JPH0719147Y2 - Semiconductor element resin sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to improvement of a resin sealing device for semiconductor elements,
In particular, the overall structure is improved to simplify the configuration of the device and reduce the size thereof, and further, the fixed mold and the movable mold are detachably fitted to both the fixed mold part and the movable mold part, respectively, The present invention relates to a device in which each pitch interval of each plunger supported by a plunger holder is configured to be changeable and adjustable to improve the handleability and workability of the device.

(Prior Art) Conventionally, the structure of a resin sealing device for a semiconductor element is roughly divided into a fixed upper mold part 1, a movable lower mold part 2 and a resin pressure mechanism part 3 as shown in FIG. (For example, Japanese Utility Model Publication No. 61-92055).

Further, the fixed upper mold part 1 includes a plate 4 for mounting on the fixed platen 4a, an upper mold plate 6 fixed to the lower part of the fixed platen via a spacer block 5, and an upper plate fixed to the lower part of the plate. The mold 7 and the upper ejector plate 9 fitted in the spacer 8 provided by the spacer block 5
Etc. are provided.

Further, the movable lower mold part 2 includes a plate 10 for mounting on a movable platen 10a which is vertically moved by a hydraulic mechanism and the like, and a lower mold plate 12 fixed to the upper part of the movable platen via a spacer block 11. Spacer block 13 on top of the plate 12
There is provided a lower mold plate 14 fixed via the lower mold 15, a lower mold 15 fixed to the upper portion of the plate 14, a lower ejector plate 17 fitted in a space 16 provided by the spacer block 13, and the like.

In addition, the resin pressing mechanism section 3 includes the mounting plate.
Cylinder piston mechanism such as hydraulic pressure stuck to the bottom of 10 18
And a plunger holder 20 fixed to the piston rod of the mechanism 18 and installed inside a space 19 provided by the spacer block 11, and a lower end portion of the plunger holder 20.
It is supported by 20 and its upper end is a lower mold mounting plate.
A plunger 22 and the like, which penetrates the ejector plate 17, the lower mold plate 14, and fits in the pot 21 of the lower mold 15, are provided.

In order to mold a semiconductor element with resin using such an apparatus, first, the upper and lower molds (7, 15) are opened, and then the parting line (P, L) surfaces of both molds are opened. The lead frame is set at a predetermined position, then the mold 21 is clamped by supplying a resin material into the pot 21, and then the cylinder piston mechanism 18 moves the plunger 22 upward. Material is heater heating and plunger 22
While being melted by the pressurizing force, the liquid is pressurized and injected into the cavity 24 through the transfer passage 23 including the cull portion and the gate.

Therefore, the semiconductor element on the lead frame set in the cavity 24 is sealed by the resin filled in the cavity 24.

(Problems to be Solved by the Invention) In the configuration of such a conventional apparatus, the fixed upper mold part 1, the movable lower mold part 2, and the resin pressure mechanism part 3 are integrally configured as one set. Therefore, there were the following problems.

That is, the overall configuration of the device is complicated, the overall configuration of one set is enlarged, and the assembly and disassembly work of the device requires labor.

In particular, since the cylinder piston mechanism 18 in the resin pressure mechanism section 3 is fixed to the mounting plate 10 for the movable platen 10a, it must move up and down at the same time as the movable lower die section 2 moves up and down. The plunger holder 20 of the resin pressurizing mechanism 3 is fitted in the space 19 formed by the spacer block 11. Further, the plunger 22 is always provided in the pot 21 of the movable lower mold part 2. The assembly and disassembly work of the device was extremely troublesome because of the mated configuration.

Further, since it is necessary to fix the spacer block 11 having a required stroke height between the mounting plate 10 and the lower die mounting plate 12, there is a problem that the movable lower die section 2 becomes heavy.

Further, the total weight of the movable lower mold part 2 is a large weight including the weight of the movable lower mold part 2 and the weight of the resin pressure mechanism part 3 integrated with the movable lower mold part 2, so that the movable platen 10a is clamped. For this reason, it is necessary to use a large-sized hydraulic mechanism or the like to be moved up. Therefore, there is a problem that the entire structure of the apparatus becomes complicated and large, and the weight becomes heavy.

