KR900002400A - Lift Off Process Using By-Products - Google Patents

Lift Off Process Using By-Products Download PDF

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Publication number
KR900002400A
KR900002400A KR1019880009158A KR880009158A KR900002400A KR 900002400 A KR900002400 A KR 900002400A KR 1019880009158 A KR1019880009158 A KR 1019880009158A KR 880009158 A KR880009158 A KR 880009158A KR 900002400 A KR900002400 A KR 900002400A
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KR
South Korea
Prior art keywords
lift
products
metal
application
fair
Prior art date
Application number
KR1019880009158A
Other languages
Korean (ko)
Other versions
KR920002028B1 (en
Inventor
박한수
Original Assignee
강진구
삼성반도체통신 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 강진구, 삼성반도체통신 주식회사 filed Critical 강진구
Priority to KR1019880009158A priority Critical patent/KR920002028B1/en
Priority to JP1171356A priority patent/JPH0258834A/en
Publication of KR900002400A publication Critical patent/KR900002400A/en
Application granted granted Critical
Publication of KR920002028B1 publication Critical patent/KR920002028B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

내용 없음No content

Description

부산물을 이용한 리프트 오프 공정Lift Off Process Using By-Products

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 접속창 형성 및 리프트 오프 공정의 단면도.1 is a cross-sectional view of a connection window forming and lift-off process.

제2도는 부산물에 의한 리프트 오프 공정을 나타낸 단면도.2 is a cross-sectional view showing the lift off process by the by-product.

Claims (1)

반도체 제조를 위한 리프트 오프 공정에 있어서, 금속 도포후 불필요한 부분의 금속을 제거하기 위해 실리콘 기판상에 열이나 빛을 가해 포토리지스트에서 발생되는 부산물을 이용하여 리프트 오프 공정시간을 단축하게 되는 리프트 오프 공정.In the lift-off process for semiconductor manufacturing, a lift-off process is performed by using a by-product generated from a photoresist by applying heat or light to a silicon substrate to remove unnecessary metal after metal application. fair. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019880009158A 1988-07-21 1988-07-21 Lift-off process using by-product KR920002028B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019880009158A KR920002028B1 (en) 1988-07-21 1988-07-21 Lift-off process using by-product
JP1171356A JPH0258834A (en) 1988-07-21 1989-07-04 Lift-off process using by-product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880009158A KR920002028B1 (en) 1988-07-21 1988-07-21 Lift-off process using by-product

Publications (2)

Publication Number Publication Date
KR900002400A true KR900002400A (en) 1990-02-28
KR920002028B1 KR920002028B1 (en) 1992-03-09

Family

ID=19276287

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880009158A KR920002028B1 (en) 1988-07-21 1988-07-21 Lift-off process using by-product

Country Status (2)

Country Link
JP (1) JPH0258834A (en)
KR (1) KR920002028B1 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5570028A (en) * 1978-11-20 1980-05-27 Matsushita Electric Ind Co Ltd Fabricating method of semiconductor device

Also Published As

Publication number Publication date
KR920002028B1 (en) 1992-03-09
JPH0258834A (en) 1990-02-28

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