BR8903708A - Composicao de peroxido de hidrogenio estabilizada;composicao quimica aquosa corrosiva,e processo de preparacao de uma placa de circuito impresso - Google Patents

Composicao de peroxido de hidrogenio estabilizada;composicao quimica aquosa corrosiva,e processo de preparacao de uma placa de circuito impresso

Info

Publication number
BR8903708A
BR8903708A BR898903708A BR8903708A BR8903708A BR 8903708 A BR8903708 A BR 8903708A BR 898903708 A BR898903708 A BR 898903708A BR 8903708 A BR8903708 A BR 8903708A BR 8903708 A BR8903708 A BR 8903708A
Authority
BR
Brazil
Prior art keywords
preparation
composition
circuit board
printed circuit
hydrogen peroxide
Prior art date
Application number
BR898903708A
Other languages
English (en)
Inventor
Bruce A Bohnen
Kurt E Heikkila
Rodney K Williams
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of BR8903708A publication Critical patent/BR8903708A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
    • C01B15/01—Hydrogen peroxide
    • C01B15/037—Stabilisation by additives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Anti-Oxidant Or Stabilizer Compositions (AREA)
BR898903708A 1988-07-27 1989-07-26 Composicao de peroxido de hidrogenio estabilizada;composicao quimica aquosa corrosiva,e processo de preparacao de uma placa de circuito impresso BR8903708A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/224,803 US4915781A (en) 1988-07-27 1988-07-27 Stabilized hydrogen peroxide compositions

Publications (1)

Publication Number Publication Date
BR8903708A true BR8903708A (pt) 1990-03-20

Family

ID=22842281

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898903708A BR8903708A (pt) 1988-07-27 1989-07-26 Composicao de peroxido de hidrogenio estabilizada;composicao quimica aquosa corrosiva,e processo de preparacao de uma placa de circuito impresso

Country Status (14)

Country Link
US (1) US4915781A (pt)
EP (1) EP0353084A3 (pt)
JP (1) JPH02125886A (pt)
KR (1) KR910003149A (pt)
CN (1) CN1040184A (pt)
AU (1) AU613507B2 (pt)
BR (1) BR8903708A (pt)
DK (1) DK368489A (pt)
FI (1) FI893579A (pt)
IL (1) IL91114A0 (pt)
NO (1) NO893049L (pt)
NZ (1) NZ230080A (pt)
PT (1) PT91282A (pt)
ZA (1) ZA895726B (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1251431B (it) * 1991-10-25 1995-05-09 Costante Fontana Composto ad elevate caratteristiche stabilizzanti particolarmente per perossidi inorganici utilizzati in applicazioni industriali
US5439569A (en) * 1993-02-12 1995-08-08 Sematech, Inc. Concentration measurement and control of hydrogen peroxide and acid/base component in a semiconductor bath
US5364510A (en) * 1993-02-12 1994-11-15 Sematech, Inc. Scheme for bath chemistry measurement and control for improved semiconductor wet processing
US5724668A (en) * 1995-11-07 1998-03-03 Electronic Power Research Institute Method for decontamination of nuclear plant components
US6147274A (en) * 1996-11-05 2000-11-14 Electric Power Research Insitute Method for decontamination of nuclear plant components
US5805654A (en) * 1997-04-08 1998-09-08 Wood; Christopher J. Regenerative LOMI decontamination process
US5901368A (en) * 1997-06-04 1999-05-04 Electric Power Research Institute Radiolysis-assisted decontamination process
US6074960A (en) 1997-08-20 2000-06-13 Micron Technology, Inc. Method and composition for selectively etching against cobalt silicide
US6068879A (en) * 1997-08-26 2000-05-30 Lsi Logic Corporation Use of corrosion inhibiting compounds to inhibit corrosion of metal plugs in chemical-mechanical polishing
TW460622B (en) * 1998-02-03 2001-10-21 Atotech Deutschland Gmbh Solution and process to pretreat copper surfaces
US6649081B1 (en) * 1998-03-24 2003-11-18 Henkel Corporation Aqueous liquid deoxidizing composition and process for aluminum, with low foaming tendency
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
US9765287B2 (en) 2015-06-03 2017-09-19 Metrex Research Corporation Stabilized hydrogen peroxide compositions and method of making same
WO2020028655A1 (en) * 2018-08-02 2020-02-06 Evonik Corporation Polymer-stabilized aqueous hydrogen peroxide solutions and associated methods
US11678433B2 (en) 2018-09-06 2023-06-13 D-Wave Systems Inc. Printed circuit board assembly for edge-coupling to an integrated circuit
US11647590B2 (en) 2019-06-18 2023-05-09 D-Wave Systems Inc. Systems and methods for etching of metals
CN116770306A (zh) * 2023-06-28 2023-09-19 珠海市板明科技有限公司 一种用于载板的快速蚀刻添加剂及其应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3407141A (en) * 1966-02-03 1968-10-22 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
JPS5120972B1 (pt) * 1971-05-13 1976-06-29
US3974086A (en) * 1972-05-04 1976-08-10 American Cyanamid Company Stabilization of hydrogen peroxide solutions
GB1435893A (en) * 1972-07-05 1976-05-19 Ici Ltd Treatment of textile materials
SE400581B (sv) * 1974-12-13 1978-04-03 Nordnero Ab Bad for kemisk polering av koppar och dess legeringar
FR2297906A1 (fr) * 1975-01-14 1976-08-13 Ugine Kuhlmann Stabilisation du peroxyde d'hydrogene dans les bains acides pour le decapage des metaux
US4027008A (en) * 1975-05-14 1977-05-31 The Gillette Company Hair bleaching composition containing water-soluble amino and quaternary ammonium polymers
GB1565349A (en) * 1975-10-20 1980-04-16 Albright & Wilson Aluminium polishing compositions
FR2343797A1 (fr) * 1976-03-11 1977-10-07 Air Liquide Solutions stabilisees de peroxyde d'hydrogene pour les traitements de surface des metaux
US4141850A (en) * 1977-11-08 1979-02-27 Dart Industries Inc. Dissolution of metals
US4233113A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 O2 -H2 SO4 -thioamide etchant
US4233111A (en) * 1979-06-25 1980-11-11 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SO4 -H2 O2 -3-sulfopropyldithiocarbamate etchant
US4236957A (en) * 1979-06-25 1980-12-02 Dart Industries Inc. Dissolution of metals utilizing an aqueous H2 SOY --H2 O.sub. -mercapto containing heterocyclic nitrogen etchant
GB8307036D0 (en) * 1983-03-15 1983-04-20 Interox Chemicals Ltd Peroxygen compounds
US4437931A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals
US4437930A (en) * 1983-08-22 1984-03-20 Dart Industries Inc. Dissolution of metals utilizing ε-caprolactam
US4462861A (en) * 1983-11-14 1984-07-31 Shipley Company Inc. Etchant with increased etch rate
DE3580406D1 (de) * 1984-07-11 1990-12-13 Merck Patent Gmbh Fluessigkristall-phase.
US4636282A (en) * 1985-06-20 1987-01-13 Great Lakes Chemical Corporation Method for etching copper and composition useful therein
GB8522046D0 (en) * 1985-09-05 1985-10-09 Interox Chemicals Ltd Stabilisation
US4735740A (en) * 1986-10-03 1988-04-05 The Clorox Company Diperoxyacid precursors and method

Also Published As

Publication number Publication date
NO893049L (no) 1990-01-29
AU613507B2 (en) 1991-08-01
DK368489A (da) 1990-01-28
FI893579A (fi) 1990-01-28
IL91114A0 (en) 1990-03-19
PT91282A (pt) 1990-02-08
US4915781A (en) 1990-04-10
NO893049D0 (no) 1989-07-26
EP0353084A2 (en) 1990-01-31
CN1040184A (zh) 1990-03-07
DK368489D0 (da) 1989-07-26
AU3900189A (en) 1990-02-01
JPH02125886A (ja) 1990-05-14
EP0353084A3 (en) 1990-04-18
ZA895726B (en) 1991-03-27
FI893579A0 (fi) 1989-07-26
NZ230080A (en) 1990-08-28
KR910003149A (ko) 1991-02-27

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