KR900015270A - Si 웨이퍼, 더욱 특히 반도체 소자용 세척욕을 안정화시키는 방법 - Google Patents
Si 웨이퍼, 더욱 특히 반도체 소자용 세척욕을 안정화시키는 방법 Download PDFInfo
- Publication number
- KR900015270A KR900015270A KR1019900003867A KR900003867A KR900015270A KR 900015270 A KR900015270 A KR 900015270A KR 1019900003867 A KR1019900003867 A KR 1019900003867A KR 900003867 A KR900003867 A KR 900003867A KR 900015270 A KR900015270 A KR 900015270A
- Authority
- KR
- South Korea
- Prior art keywords
- stabilizing
- wafers
- semiconductor devices
- cleaning bath
- bath
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims description 3
- 238000000034 method Methods 0.000 title claims 6
- 230000000087 stabilizing effect Effects 0.000 title claims 2
- 235000012431 wafers Nutrition 0.000 title description 3
- 239000004065 semiconductor Substances 0.000 title 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 claims 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D21/00—Control of chemical or physico-chemical variables, e.g. pH value
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/01—Hydrogen peroxide
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B15/00—Peroxides; Peroxyhydrates; Peroxyacids or salts thereof; Superoxides; Ozonides
- C01B15/01—Hydrogen peroxide
- C01B15/037—Stabilisation by additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Weting (AREA)
- Detergent Compositions (AREA)
Abstract
내용 없음.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 Si 웨이퍼 및 참조 전극을 갖는 세척욕을 나타낸다.
제2도는 세척조작중 참조 전극에 관한 Si 웨이퍼의 전위의 시간에 따른 변화를 나타낸다.
Claims (5)
- 알칼리성 세척욕중 참조 전극에 관한 Si 웨이퍼의 전위를 전위가 더욱 음의 값으로 크게 이동할 경우 다시 상승하는 욕중 H2O2농도로 측정함을 특징으로 하여, Si 웨이퍼, 더욱 특히 반도체 소자용, 과산화수소(H2O2)를 함유하는 알칼리성 세척욕을 안정화시키는 방법.
- 제1항에 있어서, 측정된 전위가 매 30초마다 적어도 400mv내지 더욱 음의 값으로 변화할 경우, H2O2농도가 증가됨을 특징으로 하는 방법.
- 제1항 또는 2항에 있어서, 약5:1:1의 용적비로 H2O. NH4OH(25%) 및 H2O2(30%)함유하는 세척욕을 사용함을 특징으로 하는 방법.
- 제1항 내지 3항중 어느 한 항에 있어서, 세척욕의 pH 값을 10내지 14. 바람직하게는 11로 조절함을 특징으로 하는 방법.
- 제1항 내지 4항중 어느 한 항에 있어서, 참조 전극으로 포화 칼로멜 전극을 사용함을 특징으로 하는 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3909915A DE3909915A1 (de) | 1989-03-25 | 1989-03-25 | Verfahren zum stabilisieren von reinigungsbaedern fuer si-scheiben, insbesondere fuer halbleiterbauelemente |
DEP3909915.6 | 1989-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR900015270A true KR900015270A (ko) | 1990-10-26 |
Family
ID=6377243
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019900003867A KR900015270A (ko) | 1989-03-25 | 1990-03-22 | Si 웨이퍼, 더욱 특히 반도체 소자용 세척욕을 안정화시키는 방법 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0390254A3 (ko) |
JP (1) | JPH02298032A (ko) |
KR (1) | KR900015270A (ko) |
DE (1) | DE3909915A1 (ko) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55154452A (en) * | 1979-05-18 | 1980-12-02 | Seiko Kakoki Kk | Concentration controlling method of halogen acid salt |
JPS61294824A (ja) * | 1985-06-21 | 1986-12-25 | Nec Corp | 半導体集積回路の製造装置 |
DE3738651A1 (de) * | 1987-11-13 | 1989-05-24 | Wacker Chemitronic | Verfahren zur hydrophilierenden und/oder kittreste entfernenden oberflaechenbehandlung von siliciumscheiben |
-
1989
- 1989-03-25 DE DE3909915A patent/DE3909915A1/de not_active Withdrawn
-
1990
- 1990-03-20 EP EP19900200654 patent/EP0390254A3/de not_active Withdrawn
- 1990-03-22 KR KR1019900003867A patent/KR900015270A/ko not_active Application Discontinuation
- 1990-03-22 JP JP2069918A patent/JPH02298032A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPH02298032A (ja) | 1990-12-10 |
EP0390254A3 (de) | 1991-11-27 |
DE3909915A1 (de) | 1990-09-27 |
EP0390254A2 (de) | 1990-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |