KR910003149A - 수성과산화수소 조성물 및 그것으로 인쇄 배선 판을 제조하는 방법 - Google Patents
수성과산화수소 조성물 및 그것으로 인쇄 배선 판을 제조하는 방법 Download PDFInfo
- Publication number
- KR910003149A KR910003149A KR1019890010639A KR890010639A KR910003149A KR 910003149 A KR910003149 A KR 910003149A KR 1019890010639 A KR1019890010639 A KR 1019890010639A KR 890010639 A KR890010639 A KR 890010639A KR 910003149 A KR910003149 A KR 910003149A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- hydrogen
- general formula
- alkyl
- hydrogen peroxide
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/01—Hydrogen peroxide
- C01B15/037—Stabilisation by additives
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Anti-Oxidant Or Stabilizer Compositions (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (14)
- 과산화수소 및 과산화수소에 녹는, 하기 일반식의 화합물로 구성된 안정화된 과산화수소 조성물 :상기식에서, X는 링킹(linking)기이고 Y는 금속 양이온 또는 H이다.
- 제1항에 있어서, X가 알킬부분이 1-13개 탄소원자를 함유하는 치환된 알킬인 조성물.
- 제1항에 있어서, X가 하기 일반식인 조성물 :상기식에서, R1및 R2는 각각 H 또는 C1-9알킬 또는 C5또는 C6포화또는 불포화 시클릭 기이고, m 및 n은, 각각 m과 n의 합이 12이하를 조건으로 하는, 0-9의 정수이다.
- 제3항에 있어서, R1및 R2가 같고 H 또는 C1-C4알킬인 조성물.
- 제1항에 있어서, Y가 수소인 조성물.
- 제3항에 있어서, Y가 수소인 조성물.
- 제1항에 있어서, 설퍼닐 산 화합물을 함유하는 조성물.
- 하기 (a)-(d)로 구성된 수성 화학적 부식제 조성물 : (a) 물 (b) 과산화 수소, (c) 무기산 (d) 과산화수소에 녹는, 일반식(여기서, X는 링킹기이고, Y는 금속 양이온이다.)
- 제8항에 있어서, X가 알킬 부분이 1-13개 탄소원자를 함유하는 치환된 알킬 부분인 조성물.
- 제8항에 있어서, X가 하기 일반식인 조성물 :상기식에서, R1및 R2는 각각 H 또는 C1-9알킬 또는 C5또는 C6포화 또는 불포화 시클릭 기이고, m 및 n은, 각각 m과 n의 합이 12이하인 조건을 가진, 1-9의 정수이다.
- 제10항에 있어서, R1및 R2가 같고 H 또는 C1-C4알킬인 조성물.
- 제8항에 있어서, Y가 수소인 조성물.
- 제10항에 있어서, Y가 수소인 조성물.
