bridge power driving circuit, which is an example of a power driving unit, includes a driving unit including a driving signal generator 10, a pull-up power device 22, and a pull-down power device 24. 20). Here, reference numeral 30 denotes a load operated according to the driving voltage supplied from the driving unit 20.

In this manner, the configured power driving circuit switches the pull-up power device 22 and the pull-down power device 24 according to the driving signal of the driving signal generator 10 to apply current to the load 30 in both directions.

In addition to the above-described power driving circuit, as an example, an all-bridge type or three-phase motor driving circuit in which the half-bridge type pull-up and pull-down power elements 22 and 24 of FIG. have.

2 is an external view illustrating an example of a power device used in a general power driving circuit. Typically, examples of power devices include transistors (TRs), field effect transistors (FETs), and insulated gate bipolar transistors (IGBTs). In FIG. 1, FETs are used as pull-up and pull-down power devices.

Such a power device is a package 225 as shown in FIG. 2, in the case of a package device, most of which includes its own heat sink 222. The heat sink 222 is in an electrically conductive state with the drain D among the three terminals of the gate G, the drain D, and the source S. FIG.

3 is a plan view showing a module of a power device used in the power drive circuit according to the prior art, Figure 4 is a vertical cross-sectional view showing a heat radiation structure of the power device module used in the power drive circuit according to the prior art.

Referring to FIGS. 3 and 4, the module of the power device includes a load 30, a drive signal generator 10, Vcc, and GND at the source, gate, and drain terminals of the pull-up and pull-down power devices 22 and 24, respectively. The PCB circuit board 26 to connect is bonded.

However, since a large amount of heat is generated during operation of the power device, even if the package of the power device has its own heat sink, the power device module additionally installs a large external heat sink 28 under its own heat sink as shown in FIG. 4. Is common.

On the other hand, in the power device module, the self-heating plate of the pull-up power device 22 is electrically connected to the supply power supply Vcc, but in the case of the pull-down power device 24, it is electrically connected to the load. Therefore, both power devices 22 and 24 must be electrically insulated. Thus, an electrically insulating heat transfer film 224 is inserted between the external heat sink 28 and each of the power devices 22 and 24. The insulating heat transfer film is a material such as a silicon compound or an alumina compound, and is a solid plate or liquid adhesive.

However, in the heat dissipation structure of the power device module according to the prior art, since the thermal resistance of the insulating heat transfer film 224 inserted between the external heat sink and the power device to electrically insulate the pull-up and pull-down power devices is much higher than that of the metal. There was a difficulty in dissipating heat generated in the power device to the external heat sink 28. As a result, heat dissipation of the power device is not made smoothly. As a result, the temperature of the power device increases excessively, resulting in damage to the device.

An object of the present invention, to solve the problems of the prior art, to ensure the maximum heat transfer area of the insulating heat transfer film is inserted between the external heat sink and the power element and the middle heat sink separated between the external heat sink and the pull-up and pull-down power elements respectively In order to minimize the thermal resistance of the insulating heat transfer film and to provide a heat dissipation structure of the power device module that can effectively discharge the heat generated from the power device to the external heat sink.

1 is a circuit diagram showing a general power driving circuit,

2 is an external view illustrating an example of a power device used in a general power driving circuit;

3 is a plan view illustrating a module of a power device used in a power driving circuit according to the prior art.

4 is a vertical sectional view showing a heat dissipation structure of a power device module used in a power driving circuit according to the prior art;

Figure 5 is a vertical cross-sectional view showing a heat radiation structure of the power device module used in the power drive circuit according to the present invention.

<Description of the code | symbol about the principal part of drawing>

10: drive signal generator 20: driver (power device module)

22: pull-up power device 24: pull-down power device

26: PCB circuit board 27a, 27b: the first and second intermediate heat sink

28: external heat sink 30: load

222: self-heat sink of the power device 223: adhesive portion

224: insulating heat transfer film 225: circuit package

In order to achieve the above object, the present invention provides a pull-up and pull-down driving voltage to a load, and a module structure in which an insulating heat transfer film is inserted and bonded between a power element having its own heat sink and an external heat sink, wherein And a pull-up power device and a pull-down power device each of which has an insulating heat transfer film, a first and second intermediate heat sink separated and bonded to an upper portion of the insulating heat transfer film, and a self-heating plate bonded to each other on top of the first and second middle heat sink. .

The principle of the present invention is that the heat resistance is proportional to the thickness of the insulator and inversely proportional to the heat transfer area, thereby making the area of the electrically insulating heat transfer film the same as the external heat sink, thereby increasing the heat transfer area between the power element and the external heat sink. The heat resistance of the power is reduced so that the heat generated from the power device is easily dissipated to the external heat sink.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

5 is a vertical cross-sectional view showing a heat dissipation structure of a power device module used in a power driving circuit according to the present invention.

Referring to FIG. 5, the heat dissipation structure of the power device module of the present invention includes an external heat sink 28, an insulating heat transfer film 224, first and second intermediate heat sinks 27a and 27b, pull-up power devices, and pull-down power devices ( 22,24). Here, the package of the power devices 22 and 24 includes its own heat sink 222. Unexplained reference numeral 26 is a PCB circuit board connecting the load, the drive signal generator, Vcc, and GND to the source, gate, and drain terminals of the pull-up and pull-down power devices 22 and 24, respectively.

In the heat dissipation structure of the power device module according to the present invention, the insulating heat transfer film 224 is adhered to the entire upper surface of the external heat sink 28.

The first and second intermediate heat sinks 27a and 27b are separated and bonded to the upper portion of the insulating heat transfer film 224. That is, the first intermediate heat sink 27a and the second intermediate heat sink 27b are respectively bonded to the upper portion of the insulating heat transfer film 224 corresponding to the pull-up power device 22 and the pull-down power device 24, respectively. do.

In addition, the pull-up power device 22 and the pull-down power device 24 are bonded to their heat sink 222 abuts on the first and second intermediate heat sinks 27a and 27b, respectively.

In addition, the adhesive portion 223 for bonding between the heat sink 222 and the first and second intermediate heat sinks 27a and 27b is preferably made of any one of soldering, welding, bolting, and clip pressing.

Therefore, the present invention adds the first and second intermediate heat sinks 27a and 27b separated and bonded to the pull-up and pull-down power elements 22 and 24, respectively, between the power elements 22 and 24 and the external heat sink 28. By providing the heat sink through the intermediate heat sink can be effectively released to the external heat sink.

In addition, the present invention is inserted between the external heat sink 28 and the intermediate heat sink (27a, 27b), by forming an insulating heat transfer film 224 on the front of the external heat sink 28 to secure the heat transfer area of the heat transfer film to maximize the power device module Minimize the thermal resistance generated within

As described above, the present invention effectively widens the heat transfer area of the insulating heat transfer film inserted between the external heat sink and the power device to the same as the external heat sink, thereby minimizing the thermal resistance of the insulating heat transfer film and effectively dissipating heat generated from the power device to the heat sink. can do.

In addition, the present invention adds first and second intermediate heat sinks, which are separated from each other, between the pull-up and pull-down power devices and the external heat sink, respectively, to dissipate the heat generated by the power device first, and then release the remaining heat to the external heat sink. . Therefore, it is possible to quickly dissipate when the temperature rises excessively of the power device, thereby preventing the damage of the power device in advance.

On the other hand, the present invention is not limited to the above-described embodiment, various modifications are possible by those skilled in the art within the spirit and scope of the present invention described in the claims to be described later.

Claims (2)

In a module structure in which a pull-up and pull-down driving voltage is supplied to a load, and an insulating heat transfer film is inserted and bonded between a power element having its own heat sink and an external heat sink, An insulating heat transfer film adhered to an upper surface of the outer heat sink; First and second intermediate heat sinks separated and adhered to an upper portion of the insulating heat transfer film; And a pull-up power device and a pull-down power device each of which has its own heat sink bonded to the upper portion of the first and second intermediate heat sinks, respectively. The heat dissipation structure of a power device module according to claim 1, wherein the self-heat sink and the first and second intermediate heat sinks are attached to each other by soldering, welding, bolting, or clip pressing.