According to the present invention, the resin pressurizing mechanism section is separated from the fixed or movable mold sections so as to be simplified and downsized, and the assembling / disassembling operation of the apparatus can be facilitated. The fixed mold and the movable mold are detachably fitted to both the mold parts on the side and the movable side, respectively, and the pitch intervals of the plungers supported by the plunger holders are configured to be changeable and adjustable. An object of the present invention is to provide a resin encapsulation device for semiconductor elements, which can improve the handleability and workability of the device.

(Means for Solving Problems) A resin encapsulation device for a semiconductor element according to the present invention for solving the above-described conventional problems is provided with a fixed mold portion 101.
And the movable mold part 102 arranged to face the fixed mold part.
And a required plurality of pots 109 arranged in the mold part on either the fixed side or the movable side, and a resin pressurizing mechanism part 103 for pressurizing the resin material supplied into each pot. Cylinder piston mechanism in which the above-mentioned resin pressure mechanism part is separated from both the fixed side and movable side mold parts (101, 102) and mounted on the fixed frame 104 side. 125, a plunger holder 127 mounted on the piston rod 126 of the cylinder piston mechanism, and a base end portion (128a) supported by the plunger holder and a tip end portion (128b) thereof fitted into each of the pots. It is made up of a resin pressurizing plunger 128 that is fitted together and whose pitch intervals can be changed and adjusted. Furthermore, it is fixed to both the fixed side and movable side mold parts (101 and 102). Removable and removable mold and movable mold It is characterized in that constructed by.

(Operation) According to the configuration of the present invention, both the fixed side and movable side mold parts (10
1 ・ 102) and the resin pressure mechanism section 103 are separated and independent, and the overall structure of the device is roughly divided into a fixed side mold section 101, a movable side mold section 102, and a resin pressure mechanism section 103. It has a simple configuration.

Further, since the fixed mold and the movable mold can be detachably fitted to both the fixed-side and movable-side mold parts (101 and 102), for example, in the case of high-mix low-volume production, etc.
The fixed mold and the movable mold can be replaced quickly and efficiently.

Further, by arranging the pitch intervals of the plungers 128 so that they can be changed and adjusted, the pitch intervals of the plungers 128 can be appropriately adjusted after the mold (108/118) is replaced. Each plunger 128 can be used as it is as each exchange-type plunger.

(Example) Next, this invention is demonstrated based on an Example figure.

1 and 2 show a first embodiment of the present invention.

In each of the illustrated semiconductor element resin sealing devices, a fixed-side mold section 101, a movable-side mold section 102 that is disposed above the fixed-side mold section 101 so as to face each other, and a fixed-side mold section 101 are provided. It is composed of a resin pressure mechanism section 103 provided in the lower part.

Further, in the fixed side mold portion 101, a spacer block 106 fixed to the fixed plate 105 of the fixed frame 104, a lower mold plate 107 fixed to the upper part of the spacer block, and fixed to the upper part of the lower mold plate. The lower die 108, a plurality of required resin material supply pots 109 arranged in the lower die, a required number of cavities 110 formed on the parting line surface in the peripheral portion of the pot, and the spacer block 106. A lower ejector plate 112 and the like fitted in a space 111 to be accommodated is provided.

In addition, in the movable side mold part 102, a movable plate 115 provided so as to move up and down by a hydraulic mechanism 114 fixed to an upper fixed plate 113 of a fixed frame 104, and a spacer block fixed to a lower part of the movable plate. 116, an upper mold plate 117 fixed to the lower part of the spacer block, an upper mold 118 fixed to the lower part of the upper mold plate, and a position corresponding to the lower mold pot 109 on the parting line surface of the upper mold. Provided by the spacer block 116, the upper mold cavity 120 arranged at a position corresponding to the lower mold cavity 110, the gate 121 connecting the upper mold cavity and the cull part, and the spacer block 116. The upper ejector plate 123 and the like fitted in the space 122 to be accommodated are provided.

Further, the fixed frame 1 is attached to the resin pressing mechanism 103 described above.
04 A cylinder piston mechanism 125 driven by oil or air fixed to a mounting plate 124 at the bottom, a plunger holder 127 mounted on a piston rod 126 of the mechanism 125, and a base end 128a on the plunger holder 127. A resin pressurizing plunger 128 and the like for supporting and fitting the tip end portion 128b thereof into the lower mold pot 109 are provided.

Further, a plurality of pots 109 and plungers 128 are arranged for the purpose of molding a resin-sealed molded product having high quality and high reliability and effectively utilizing a resin material.

