KR900018318A - 반도체다이 부착접착제용 고순도에폭시조성물 - Google Patents

반도체다이 부착접착제용 고순도에폭시조성물 Download PDF

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Publication number
KR900018318A
KR900018318A KR1019900006571A KR900006571A KR900018318A KR 900018318 A KR900018318 A KR 900018318A KR 1019900006571 A KR1019900006571 A KR 1019900006571A KR 900006571 A KR900006571 A KR 900006571A KR 900018318 A KR900018318 A KR 900018318A
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South Korea
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weight
epoxy
parts
adhesive
adhesive composition
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KR1019900006571A
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English (en)
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스티브 첸 에스.
쉬엔베르그 쥴레스
송박
Original Assignee
허버트 제이. 범가튼
내쇼날 스타치 앤드 케미칼 인베스트먼트 홀딩 코포레이숀
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Publication of KR900018318A publication Critical patent/KR900018318A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음

Description

반도체다이 부착접착제용 고순도에폭시조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 하나 이상의 경화가능한 에폭시화합물, 전도성 충진제 및 적합한 경화제로 이루어지는 에폭시를 기본구성으로 하는 다이 부착용 접착제 조성물에 있어서, 일반식,
    식중, R'는 C2-C20직쇄 또는 분기상 또는 환상포화 또는 불포화 탄화수소, R은 에테르결합을 가지는 선형탄화수소 또는 술폰. 설파이드, 포스포네이트, 포스핀 옥사이드, 실란, 또는 실록산으로 치환된 선형탄화수소, 바람직하게는 에테르결합을 가지는 선형 탄화수소, X는 O, NH, 또는 NR", R"는 C1-C10알킬, 알케닐 또는 아릴, n은 최소한 1이상의 카르복실기로 종결된 중합체로 이루어지는 에폭시 변형제의 유효량을 상기 접착제에 첨가하여 저점도이며 열적사이클에 대하여 안정된 다이 부착용 접착제를 얻는 것을 특징으로 하는 에폭시를 기본구성으로 하는 다이부착용 접착제 조성물.
  2. 제1항에 있어선, 상기 카르복실기로 종결된 중합체는 에폭시와 미리 반응시키는 것을 특징으로 하는 에폭시를 기본구성으로 하는 다이 부착용 접착제 조성물.
  3. 제1항에 있어서, 상기 카그복실기로 종결된 중합체는 구조식.
    식중, R'는 C2-C20직쇄 또는 분기상 또는 환상포화 또는 불포화 지방족 또는 방향족 탄화수소, R은 선형 폴리에테르, X는 0인 것을 특징으로 하는 에폭시를 기본 구성으로 다이 부착용 접착제 조성물.
  4. 제3항에 있어서, 상기 선형 폴리에테르는 약 500 내지 5000의 분자량을 가지는 것을 특징으로 하는 에폭시를 기본 구성으로 하는 다이 부착용 접착제 조성물.
  5. 제1항에 있어서, 100-125중량부의 하나 또는 그 이상의 에폭시 화합물, 3-50중량부의 카르복실기로 종결된 중합체 변형제, 0-20중량부의 경화제, 2.5-10중량부의 촉매, 0-2중량부의 접착족진제 및 300-650 중량부의 전도성 충진제를 포함하는 것을 특징으로 하는 에폭시를 기본 구성으로 하는 다이 부착용 접착제 조성물.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019900006571A 1989-05-12 1990-05-10 반도체다이 부착접착제용 고순도에폭시조성물 KR900018318A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/350,987 US4975221A (en) 1989-05-12 1989-05-12 High purity epoxy formulations for use as die attach adhesives
US350,987 1989-05-12

Publications (1)

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KR900018318A true KR900018318A (ko) 1990-12-21

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KR1019900006571A KR900018318A (ko) 1989-05-12 1990-05-10 반도체다이 부착접착제용 고순도에폭시조성물

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US (1) US4975221A (ko)
EP (1) EP0397010A1 (ko)
JP (1) JP2695273B2 (ko)
KR (1) KR900018318A (ko)

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Also Published As

Publication number Publication date
EP0397010A1 (en) 1990-11-14
US4975221A (en) 1990-12-04
JP2695273B2 (ja) 1997-12-24
JPH02311588A (ja) 1990-12-27

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