KR910003065A - Metal Surface Polishing Composition and Polishing Method - Google Patents

Metal Surface Polishing Composition and Polishing Method Download PDF

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Publication number
KR910003065A
KR910003065A KR1019900011562A KR900011562A KR910003065A KR 910003065 A KR910003065 A KR 910003065A KR 1019900011562 A KR1019900011562 A KR 1019900011562A KR 900011562 A KR900011562 A KR 900011562A KR 910003065 A KR910003065 A KR 910003065A
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South Korea
Prior art keywords
polishing composition
metal surface
polishing
aluminum
chloride
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KR1019900011562A
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Korean (ko)
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KR0165107B1 (en
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브이. 에이치. 로버츠 존
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윌리암 디. 부딘저
로델, 인코포레이티드
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Abstract

The present invention relates to a method of polishing a metal surface using an aqueous polishing composition for metal surfaces comprising water, an abrasive agent, such as aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide and a salt, or combination of salts, such as aluminum chloride, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, aluminum bromide, aluminum iodide, aluminum chloride, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride, magnesium perchlorate and iron chloride.

Description

금속 표면 연마용 조성물 및 연마 방법Metal Surface Polishing Composition and Polishing Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (20)

(a)산 및 염기의 반응 및 산 및 금속의 반응으로 이루어진 그룹중에서 선택된 반응 생성물이며, 양이온성분(이 양이온 성분은 연마되는 금속 표면상에서 무전기 도금에 의해 침착되지 않는 이온화된 원소로 이루어지 그룹으로부터 선택된다) 및 음이온 성분을 함유하는 염, 물 및 연마제를 함유하는 수성 연마 조성물을 제조하고, (b)이 조성물을 연마될 금속 표면에 적용하며, (c)금속 표면을 연마함을 특징으로 하여, 금속 표면을 연마하는 방법.(a) a reaction product selected from the group consisting of reactions of acids and bases and reactions of acids and metals, the cationic component of which is composed of ionized elements not deposited by radio plating on the surface of the metal being polished And (b) applies the composition to the metal surface to be polished, and (c) polishes the metal surface. , How to polish metal surfaces. 제1항에 있어서, 연마제가 산화세륨, 산화알루미늄, 산화지르코늄, 산화주석, 이산화실리콘, 탄화실리콘, 이산화티탄 및 탄화티탄으로 이루어진 그룹으로부터 선택되는 방법.The method of claim 1 wherein the abrasive is selected from the group consisting of cerium oxide, aluminum oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide. 제2항에 있어서, 연마제가 약 20 마이크론 이하의 크기를 갖는 입자를 함유함을 특징으로 하는 방법.The method of claim 2, wherein the abrasive contains particles having a size of about 20 microns or less. 제1항에 있어서, 염의 양이온 성분이 원소 주기율표의 ⅡA, ⅢA, ⅣA, 및 ⅣB 그룹으로부터 선택된 이온화된 원소, 아연, 세륨, 주석 및 철이온을 포함함을 특징으로 하는 방법.The method of claim 1 wherein the cationic component of the salt comprises ionized elements, zinc, cerium, tin and iron ions selected from groups IIA, IIIA, IVA, and IVB of the Periodic Table of the Elements. 제1항에 있어서, 염의 음이온 성분이 클로라이드, 브로마이드, 요오다이드, 질산염, 인산염, 황산염 또는 과염소산염 이온으로 이루어진 그룹으로부터 선택되는 방법.The method of claim 1 wherein the anionic component of the salt is selected from the group consisting of chloride, bromide, iodide, nitrate, phosphate, sulfate or perchlorate ions. 제1항에 있어서, 연마 조성물이 두개 이상의 염을 함유함을 특징으로 하는 방법.The method of claim 1 wherein the polishing composition contains at least two salts. (a)브롬화알루미늄, 염화알루미늄, 요오드화알루미늄, 지르코닐 니트레이트, 지르코닐 설페이트, 질산세륨, 질산알루미늄, 지르코닐 클로라이드, 염화주석, 과염소산알루미늄, 염화마그네슘, 염화아연 및 과염소산마그네슘으로 이루어진 그룹으로부터 선택된 염, 물 및 연마제를 함유하는 수성 연마 조성물을 제조하고, (b)이 조성물을 연마할 금속 표면에 적용하며, (c)금속 표면을 연마함을 특징으로 하여, 금속 표면을 염마하는 방법.(a) selected from the group consisting of aluminum bromide, aluminum chloride, aluminum iodide, zirconyl nitrate, zirconyl sulfate, cerium nitrate, aluminum nitrate, zirconyl chloride, tin chloride, aluminum perchlorate, magnesium chloride, zinc chloride and magnesium perchlorate A method of preparing an aqueous polishing composition containing salt, water, and an abrasive, wherein (b) applies the composition to a metal surface to be polished, and (c) polishes the metal surface. (a)연마 화합물의 수성 슬러리에 산 및 염기를 가하여 동일계 반응내에서 생성시킨 염, 물 및 연마제를 함유하는 수성 연마 조성물을 제조하고, (b)이 조성물을 연마할 금속 표면에 적용하며, (c)금속 표면을 연마함을 특징으로 하여, 금속 표면을 연마하는 방법.