KR910002013A - 양자-웰 방사 검출기 장치 - Google Patents
양자-웰 방사 검출기 장치 Download PDFInfo
- Publication number
- KR910002013A KR910002013A KR1019890007684A KR890007684A KR910002013A KR 910002013 A KR910002013 A KR 910002013A KR 1019890007684 A KR1019890007684 A KR 1019890007684A KR 890007684 A KR890007684 A KR 890007684A KR 910002013 A KR910002013 A KR 910002013A
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- South Korea
- Prior art keywords
- quantum
- well
- radiation detector
- detector device
- layer
- Prior art date
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- 230000005855 radiation Effects 0.000 title claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 claims 10
- 230000004888 barrier function Effects 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 239000011229 interlayer Substances 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- KWLSQQRRSAWBOQ-UHFFFAOYSA-N dipotassioarsanylpotassium Chemical compound [K][As]([K])[K] KWLSQQRRSAWBOQ-UHFFFAOYSA-N 0.000 claims 1
- 230000005284 excitation Effects 0.000 claims 1
- 239000003362 semiconductor superlattice Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
- H01L31/09—Devices sensitive to infrared, visible or ultraviolet radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/043—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14868—CCD or CID colour imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14875—Infrared CCD or CID imagers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Biophysics (AREA)
- Light Receiving Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Measurement Of Radiation (AREA)
Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 제1 제시된 실시예에 따른 방사 검출기의 개략 측면도,
제 2도는 전기적으로 바이어스되고 반도체 헤테로 구조체를 사용하는 것이 수행된 바와 같이 제1도의 방사 검출기에 대응하는 것과 같은 개략 에너지대 다이아그램도,
제 3도는 전기적으로 바이어스 되고 양자가 도프된 영역으로 잘 형성되어 있는 반도체 호모 구조를 사용하는 것이 수행된 바와 같이 제1도의 방사 검출기에 대응하는 것과 같은 개략 에너지대 다이아그램도,
Claims (10)
- 흥미있는 파장에서의 입사 전자 방사에 응답하는 전기 효과를 생성하는 검출기는, 접촉층(예컨대 12,14)간의 기판 지지 반도체 초격자(예컨대 13)를 구비하며, 상기 초격자(예컨대 13)는 층간 삽입지된 양자 웰(예컨대 21)과 장벽(예컨대 22)층을 구비하며, 상기 층으로 형성된 양자 웰은 가전자대 속박 에너지 상태(예컨대 24)를 가지며, 상기 양자 웰은 상기 방사에 의해 캐리어 여기용으로 적합하게 되어 있으며, 여기는 가전자대 속박 에너지 상태에서 가전자대 연속 에너지 상태이거나 그렇지 않으면 상기 전도대 속박 에너지 상태로부터 전도대 연속 에너지 상태중인 것을 구비하는 양자-웰 방사 검출기 장치에 있어서, 상기 장벽(예컨대 22)층의 두께는 상기 양자 웰(예컨대 21)층의 두께보다 암시적으로 훨씬 두꺼운 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제1항에 있어서,상기 장벽층의 두께는 상기 양자 웰층 두께의 3배보다 훨씬 두껍거나 같은 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제1항에 있어서,상기 파장은 3㎛보다 훨씬 길거나 같은 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제3항에 있어서,상기 파장은 3 내지 15㎛범위인 것을 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제1항에 있어서,상기 초격자는 상이한 재료의 층간 삽입지된 층을 구비하는 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제5항에 있어서,상기 초격자는 그룹IV반도체 재료를 구비하고 상기 양자 웰 층은 p-도프된 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제6항에 있어서,상기 검출기는 실리콘 반도체 소자로 모놀리스적으로 집적된 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제5항에 있어서, 상기 초격자는 그룹IIIV반도체 재료를 구비하고, 상기 양자 웰 층은 n-도프된 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제8항에 있어서, 상기 검출기는 칼륨 비소화 반도체 소자로 모놀리스적으로 집적된 것을 특징으로 하는 양자-웰 방사 검출기 장치.
- 제1항에 있어서, 상기 장치는 흥미있는 상이한 파장에 대응하는 것처럼 상기 검출기를 구비하는 스텍을 형성한 다수의 검출기를 구비하는 것을 특징으로 하는 양자-웰 방사 검출기 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20286088A | 1988-06-06 | 1988-06-06 | |
US202860 | 1988-06-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910002013A true KR910002013A (ko) | 1991-01-31 |
KR920009918B1 KR920009918B1 (ko) | 1992-11-06 |
Family
ID=22751541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890007684A KR920009918B1 (ko) | 1988-06-06 | 1989-06-05 | 양자-웰 방사선 검출 소자 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0345972B1 (ko) |
JP (1) | JPH0766980B2 (ko) |
KR (1) | KR920009918B1 (ko) |
CA (1) | CA1314614C (ko) |
DE (1) | DE68916867T2 (ko) |
ES (1) | ES2056218T3 (ko) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2671882B1 (fr) * | 1989-12-28 | 1993-05-28 | France Etat | Dispositif de conversion d'un rayonnement infrarouge en un autre rayonnement d'energie superieure a celle de ce rayonnement infrarouge. |
WO1992008250A1 (en) * | 1990-10-31 | 1992-05-14 | Martin Marietta Corporation | Miniband transport quantum well infrared detector |
JP2797738B2 (ja) * | 1991-03-15 | 1998-09-17 | 富士通株式会社 | 赤外線検知装置 |
US5272356A (en) * | 1991-11-12 | 1993-12-21 | Hughes Aircraft Company | Multiple quantum well photodetector for normal incident radiation |
US5223704A (en) * | 1992-03-31 | 1993-06-29 | At&T Bell Laboratories | Planar buried quantum well photodetector |
FR2724768B1 (fr) * | 1994-09-16 | 1997-01-24 | Sgs Thomson Microelectronics | Groupement en serie de thyristors photosensibles |
US5539206A (en) * | 1995-04-20 | 1996-07-23 | Loral Vought Systems Corporation | Enhanced quantum well infrared photodetector |
FR2756666B1 (fr) * | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques |
FR2756667B1 (fr) * | 1996-12-04 | 1999-02-19 | Thomson Csf | Detecteur d'ondes electromagnetiques bispectral |
US6054718A (en) * | 1998-03-31 | 2000-04-25 | Lockheed Martin Corporation | Quantum well infrared photocathode having negative electron affinity surface |
JP4029420B2 (ja) * | 1999-07-15 | 2008-01-09 | 独立行政法人科学技術振興機構 | ミリ波・遠赤外光検出器 |
JP4330210B2 (ja) | 1999-07-30 | 2009-09-16 | 富士通株式会社 | 光半導体装置及びその製造方法 |
JP2001044453A (ja) | 1999-07-30 | 2001-02-16 | Fujitsu Ltd | 光検出素子 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4688068A (en) * | 1983-07-08 | 1987-08-18 | The United States Of America As Represented By The Department Of Energy | Quantum well multijunction photovoltaic cell |
US4679061A (en) * | 1985-06-14 | 1987-07-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Superlattice photoconductor |
CA1282671C (en) * | 1985-11-18 | 1991-04-09 | John Condon Bean | Device having strain induced region |
US4711857A (en) * | 1986-08-28 | 1987-12-08 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Tailorable infrared sensing device with strain layer superlattice structure |
-
1989
- 1989-05-17 CA CA000599886A patent/CA1314614C/en not_active Expired - Fee Related
- 1989-05-25 ES ES89305313T patent/ES2056218T3/es not_active Expired - Lifetime
- 1989-05-25 EP EP89305313A patent/EP0345972B1/en not_active Expired - Lifetime
- 1989-05-25 DE DE68916867T patent/DE68916867T2/de not_active Expired - Fee Related
- 1989-06-05 KR KR1019890007684A patent/KR920009918B1/ko not_active IP Right Cessation
- 1989-06-06 JP JP1145036A patent/JPH0766980B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR920009918B1 (ko) | 1992-11-06 |
EP0345972B1 (en) | 1994-07-20 |
DE68916867T2 (de) | 1994-12-22 |
CA1314614C (en) | 1993-03-16 |
EP0345972A1 (en) | 1989-12-13 |
DE68916867D1 (de) | 1994-08-25 |
ES2056218T3 (es) | 1994-10-01 |
JPH0766980B2 (ja) | 1995-07-19 |
JPH0243777A (ja) | 1990-02-14 |
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