Further, each of the plunger base end portions 128a is supported by the plunger holder 127, and they are fitted so as to be slidable in the thrust direction (vertical axis direction) individually. Further, due to the elasticity of the compression spring 129 installed inside the plunger holder 127,
That is, the elastic pressing force in the direction of being press-fitted into the upper pot 109 is individually applied.

This type of device is called a multi-pot plunger type and each plunger 128 is
Since it is possible to apply uniform pressure to the resin material supplied to the inside of the 09, it is called an equal pressure method or an equal pressure method, and the semiconductor element is made of a thermosetting resin material such as epoxy resin. Suitable when used for sealing.

Next, the operation and effect based on the configuration of the first embodiment described above will be described. First, the movable platen 115 is moved upward by the hydraulic mechanism 114 to open the upper and lower molds (118, 108).

Next, while supplying a lead frame (not shown) to a predetermined position on the parting line surface of the lower mold 108,
A resin material (not shown) is supplied into each pot 109 to perform mold clamping (see FIG. 1). At this time, the semiconductor element mounted on the lead frame is divided into upper and lower mold cavities (12
The resin material in each pot 109 is heated and melted by heaters (not shown) provided in both upper and lower molds.

Next, when each plunger 128 is moved upward by the cylinder piston mechanism 125, the resin material in each pot 109 is respectively heated and pressed to be melted, and the molten resin material is transferred to the upper mold 118 surface. Immediately under pressure is injected into both cavities (120, 11) through the cull portion 119 and the gate 121 (passage for transferring molten resin). Therefore, the semiconductor elements on the lead frames fitted and set in the upper and lower cavities are sealed by the resin filled in the cavities.

For a resin-sealed molded product (not shown), after a lapse of a predetermined time, the molds (118, 108) are opened again and both ejector plates (123, 112) are moved downward and upward. , These ejector pins (123a and 112a) can be used to take out between the two molds.

By the way, although a thermosetting material such as epoxy resin is used as the resin material, it is preferable that the resin material is injected and filled into the cavity as soon as it is melted by heating because of its property.

That is, in order to prevent damage to the semiconductor element set in the cavity and the wire that electrically connects the semiconductor element and the external lead, it is necessary to inject and fill the molten resin in a short time when the molten resin has a low viscosity. In the multi-pot plunger type, since the resin material in each pot 109 is melted and immediately injected into the cavity (120, 110) through a short resin passage called the cull portion 119 and the gate 121,
Such molding conditions can be satisfied.

Further, since the amount of the resin material that cannot be recycled due to the thermosetting is a small amount corresponding to the above-mentioned short resin passage, the resin material can be effectively used.

Furthermore, since each plunger 128 can move backward (downward in the illustrated example) against the elasticity of the spring 129, even if the amount of resin material supplied to each pot 109 varies, When the resin material is pressed (moved upward), the resin material in each pot 109 can be simultaneously and evenly pressed by sliding to a position corresponding to the supplied amount.

Therefore, the operations of heating and melting the resin material and injecting pressure into the cavity are performed under uniform conditions, respectively, and the resin sealing with uniform and high quality and high reliability is achieved. Molded articles can be formed.

FIGS. 3 to 5 show a second embodiment of the present invention. For the purpose of downsizing the apparatus and facilitating assembly / disassembly work, in particular, for both fixed side and movable side mold parts, The upper die (movable die) and the lower die (fixed die) are detachably fitted, and the upper and lower ejector plates are detachably fitted to the upper die and the lower die, respectively. ing.

That is, the fixed base 130 is fixed to the upper part of the fixed plate 105, and the fitting base 131 is formed in the fixed base 130.
Further, the lower ejector plate 112 is integrally mounted on the bottom surface of the lower mold 108 via the holder 132, and further, the lower mold 108 is attached.
An integral structure of the lower ejector plate 112 and the lower ejector plate 112 is detachably fitted and attached to the fitting recess 131. In the figure, reference numeral 133 is a fixing bolt, and reference numeral 1
Reference numeral 34 is a returning spring, and reference numeral 135 is an ejector bar.

Further, the configuration of the movable-side mold section 102 has the same arrangement configuration.

That is, the movable base 136 is fixed to the lower part of the movable plate 115, and the fitting recess 137 is formed in the movable base 136.
Further, the upper ejector plate 123 is integrally mounted on the upper surface of the upper mold 118 via the holder 138, and further, the integrated structure of the upper mold 118 and the upper ejector plate 123 can be detachably attached to the fitting recess 137. It is configured by being fitted and attached to.

Further, the above-mentioned both molds 108 and 118 and both ejector plates 112 and 123 configured as an integrated structure are suitable, for example, in the case where they are frequently replaced for molding a variety of small quantities of resin-sealed molded products. ing. At this time, a problem may occur in which the pitch interval of each plunger 128 after replacement does not match the one before replacement, but in such a case, the pitch interval of each plunger 128 is
For example, while using a hole (not shown) for regulating the pitch interval formed in the lid body 127a of the plunger holder 127 to adjust and change, the fixed plate 105, the fixed side base 130, the holder 132, the lower ejector plate 112. In addition, the elongated holes 139 and the like that can freely adjust the pitch interval of each plunger 128 described above may be provided.

Since other configurations are substantially the same as those of the previous embodiment, the corresponding components are designated by the same reference numerals as those of the previous embodiment.

Further, the operation and effect of this embodiment are similar to those of the previous embodiment, but are excellent in that the mold parts 101 and 102 can be easily replaced and the overall shape (especially in the vertical direction) can be further downsized. There is.

The plunger holder 127 may be configured to apply a fluid pressure such as oil pressure or air pressure, and the spring 129 may be omitted, or the fluid pressure and the spring may be omitted. You may employ | adopt the structure which acts simultaneously with 129.

Further, a heater or a heating means (not shown) such as oil may be attached to the upper and lower bases 130 and 136 shown in FIG.
Further, the upper and lower molds 118 and 108 may be provided with a dedicated heating means (not shown).

Further, the integrated structure composed of the lower mold 108, the lower ejector plate 112, and the holder 132 shown in FIG. 3 is detachable from the base 130 by retracting the plunger holder 127 and each plunger 128 downward. Becomes As a concrete means, for example, the plunger 12
By setting the vertical stroke of 8 to be long, each plunger 128 may be lowered to a predetermined position. Further, as shown in FIG. 6, the plunger tip 12
If the 8b is configured to be detachable, the length of each plunger 128 can be shortened by removing the tip portion 128b.
You may make it attach or detach with respect to.

Further, as described above, when the lower mold 108 is exchanged, the pitch intervals of the lower mold pots 109 of the plungers 128 change, and therefore the pitch intervals of the plungers 128 before the change do not match. Sometimes. Therefore, in order to change the pitch interval of each plunger 128, as described above, by using the lid body (not shown) having the plunger support holes equal to the pitch interval in each pot after replacement, Each of the plungers 128 and the plunger holder 127 can be adapted for the lower mold after replacement.

However, it may be possible to improve the overall work efficiency by simultaneously replacing the plunger and the plunger holder corresponding to the pot pitch interval after replacement, rather than changing and adjusting the plunger pitch interval. . Sixth
With this intention, FIGS. 7 and 7 show the plunger 128.
Also, the plunger holder 127 itself is shown so that it can be easily replaced.

That is, the engaging grooves 127b in the horizontal direction are formed on the left and right side surfaces of the plunger holder 127 described above, and the mounting member 140 of the plunger holder 127 fixed to the upper end of the piston rod 126 of the cylinder piston mechanism 125 includes
A ridge (projection body) 140a that engages with the above-described engagement groove 127b is formed, and therefore, by sliding the plunger holder 127 in the front-rear horizontal direction with respect to the mounting member 140, both It is configured so that it can be freely engaged and disengaged. In this case, in order to prevent the mounting member 140 from rotating in the circumferential direction of the piston rod 126, for example, an appropriate detent member (not shown) is mounted between the piston rod 126 and the cylinder portion. It is preferable.

Further, each plunger 128 is reciprocated up and down by vertically moving the piston rod 126. At this time, the tip end portion 128b of each plunger is closely fitted in each pot 109, and further, each plunger 128 can be moved downward individually against the elasticity of each spring 129. Has become. Therefore, for example, due to rattling between the pots 109 and the plunger tip portions 128b or other improper adjustments, the sliding between the pots 109 and the plunger tip portions 128b is smooth. If this is not the case, there will be a serious adverse effect on the molding such that the pressure of the resin material by each plunger 128 is insufficient.

That is, the sliding action between each plunger 128 and each pot 106,
In particular, when the upper movement of each plunger 128 is not completed even though the elasticity of the spring 129 is added, the interior of the pot 109 is designed to evenly press the resin material supplied to each pot 109. The elasticity of the springs 129 causes the plungers 128 to move downward relative to each other, which in turn causes the insufficient pressurizing force.

In order to eliminate such an adverse effect, for example, as shown by a chain line in FIG. 7, it is possible to mount a vertical guide rod 141 on the side portion of the plunger holder 127. However, in this case, each plunger tip
Similar to the fitting of 128b and each pot 109, rattling or twisting between the guide rod 141 and the guide hole 142 provided on the holder side is likely to occur. There is an adverse effect that the effect of the jar holder 127 as a guide mechanism cannot be sufficiently obtained.

6 and 7 show a structure capable of improving the vertical guide function of the plunger 128 and the plunger holder 127. That is, the plunger 12
Since the cause of rattling or twisting between the pot 8 and the pot 109 often occurs because the plunger holder 127 is not reciprocally moved in parallel in the vertical direction, the holder 127 is provided so as to reciprocate in parallel. .

The parallel reciprocating mechanism 143 is a rack 144 in the vertical direction fixed to the front and rear positions on the left and right side surfaces of the mounting member 140 of the plunger holder described above, and a rotary shaft 145 properly mounted at the front and rear horizontal height positions. The pinion 1 fixed to the rotary shaft 145 and engaged with the front and rear racks 144.
It consists of 46 and. Therefore, according to such a parallel reciprocating mechanism 143, when the mounting member 140 (that is, the plunger holder 127) is moved up and down, the pinions 146 engaged at the front and rear positions on the left and right side surfaces thereof simultaneously rotate. Since the front and rear and left and right side surfaces of the mounting member 140 are supported by the mounting member 140, the vertical parallel reciprocating movement can be performed reliably and smoothly. The rack 144 and the pinion 146 of the parallel reciprocating mechanism 143 may be arranged on both front and rear surfaces of the mounting member 140 (not shown), and either one of the left and right side surfaces or the front and rear side surfaces may be disposed. Instead of the rack and pinion of No. 1, a configuration (not shown) in which a sliding roll is slid on their side surfaces may be adopted.

In addition, each tip 109 of each plunger is attached to each lower pot 109.
Since it is necessary to tightly fit 28b, a sleeve-shaped pot bush (see FIG. 1 etc.) formed separately is fitted in the mounting hole provided in the lower mold 108. However, the pot bush tends to be formed in a thin shape in order to dispose the position of the pot 109 and the position of the cavity 110 as close as possible. Therefore, in the die processing, the manufacturing of the pot bush is troublesome and time-consuming, and it is a factor of increasing the overall cost. In order to eliminate such an adverse effect, it is possible to directly process each pot 109 on the lower mold 108, but in this case, there is a problem in abrasion resistance of the pot portion. 10th
The lower mold pot 151 shown in FIG. 11 and FIG. 11 shows an example of the structure of a lower mold that can solve such problems.

That is, the insertion hole 147 of the plunger tip portion 128b is formed at a predetermined position of the lower mold 108, and the fitting recess 149 of the pot block 148 is formed at the upper position of the insertion hole 147. As shown in FIG. 11, the fitting recess 149 is formed in the front-rear direction at the center between the pair of left and right cavities 110. Further, both the pot block 148 and the fitting recess 149 are engaged by an engaging means such as a dovetail groove, and the pot block 148 is slidable in the front-back direction along the fitting recess 149. Therefore, it is configured to be detachable. Further, the pot blocks 148 are fixed plates 150 fixed to the front and rear ends of the fitting recess 149.
-It is provided so that it can be mounted at a predetermined fitting position by 150 (Note that the pot block 148 has a fitting recess 149).
It may be detachably attached with a bolt or the like). Further, at predetermined positions of the pot block 148, pots 151 corresponding to the number of each plunger 128 are formed. Furthermore, since the pot block 148 is formed of a cemented carbide having high hardness and wear resistance, the pot 151 itself has wear resistance.

The pot block 148 and other worn parts may be subjected to a surface hardening treatment.

For example, electroless plating or the like in which nickel and these fine particles are compositely co-deposited at a fixed ratio while suspending and dispersing insoluble fine particles having wear resistance or self-lubricity in a normal hard chrome plating or electroless plating bath is performed. You may do it.

Further, as described above, the resin material in each pot 109 is
Both cavities undergoing heating and pressurization while being melted
The semiconductor element, which is injected and filled in the 110 and 120 and set in both cavities, is sealed.

By the way, in the multi-pot plunger type, since the molten resin material is transferred under pressure from the pot 109 into both the cavities 110 and 120 only through the short passages such as the cull portion 119 and the gate 121, it has been described above. like,
It is suitable for resin encapsulation of semiconductor elements using thermosetting resin materials.

Since the action of pressurizing and injecting this molten resin material into both the cavities 110 and 120 is due to the upward movement of the plunger 128, the injection speed is determined by the resin pressure (resin pressure) due to the upward movement of the plunger 128. It can be adjusted by adjusting. By adjusting this injection speed (resin pressure) under constant conditions and under the multi-pot plunger type, the following extremely ideal resin sealing action and effect can be obtained. To be

That is, when the injection speed is high, the gate opening 121a
Since the molten resin material is injected into both cavities 110 and 120 so as to eject from (see FIG. 12), the injected resin entrains the air near the gate opening 121a and the gate opening of the resin molding (package). An unfilled part (a gate opening void or a defective part) is formed in the corresponding part, and both cavities 11
A vortex flow of the molten resin material is generated in 0.120 and the residual air is entrained, and the air forms voids inside and on the surface of the resin molded body, and further, the semiconductor element mounted on the lead frame. Thin wire that connects the lead to the external lead
There is an adverse effect of deforming and breaking the 152. Such an adverse effect can be eliminated by adjusting the injection speed.

For example, as shown in FIG. 12, the injection speed of the molten resin material injected through the gate opening 121a is set to the range (and time T ₁ ) at which the molten resin material is completely filled near the gate opening 121a, and the wire. Injection is performed relatively slowly in the range (and time T ₃ ) filled near 152, and comparison is made in the range (T ₂ · T ₄ ) other than these ranges (T ₁ · T ₃ ). The multi-stage inflow method, which is to inject so as to be faster, may be performed.

Such a multi-step injection method uses a pot 109 and both cavities 110.
・ 120 and gate 121 only (as described above, cull part 119
Also, a very effective action and effect can be obtained under a multi-pot plunger type which is communicated via a short resin passage such as a gate 121).

That is, in the multi-pot plunger type, as described above, the required number of cavities 110 and 120 are arranged at predetermined positions around each pot 109, and the gates having the same length are provided between the pots 109 and cavities. Since the structure is such that only the 121 (short resin passage) communicates with each other (see FIG. 13), the molten resin material is pressurized and injected into each of the cavities 110 and 120 under exactly the same setting conditions. Because it will happen. Therefore, since the above-described multi-step injection method can be performed simultaneously and under the same conditions in each cavity 110/120, it is possible to form a uniform resin-sealed molded product having high quality and high reliability. .

In the so-called one-pot / one-plunger type, for example, as shown in FIG. 14, there are long main runners C and auxiliary runners D between the large pot A and each cavity B. That the injection time of the molten resin material to be injected into the cavity B under pressure is different, and
In this case, even if the above-described multi-step injection method is performed, the injection conditions / states in the respective cavities B are different from each other, so there is practically no point in adopting the multi-step injection method. Cavity B ₁ farthest from the position of pot A because it is accelerated by the course of
Then, the harmful effects such as the non-filling of the cavity occur.

Further, when the electroless plating described above is performed on the surface on which the cavities 110 and 120 are formed, lubricity is imparted to the cavity surface, so that the resin-sealed molded product is formed into the cavities 110 and 120.
There is an advantage that the protruding action for taking out from the inside, that is, the releasing property of the resin-sealed molded product can be improved.

(Effect of the Invention) According to the present invention, by separating the resin pressure mechanism part from both the fixed and movable mold parts, the overall structure of the device can be significantly simplified compared to the conventional one. At the same time, there is an excellent practical effect that the entire structure can be downsized and the assembling / disassembling work can be facilitated.

Further, according to the present invention, the fixed mold and the movable mold are detachably fitted to the fixed mold part and the movable mold part, respectively. Also, there is an excellent practical effect that the movable die can be replaced quickly and efficiently.

Further, according to the present invention, compared with the conventional structure in which the resin pressurizing mechanism section and the spacer block for mounting the resin pressing section are mounted, the overall weight of the mold section is remarkably reduced and the durability of the mold section is reduced. Of the cylinder piston mechanism such as hydraulic pressure can be miniaturized.

Further, according to the present invention, since the pitch intervals of the plungers supported by the plunger holders can be changed and adjusted, each plunger can be used as it is as each exchangeable plunger. It is possible to provide a resin encapsulating device for a semiconductor element, which can improve the easiness of handling and the workability of the device, and has an excellent practical effect.

[Brief description of drawings]

1 and 2 show a first embodiment of the present invention. FIG. 1 is a schematic overall front view of a resin encapsulation device for semiconductor elements, and FIG. 2 is a schematic side view of its main part. is there. FIGS. 3 to 5 show a second embodiment of the present invention. FIG. 3 is a schematic front view of a resin encapsulating apparatus for semiconductor elements, and FIG. 4 is a part of a fixed side mold part thereof. FIG. 5 is a partially cutaway side view showing the fixed side mold part in an exploded manner. FIG. 6 and FIG. 7 are a partially cutaway front view and a partially cutaway side view showing another configuration example of the resin pressure mechanism portion in an enlarged manner. FIG. 8 and FIG. 9 are an enlarged cross-sectional view and a bottom view of a central vertical section of the upper die. FIG. 10 and FIG. 11 are a central longitudinal enlarged cross-sectional view and another plan view showing another configuration example of the lower mold. 12 to 14 are explanatory views of the operation of the multistage injection method.
FIG. 12 is a schematic vertical sectional view of a main part of a mold, FIG. 13 is a schematic plan view of a main part of an upper mold, and FIG. 14 is a schematic plan view of another main part of a mold. FIG. 15 is a vertical cross-sectional view showing a main part of a conventional resin sealing device. (Explanation of symbols) 101 …… Fixed side mold section 102 …… Movable side mold section 103 …… Resin pressing mechanism section 104 …… Fixed frame 108 …… Lower mold (fixed type) 109 …… Pot 110 …… Cavity 112 …… Ejector plate 118 …… Upper mold (movable type) 119 …… Cull part 120 …… Cavity 121 …… Gate 123 …… Ejector plate 125 …… Cylinder piston mechanism 126 …… Piston rod 127 …… Plunger holder 128… … Plunger 128a …… Plunger base end 128b …… Plunger tip 131 …… Mating recess 137 …… Mating recess 143 …… Parallel reciprocating mechanism 147 …… Insertion hole 148 …… Pot block 149 ...... Mating recess 151 …… Lower pot

Claims (5)

[Scope of utility model registration request] 1. A fixed-side mold part, a movable-side mold part which is arranged to face the fixed-side mold part, and a plurality of required parts which are arranged on either the fixed-side or movable-side mold part. What is claimed is: 1. A resin sealing device for a semiconductor element, comprising: a pot; and a resin pressurizing mechanism part for pressurizing a resin material supplied into each pot, wherein the resin pressurizing mechanism part is provided on the fixed side and A cylinder piston mechanism that is separated from both movable mold parts and is mounted on the fixed frame side, a plunger holder that is mounted on a piston rod of the cylinder piston mechanism, and a base end part of which is supported by the plunger holder and its tip end. And a plunger for resin pressurization in which the pitch intervals of the pots can be changed and adjusted, and the fixed-side mold part and the movable-side mold part. In contrast, fixed type and acceptable Resin sealing apparatus for a semiconductor element characterized by being configured mold respectively detachably so fitted. 2. The resin encapsulation device for a semiconductor element according to claim 1, wherein the fixed type and the movable type are respectively provided with dedicated heating means. 3. An insertion hole for a plunger tip portion is formed at a predetermined position of a mold portion, a recess for fitting a pot block is formed in the insertion hole, and a pot is provided at a predetermined position of the recess. The resin encapsulation device for a semiconductor element according to claim 1, wherein the block is detachably mounted. 4. The resin encapsulation device for a semiconductor element according to claim 3, wherein the pot block is formed of a cemented carbide having high hardness and wear resistance. 5. The resin encapsulation device for a semiconductor element according to claim (1) or (4), characterized in that the wear portion is subjected to a surface hardening treatment.