KR900009397A - 집적 회로용 트레이 - Google Patents

집적 회로용 트레이

Info

Publication number
KR900009397A
KR900009397A KR1019890015492A KR890015492A KR900009397A KR 900009397 A KR900009397 A KR 900009397A KR 1019890015492 A KR1019890015492 A KR 1019890015492A KR 890015492 A KR890015492 A KR 890015492A KR 900009397 A KR900009397 A KR 900009397A
Authority
KR
South Korea
Prior art keywords
integrated circuit
circuit tray
tray
integrated
circuit
Prior art date
Application number
KR1019890015492A
Other languages
English (en)
Other versions
KR950011862B1 (ko
Inventor
도시히로 이또
데쯔지 오가와
시게노리 하마오까
Original Assignee
아사히 유끼자이 고교 가부시끼가이샤
이노우에 엠티피 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 유끼자이 고교 가부시끼가이샤, 이노우에 엠티피 가부시끼가이샤 filed Critical 아사히 유끼자이 고교 가부시끼가이샤
Publication of KR900009397A publication Critical patent/KR900009397A/ko
Application granted granted Critical
Publication of KR950011862B1 publication Critical patent/KR950011862B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H01L21/67336—Trays for chips characterized by a material, a roughness, a coating or the like
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dispersion Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Packaging Frangible Articles (AREA)
  • Containers Having Bodies Formed In One Piece (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
KR1019890015492A 1988-12-15 1989-10-27 집적 회로용 트레이 KR950011862B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP315071 1988-12-15
JP31507188A JPH0714744B2 (ja) 1988-12-15 1988-12-15 集積回路用トレー

Publications (2)

Publication Number Publication Date
KR900009397A true KR900009397A (ko) 1990-07-04
KR950011862B1 KR950011862B1 (ko) 1995-10-11

Family

ID=18061073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890015492A KR950011862B1 (ko) 1988-12-15 1989-10-27 집적 회로용 트레이

Country Status (3)

Country Link
US (1) US5104581A (ko)
JP (1) JPH0714744B2 (ko)
KR (1) KR950011862B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064528B1 (ko) * 2009-06-24 2011-09-14 주식회사 티씨케이 솔라셀 트래이 및 그 제조방법

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3174271B2 (ja) * 1995-07-27 2001-06-11 株式会社小糸製作所 ランプ反射鏡用成形組成物、それを用いたランプ反射鏡の製造方法及びランプ反射鏡
US6103818A (en) * 1998-08-07 2000-08-15 Mitsui Chemicals, Inc. Resin composition and heat-resistant, returnable IC tray obtained by molding the same
US6174427B1 (en) 1998-09-24 2001-01-16 The Dow Chemical Company Process for the preparation of electromotively coated filled thermoset articles
DE19927748C2 (de) * 1999-06-17 2001-05-17 Siemens Ag Transportvorrichtung für elektronische Bauelemente mit kontaminationsverhindernder Beschichtung
US6453760B1 (en) * 2000-07-03 2002-09-24 Advanced Micro Device, Inc. Automated detection of unacceptable warpage of trays for holding integrated circuit packages
WO2002024808A1 (en) * 2000-09-25 2002-03-28 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing
JP4931294B2 (ja) * 2001-07-09 2012-05-16 電気化学工業株式会社 Ｉｃ包装体
JP2006506278A (ja) * 2002-09-03 2006-02-23 エンテグリス・インコーポレーテッド 電子機器処理アプリケーションで使用するための高温高強度着色可能材料
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
US6926937B2 (en) * 2002-09-11 2005-08-09 Entegris, Inc. Matrix tray with tacky surfaces
CN1942304A (zh) * 2002-10-09 2007-04-04 诚实公司 用于设备处理系统的高温高强度可着色材料
KR100502562B1 (ko) * 2003-03-21 2005-07-20 서광석 트레이에 부피전도성을 부여하는 방법
TW200607039A (en) * 2004-07-06 2006-02-16 Dainichi Can Co Ltd Marking clip for IC tray
JP5221731B2 (ja) * 2011-10-11 2013-06-26 電気化学工業株式会社 Ｉｃ包装体
JP6116881B2 (ja) * 2012-12-07 2017-04-19 株式会社カネカ 絶縁ケース
US9824906B2 (en) * 2013-09-03 2017-11-21 Altera Corporation Methods and structures for handling integrated circuits

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58214210A (ja) * 1982-06-08 1983-12-13 大日本インキ化学工業株式会社 非帯電絶縁性組成物
JPS61285241A (ja) * 1985-06-13 1986-12-16 Matsushita Electric Works Ltd フエノ−ル樹脂成形材料
JPS61287951A (ja) * 1985-06-14 1986-12-18 Toshiba Chem Corp フエノ−ル樹脂組成物
US4715989A (en) * 1986-01-22 1987-12-29 The B.F. Goodrich Company Coating for EMI shielding
DE3619094A1 (de) * 1986-06-10 1987-12-17 Bayer Ag Kohlenstoff-haltige formkoerper
DE3626460A1 (de) * 1986-08-05 1988-02-11 Lehmann & Voss & Co Kunststoffmischung mit elektromagnetischen abschirmeigenschaften
JPH0733430B2 (ja) * 1987-05-30 1995-04-12 三井石油化学工業株式会社 エポキシ樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101064528B1 (ko) * 2009-06-24 2011-09-14 주식회사 티씨케이 솔라셀 트래이 및 그 제조방법

Also Published As

Publication number Publication date
KR950011862B1 (ko) 1995-10-11
US5104581A (en) 1992-04-14
JPH0714744B2 (ja) 1995-02-22
JPH02166082A (ja) 1990-06-26

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19980930

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee