KR910004738A - 열경화성 수지 조성물 - Google Patents

열경화성 수지 조성물 Download PDF

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Publication number
KR910004738A
KR910004738A KR1019890015988A KR890015988A KR910004738A KR 910004738 A KR910004738 A KR 910004738A KR 1019890015988 A KR1019890015988 A KR 1019890015988A KR 890015988 A KR890015988 A KR 890015988A KR 910004738 A KR910004738 A KR 910004738A
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South Korea
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composition
weight
parts
rotor
resin
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KR1019890015988A
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KR0133062B1 (ko
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이찌로 아구따가와
구니미쓰 마쓰자끼
도시오 마쓰오
류이찌 후지이
사또루 우메끼
요시미찌 오노
다께오 미야모또
고끼 우에따
나오끼 가마다
Original Assignee
원본미기재
소마루 가부시끼가이샤
가부시끼가이샤 히다찌세이사꾸쇼
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Publication of KR910004738A publication Critical patent/KR910004738A/ko
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Publication of KR0133062B1 publication Critical patent/KR0133062B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
    • H01B7/29—Protection against damage caused by extremes of temperature or by flame
    • H01B7/292—Protection against damage caused by extremes of temperature or by flame using material resistant to heat
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/10—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Insulation, Fastening Of Motor, Generator Windings (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Motors, Generators (AREA)

Abstract

내용 없음.

Description

열경화성 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 모터의 회전자를 도식적으로 예시하는 투시도이고,
제2도는 제1도의 부분 단면도이고,
제3(a) 내지 제3(c)도는 회전자의 권선을 단열시키는 방법을 도식적으로 예시하는 것이다.

Claims (11)

  1. 액체 에폭시 수지, 산 무수물을 함유하는 경화제, 상기 액체 에폭시 수지 100 중량부 당 3 내지 50 중량부의 말레이미드 수지, 및 상기 액체 에폭시 수지 100 중량부 당 50 내지 400중량부의 미분된 규회석(wollastonite)을 함유하는 열경화성 수지 조성물.
  2. 제1항에 있어서, 상기 에폭시 수지 100 중량부 당 각각 5 내지 20 중량부 및 100 내지 300 중량부로 말레이미드 수지 및 규회석을 사용하는 조성물.
  3. 제1항에 있어서, 말레이미드 수지가 두 개 이상의 하기 일반식의 구조 단위를 갖는 수지인 조성물.
    상기식에서, R은 수소, 할로겐, 알킬 또는 알콕시를 나타낸다.
  4. 제1항에 있어서, 규회석이 0.5 내지 100㎛의 평균 입자 크기를 갖는 조성물.
  5. 제1항에 따른 열경화성 수지 조성물을 제조하고, 회전자의 슬로트(slot) 및/또는 이의 주위에 제공된 권선에 상기 조성물을 도포하며, 상기 도포된 조성물을 경화시키는 공정을 포함하는, 회전자의 슬로트 주위에 제공된 권선을 단열 시키는 방법.
  6. 제5항에 있어서, 상기 도포된 조성물을 160 내지 200℃로 가열하여 상기 경화를 수행하는 방법.
  7. 제5항에 있어서, 상기 도포 공정전에 상기 회전자를 150 내지 200℃까지 가열시킴을 추가로 포함하는 방법.
  8. 제5항에 있어서, 상기 회전자를 상기 조성물의 욕조와 접촉시키거나, 상기 회전자상에 상기 조성물의 소적을 도포하거나 또는 상기 회전자를 상기 조성물의 제트 스트림과 접촉시켜 상기 도포공정을 수행하는 방법.
  9. 제8항에 있어서, 상기 조성물의 욕조와 상기 회전자와의 접촉을 상기 회전자를 회전시키면서 수행하는 방법.
  10. 제8항에 있어서, 상기 조성물의 욕조와 상기 회전자와의 접촉을 감압으로 유지된 폐쇄 용기중에 포함된 상기 욕조중에서 상기 회전자를 침지시켜 수행하는 방법.
  11. 액체 에폭시 수지, 이 액체 에폭시 수지 100 중량부 당 3 내지 50 중량부의 말레이미드 수지, 및 상기 액체 에폭시 수지 100 중량부 당 50 내지 400 중량부의 미분된 규회석을 함유하는 제1성분 팩(pack), 및 산 무수물을 포함하는 경화제를 함유하는 제2성분 팩으로 이루어지고, 제1 및 제2성분 팩이 서로 혼합되어 열경화성 수지 조성물을 제공하는 2성분 팩.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890015988A 1989-08-26 1989-11-04 열경화성 수지 조성물 KR0133062B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP89-219751 1989-08-26
JP1219751A JPH0799915B2 (ja) 1989-08-26 1989-08-26 回転電機の回転子及びその絶縁方法

Publications (2)

Publication Number Publication Date
KR910004738A true KR910004738A (ko) 1991-03-29
KR0133062B1 KR0133062B1 (ko) 1998-04-13

Family

ID=16740428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015988A KR0133062B1 (ko) 1989-08-26 1989-11-04 열경화성 수지 조성물

Country Status (5)

Country Link
EP (1) EP0414975B1 (ko)
JP (1) JPH0799915B2 (ko)
KR (1) KR0133062B1 (ko)
CA (1) CA2002063A1 (ko)
DE (1) DE68924531T2 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3896529B2 (ja) * 1994-07-01 2007-03-22 バンティコ アクチエンゲゼルシャフト エポキシ樹脂注型用組成物
EP0736556B1 (de) * 1995-04-04 2003-05-07 Vantico AG Wollastonit enthaltendes, härtbares Epoxidharzgemisch
US6001902A (en) * 1996-03-27 1999-12-14 Ciba Specialty Chemicals Corp. Wollastonite-containing curable epoxy resin mixture
JP4665319B2 (ja) * 2001-02-26 2011-04-06 住友ベークライト株式会社 一液型エポキシ樹脂組成物
JP4576732B2 (ja) * 2001-03-23 2010-11-10 住友ベークライト株式会社 一液型エポキシ樹脂組成物
EP1619777B1 (en) * 2003-04-28 2017-03-15 Mitsubishi Denki Kabushiki Kaisha Process for producing stator of dynamo-electric machine
JP5058514B2 (ja) * 2006-05-22 2012-10-24 京セラケミカル株式会社 樹脂モールドステータの製造方法および樹脂モールドステータ
JP5332084B2 (ja) * 2006-06-20 2013-11-06 株式会社安川電機 真空用機器に用いられるエポキシ樹脂組成物とその製造方法およびこの樹脂を用いた真空用機器
JP5182512B2 (ja) * 2008-12-15 2013-04-17 日亜化学工業株式会社 熱硬化性エポキシ樹脂組成物及び半導体装置
JP6101122B2 (ja) * 2013-03-15 2017-03-22 京セラ株式会社 モールドトランス用エポキシ樹脂組成物、モールドトランスおよびモールドトランスの製造方法

Also Published As

Publication number Publication date
CA2002063A1 (en) 1991-02-26
JPH0386034A (ja) 1991-04-11
EP0414975A1 (en) 1991-03-06
EP0414975B1 (en) 1995-10-11
KR0133062B1 (ko) 1998-04-13
JPH0799915B2 (ja) 1995-10-25
DE68924531D1 (de) 1995-11-16
DE68924531T2 (de) 1996-04-25

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