(a) adding an acid and a base to an aqueous slurry of the polishing compound to prepare an aqueous polishing composition containing salts, water and abrasives produced in situ, and (b) applying the composition to the metal surface to be polished, ( c) polishing the metal surface, characterized by grinding the metal surface. (a)연마 화합물의 수성 슬러리에 금속 및 산을 가하여 동일계 반응내에서 생성시킨 염, 물 및 연마제를 함유하는 수성 연마 조성물을 제조하고, (b)이 조성물을 연마할 금속 표면에 적용하며, (c)금속 표면을 연마함을 특징으로 하여, 금속 표면을 연마하는 방법.(a) adding an metal and an acid to an aqueous slurry of the polishing compound to prepare an aqueous polishing composition containing salts, water and abrasives produced in situ, and (b) applying the composition to the metal surface to be polished, ( c) polishing the metal surface, characterized by grinding the metal surface. 제1항에 있어서, 염의 농도가 연마 조성물의 약 0.1 내지 약 50중량%인 방법.The method of claim 1 wherein the concentration of salt is from about 0.1 to about 50 weight percent of the polishing composition. 제1항에 있어서, 연마제 및 염의 혼합 중량%가 연마 조성물의 약 2중량% 내지 약 50중량%인 방법.The method of claim 1 wherein the mixed weight percentage of abrasive and salt is from about 2% to about 50% by weight of the polishing composition. (a)염산, 질산, 인삼 및 황산으로 이루어진 그룹으로부터 선택되며 연마 조성물의 pH를 약 1 내지 약 6으로 조절하는 양의 산, 물, 연마제 및 염을 함유하는 수성 연마 조성물을 제조하고, (b)이 조성물을 연마할 금속 표면에 적용하며, (c)금속 표면을 연마함을 특징으로 하여, 금속 표면을 연마하는 방법.(a) preparing an aqueous polishing composition selected from the group consisting of hydrochloric acid, nitric acid, ginseng and sulfuric acid and containing an amount of acid, water, abrasive and salt in an amount that adjusts the pH of the polishing composition to about 1 to about 6, (b) ) Applying the composition to a metal surface to be polished, and (c) polishing the metal surface. 산화알루미늄, 산화세륨, 산화지르코늄, 산화주석, 이산화실리콘, 탄화실리콘, 이산화티탄 및 탄화티탄으로 구성된 그룹으로부터 선택된 연마제, 물, 및 염화마그네슘, 질산알루니늄 및 과염소산마그네슘으로 구성된 그룹으로 부터 선택된 염을 함유함을 특징으로 하는, 금속 표면 연마용 수성 연마 조성물.Abrasive selected from the group consisting of aluminum oxide, cerium oxide, zirconium oxide, tin oxide, silicon dioxide, silicon carbide, titanium dioxide and titanium carbide, water and salts selected from the group consisting of magnesium chloride, aluminum nitrate and magnesium perchlorate An aqueous polishing composition for polishing a metal surface, comprising: a. 제13항에 있어서, 두개 이상의 염을 함유하는 연마 조성물.The polishing composition of claim 13, wherein the polishing composition contains at least two salts. 제13항에 있어서, 염의 농도가 연마 조성물의 약 0.1 내지 약 50중량%인 연마 조성물.The polishing composition of claim 13, wherein the salt concentration is about 0.1 to about 50 weight percent of the polishing composition. 제13항에 있어서, 연마제 및 염의 혼합 중량%가 연마 조성물의 약 2 내지 50중량%인 연마 조성물.The polishing composition of claim 13, wherein the mixed weight percent of the abrasive and salt is about 2-50% by weight of the polishing composition. 제13항에 있어서, 연마 조성물의 pH를 약 1 내지 약 6으로 조절하는 양으로 산을 추가로 함유하는 연마 조성물.The polishing composition of claim 13, further comprising an acid in an amount that adjusts the pH of the polishing composition to about 1 to about 6. 14. 제17항에 있어서, 산을 염산, 질산, 인산 및 황산으로 이루어진 그룹으로부터 선택한 연마 조성물.18. The polishing composition of claim 17 wherein the acid is selected from the group consisting of hydrochloric acid, nitric acid, phosphoric acid and sulfuric acid. 제6항에 있어서, 두개 이상의 염이 연마되는 금속 표면상에서 단일 염을 사용하는 방법과 비교하여 상승연마 효과를 제공하는 방법.The method of claim 6, wherein the method provides a synergistic effect as compared to the use of a single salt on a metal surface on which at least two salts are to be polished. 제14항에 있어서, 두개 이상의 염이 연마되는 금속 표면상에서 단일 염을 함유하는 조성물과 비교하여 상승 연마 효과를 제공하는 연마 조성물.15. The polishing composition of claim 14 wherein the two or more salts provide a synergistic polishing effect as compared to a composition containing a single salt on the metal surface to be polished. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019900011562A 1989-07-31 1990-07-30 Method and composition for polishing metal surface KR0165107B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/387474 1989-07-31
US387,474 1989-07-31
US07387474 US4959113C1 (en) 1989-07-31 1989-07-31 Method and composition for polishing metal surfaces

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KR910003065A true KR910003065A (en) 1991-02-26
KR0165107B1 KR0165107B1 (en) 1999-03-20

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US (1) US4959113C1 (en)
EP (1) EP0411413B1 (en)
JP (1) JP2937264B2 (en)
KR (1) KR0165107B1 (en)
AT (1) ATE147423T1 (en)
CA (1) CA1331521C (en)
DE (1) DE69029616T2 (en)
SG (1) SG90007A1 (en)

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