- 하기 (a)-(d)로 구성된 조성물을 가진 금속 부분을 함유하는 표면을 부식시키는 것으로 구성된 인쇄 배선판을 제조하는 방법 : (a) 물 (b) 과산화 수소, (c) 무기산 (d) 과산화수소에 녹는, 일반식의 화합물.(여기서, X는 링킹기이고, Y는 금속 양이온 또는 H이다.)※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/224,803 US4915781A (en) | 1988-07-27 | 1988-07-27 | Stabilized hydrogen peroxide compositions |
US224,803 | 1988-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR910003149A true KR910003149A (ko) | 1991-02-27 |
Family
ID=22842281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890010639A KR910003149A (ko) | 1988-07-27 | 1989-07-26 | 수성과산화수소 조성물 및 그것으로 인쇄 배선 판을 제조하는 방법 |
Country Status (14)
Country | Link |
---|---|
US (1) | US4915781A (ko) |
EP (1) | EP0353084A3 (ko) |
JP (1) | JPH02125886A (ko) |
KR (1) | KR910003149A (ko) |
CN (1) | CN1040184A (ko) |
AU (1) | AU613507B2 (ko) |
BR (1) | BR8903708A (ko) |
DK (1) | DK368489A (ko) |
FI (1) | FI893579A (ko) |
IL (1) | IL91114A0 (ko) |
NO (1) | NO893049L (ko) |
NZ (1) | NZ230080A (ko) |
PT (1) | PT91282A (ko) |
ZA (1) | ZA895726B (ko) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1251431B (it) * | 1991-10-25 | 1995-05-09 | Costante Fontana | Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali |
US5364510A (en) * | 1993-02-12 | 1994-11-15 | Sematech, Inc. | Scheme for bath chemistry measurement and control for improved semiconductor wet processing |
US5439569A (en) * | 1993-02-12 | 1995-08-08 | Sematech, Inc. | Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath |
US5724668A (en) * | 1995-11-07 | 1998-03-03 | Electronic Power Research Institute | Method for decontamination of nuclear plant components |
US6147274A (en) * | 1996-11-05 | 2000-11-14 | Electric Power Research Insitute | Method for decontamination of nuclear plant components |
US5805654A (en) * | 1997-04-08 | 1998-09-08 | Wood; Christopher J. | Regenerative LOMI decontamination process |
US5901368A (en) * | 1997-06-04 | 1999-05-04 | Electric Power Research Institute | Radiolysis-assisted decontamination process |
US6074960A (en) | 1997-08-20 | 2000-06-13 | Micron Technology, Inc. | Method and composition for selectively etching against cobalt silicide |
US6068879A (en) * | 1997-08-26 | 2000-05-30 | Lsi Logic Corporation | Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing |
TW460622B (en) * | 1998-02-03 | 2001-10-21 | Atotech Deutschland Gmbh | Solution and process to pretreat copper surfaces |
EP0945527A1 (en) * | 1998-03-24 | 1999-09-29 | Henkel Corporation | Aqueous liquid deoxidizing compositions methods of preparing them and processes for deoxidizing-etching aluminum therewith |
US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
US9765287B2 (en) | 2015-06-03 | 2017-09-19 | Metrex Research Corporation | Stabilized hydrogen peroxide compositions and method of making same |
BR112021001869A2 (pt) * | 2018-08-02 | 2021-04-27 | Evonik Corporation | soluções aquosas de peróxido de hidrogênio estabilizadas por polímero |
US11678433B2 (en) | 2018-09-06 | 2023-06-13 | D-Wave Systems Inc. | Printed circuit board assembly for edge-coupling to an integrated circuit |
US11647590B2 (en) | 2019-06-18 | 2023-05-09 | D-Wave Systems Inc. | Systems and methods for etching of metals |
CN116770306A (zh) * | 2023-06-28 | 2023-09-19 | 珠海市板明科技有限公司 | 一种用于载板的快速蚀刻添加剂及其应用 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
JPS5120972B1 (ko) * | 1971-05-13 | 1976-06-29 | ||
US3974086A (en) * | 1972-05-04 | 1976-08-10 | American Cyanamid Company | Stabilization of hydrogen peroxide solutions |
GB1435893A (en) * | 1972-07-05 | 1976-05-19 | Ici Ltd | Treatment of textile materials |
