KR900002436A - 전자소자의 고착방법 - Google Patents
전자소자의 고착방법Info
- Publication number
- KR900002436A KR900002436A KR1019890010016A KR890010016A KR900002436A KR 900002436 A KR900002436 A KR 900002436A KR 1019890010016 A KR1019890010016 A KR 1019890010016A KR 890010016 A KR890010016 A KR 890010016A KR 900002436 A KR900002436 A KR 900002436A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic devices
- fixing method
- fixing
- electronic
- devices
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2101/40—Semiconductor devices
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- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63-176386 | 1988-07-15 | ||
JP63176386A JPH0682697B2 (ja) | 1988-07-15 | 1988-07-15 | 電子素子の固着方法 |
JP1-65672 | 1989-03-17 | ||
JP1-65671 | 1989-03-17 | ||
JP1065671A JPH0758719B2 (ja) | 1989-03-17 | 1989-03-17 | 電子素子の固着方法 |
JP1065672A JPH0758720B2 (ja) | 1989-03-17 | 1989-03-17 | 電子素子の固着方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR900002436A true KR900002436A (ko) | 1990-02-28 |
KR920005801B1 KR920005801B1 (ko) | 1992-07-18 |
Family
ID=27298865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890010016A KR920005801B1 (ko) | 1988-07-15 | 1989-07-14 | 전자소자의 고착방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4927069A (ko) |
KR (1) | KR920005801B1 (ko) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5066614A (en) * | 1988-11-21 | 1991-11-19 | Honeywell Inc. | Method of manufacturing a leadframe having conductive elements preformed with solder bumps |
US5161729A (en) * | 1988-11-21 | 1992-11-10 | Honeywell Inc. | Package to semiconductor chip active interconnect site method |
US5121871A (en) * | 1990-04-20 | 1992-06-16 | The United States Of America As Represented By The United States Department Of Energy | Solder extrusion pressure bonding process and bonded products produced thereby |
US5230462A (en) * | 1992-07-08 | 1993-07-27 | Materials Research Corporation | Method of soldering a sputtering target to a backing member |
CA2156941A1 (en) * | 1995-08-21 | 1997-02-22 | Jonathan H. Orchard-Webb | Method of making electrical connections to integrated circuit |
WO2002058876A1 (de) * | 2001-01-26 | 2002-08-01 | Robert Bosch Gmbh | Verfahren zur herstellung einer verbindung, vorrichtung und leistungshalbleiterbauelement |
WO2008026335A1 (en) * | 2006-09-01 | 2008-03-06 | Murata Manufacturing Co., Ltd. | Electronic part device and method of manufacturing it and electronic part assembly and method of manufacturing it |
JP2016129205A (ja) | 2015-01-09 | 2016-07-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US20190067176A1 (en) * | 2016-03-22 | 2019-02-28 | Intel Corporation | Void reduction in solder joints using off-eutectic solder |
JP6867778B2 (ja) * | 2016-10-27 | 2021-05-12 | ローム株式会社 | 整流ic及びこれを用いた絶縁型スイッチング電源 |
US10881007B2 (en) * | 2017-10-04 | 2020-12-29 | International Business Machines Corporation | Recondition process for BGA using flux |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1331028A (en) * | 1971-08-07 | 1973-09-19 | Matsushita Electronics Corp | Method of soldering a semiconductor plate |
JPS51131274A (en) * | 1975-05-10 | 1976-11-15 | Fujitsu Ltd | Tip bonding method |
US4342090A (en) * | 1980-06-27 | 1982-07-27 | International Business Machines Corp. | Batch chip placement system |
JPS5945077A (ja) * | 1982-09-07 | 1984-03-13 | Nec Corp | 電子部品の半田付方法 |
JPS61125025A (ja) * | 1984-11-22 | 1986-06-12 | Hitachi Ltd | 半導体装置の製造方法 |
IN168174B (ko) * | 1986-04-22 | 1991-02-16 | Siemens Ag | |
EP0264122B1 (en) * | 1986-10-17 | 1992-03-18 | Hitachi, Ltd. | Method of producing a composite structure for a semiconductor device |
JPH0640555B2 (ja) * | 1987-02-09 | 1994-05-25 | 株式会社東芝 | ダイボンデイング装置 |
-
1989
- 1989-07-10 US US07/377,906 patent/US4927069A/en not_active Expired - Lifetime
- 1989-07-14 KR KR1019890010016A patent/KR920005801B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR920005801B1 (ko) | 1992-07-18 |
US4927069A (en) | 1990-05-22 |
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