SE400581B (sv) * | 1974-12-13 | 1978-04-03 | Nordnero Ab | Bad for kemisk polering av koppar och dess legeringar |
FR2297906A1 (fr) * | 1975-01-14 | 1976-08-13 | Ugine Kuhlmann | Stabilisation du peroxyde d'hydrogene dans les bains acides pour le decapage des metaux |
US4027008A (en) * | 1975-05-14 | 1977-05-31 | The Gillette Company | Hair bleaching composition containing water-soluble amino and quaternary ammonium polymers |
GB1565349A (en) * | 1975-10-20 | 1980-04-16 | Albright & Wilson | Aluminium polishing compositions |
FR2343797A1 (fr) * | 1976-03-11 | 1977-10-07 | Air Liquide | Solutions stabilisees de peroxyde d'hydrogene pour les traitements de surface des metaux |
US4141850A (en) * | 1977-11-08 | 1979-02-27 | Dart Industries Inc. | Dissolution of metals |
US4233113A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant |
US4233111A (en) * | 1979-06-25 | 1980-11-11 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant |
US4236957A (en) * | 1979-06-25 | 1980-12-02 | Dart Industries Inc. | Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant |
GB8307036D0 (en) * | 1983-03-15 | 1983-04-20 | Interox Chemicals Ltd | Peroxygen compounds |
US4437930A (en) * | 1983-08-22 | 1984-03-20 | Dart Industries Inc. | Dissolution of metals utilizing ε-caprolactam |
US4437931A (en) * | 1983-08-22 | 1984-03-20 | Dart Industries Inc. | Dissolution of metals |
US4462861A (en) * | 1983-11-14 | 1984-07-31 | Shipley Company Inc. | Etchant with increased etch rate |
DE3580406D1 (de) * | 1984-07-11 | 1990-12-13 | Merck Patent Gmbh | Fluessigkristall-phase. |
US4636282A (en) * | 1985-06-20 | 1987-01-13 | Great Lakes Chemical Corporation | Method for etching copper and composition useful therein |
GB8522046D0 (en) * | 1985-09-05 | 1985-10-09 | Interox Chemicals Ltd | Stabilisation |
US4735740A (en) * | 1986-10-03 | 1988-04-05 | The Clorox Company | Diperoxyacid precursors and method |
-
1988
- 1988-07-27 US US07/224,803 patent/US4915781A/en not_active Expired - Fee Related
-
1989
- 1989-07-25 NZ NZ230080A patent/NZ230080A/xx unknown
- 1989-07-26 PT PT91282A patent/PT91282A/pt not_active Application Discontinuation
- 1989-07-26 DK DK368489A patent/DK368489A/da not_active Application Discontinuation
- 1989-07-26 IL IL91114A patent/IL91114A0/xx unknown
- 1989-07-26 KR KR1019890010639A patent/KR910003149A/ko not_active Application Discontinuation
- 1989-07-26 FI FI893579A patent/FI893579A/fi not_active Application Discontinuation
- 1989-07-26 NO NO89893049A patent/NO893049L/no unknown
- 1989-07-26 BR BR898903708A patent/BR8903708A/pt unknown
- 1989-07-27 CN CN89107306A patent/CN1040184A/zh active Pending
- 1989-07-27 ZA ZA895726A patent/ZA895726B/xx unknown
- 1989-07-27 EP EP89307687A patent/EP0353084A3/en not_active Withdrawn
- 1989-07-27 JP JP1195398A patent/JPH02125886A/ja active Pending
- 1989-07-27 AU AU39001/89A patent/AU613507B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
NO893049L (no) | 1990-01-29 |
BR8903708A (pt) | 1990-03-20 |
PT91282A (pt) | 1990-02-08 |
DK368489A (da) | 1990-01-28 |
FI893579A (fi) | 1990-01-28 |
AU3900189A (en) | 1990-02-01 |
AU613507B2 (en) | 1991-08-01 |
IL91114A0 (en) | 1990-03-19 |
ZA895726B (en) | 1991-03-27 |
NO893049D0 (no) | 1989-07-26 |
CN1040184A (zh) | 1990-03-07 |
NZ230080A (en) | 1990-08-28 |
FI893579A0 (fi) | 1989-07-26 |
US4915781A (en) | 1990-04-10 |
EP0353084A3 (en) | 1990-04-18 |
JPH02125886A (ja) | 1990-05-14 |
EP0353084A2 (en) | 1990-01-31 |
DK368489D0 (da) | 1989-07-26 |
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WITB | Written withdrawal of application |