KR900002373B1 - Printed circuit board laminating apparatus - Google Patents

Abstract

A PCB laminator (1) adapted for laminating a film on the baseboard of a PCB comprises a laminating mechanism (3) which can continuously laminate a long film on the continuously fed baseboards, a constant- gap board feed mechanism (5) which can arrange the baseboards with a constant gap therebetween and continuosly feed them to the laminating mechanism, a cutting mechanism (4) which can cut the film laminated to the boards for sepg. the latter from each other, and an access hole-making unit which can make access holes in the film to be aligned with indexing holes in the baseboard, prior to the lamination.

Description

Printed Circuit Board Laminating Equipment

1 is an external perspective view of a printed circuit board laminator embodiment according to the present invention.

2 and 3 are a plan view and a side view, respectively, schematically illustrating the overall structure of the stacker.

4 and 5 are a plan view and a side view, respectively, of a timing section of the stacker.

6a to 6k illustrate a continuous step of constant-gap feed of a substrate in a timing portion.

7 is a time chart for a constant feed of a substrate.

8 is a partial cutaway side cross-sectional view of the main portion of the laminate stacker.

9 is a sectional view of a resist film.

10 is a sectional view of a substrate and a resist film after lamination.

11 is a block diagram of a control system of an access hole forming mechanism.

12 is a perspective view of a first embodiment of a cutout of the stacker.

13, 14 and 15 are detailed views of the main part of the 12th cut.

16 is a perspective view of a second embodiment of a cutout of the stacker.

17 is a detailed view of the main part of the FIG. 16 cut.

* Explanation of symbols for main parts of the drawings

2: timing portion 3: lamination portion

4: cutting part 5: substrate transfer machine

8: support roller 11: quick feed belt

17: stopper 18: guide roller

19: alignment roller 40: die punch device

54: conveying belt 63: shearing machine conveyer

The invention relates to a suitable apparatus for manufacturing a printed circuit board, in particular a printed circuit board which laminates the surface of a printed circuit board (hereinafter referred to as a substrate) with a film such as a dry photoresist film (hereinafter referred to as a resist film). The present invention relates to a laminating device (laminating machine).

A conventional printed circuit board is manufactured by forming a photoresist layer on the surface of a conductive material layer of a substrate such as a copper-clad plate and then forming a wiring pattern by photolithography thereon.

In this method, the photoresist layer is formed by laminating a raster film on the substrate surface.

The lamination of the resist film is performed on the substrate in such a manner that a part of the resist film having a length corresponding to the length of the conventional substrate is cut from the long resist film and laminated on the substrate. However, this method is inefficient and unsuitable for mass production processes.

Accordingly, a laminator has recently been developed that can continuously deposit a long resist film onto a substrate without cutting the film. However, this type of conventional stacker has the following problems. Conventional laminators are fabricated in such a way that the substrates are spaced between them continuously, for example by a feed roller, and at the same time a long resist film is supplied by laminating roll means and laminated on the substrate surface by thermal compression. Was manufactured.

According to this type of laminator, the substrates laminated by the resist film exit the laminate in a state where they are interconnected by the resist film. Therefore, in order to separate the substrate, a resist film must be cut between the substrates. In addition, the substrate is usually provided with an indexing hole (pile rod hole or adjusting hole) used for positioning of the substrate in the next step process.

The resist film must have an access hole allowing the substrate to access the indexing hole. However, the conventional laminating machine does not have a means for cutting the resist film to make an access hole. Therefore, after the lamination process, the resist film and the access hole must be manually cut by a knife or the like.

This is a waste of labor and means that the automation is not provided in the printed circuit board manufacturing process, which means that the process is inefficient and the productivity is low. Furthermore, there is a disadvantage that the inaccuracy in cutting the resist film, making pieces of the access hole, the resist film, and the substrate adhered to the resist film causes an error that results in deterioration of quality and low production of the printed circuit board in the next step.

Furthermore, the spacing between substrates entering the stacker from the previous substrate-processing portion or substrate accumulator in the stacker is important. For example, if the gap is too large, the end portion of the resist film protruding from the substrate tends to roll over or roll after being cut, thereby further increasing the above disadvantages. On the other hand, if the spacing is too small, the cutting of the resist film cannot be performed continuously after being laminated.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board stacker capable of carrying a predetermined distance transfer of a substrate.

It is another object of the present invention to provide a laminator which can automatically, efficiently and accurately make access balls in a resist film before lamination.

It is still another object of the present invention to provide a laminating apparatus capable of automatically, efficiently and accurately cutting a resist film after lamination.

It is still another object of the present invention to automatically and efficiently perform a constant distance transfer of a substrate, by making access balls in a resist film before lamination, successively laminating the resist film on a substrate, and cutting the resist film after lamination, The present invention provides a printed circuit board laminating machine that can realize automation, productivity improvement, quality and yield of printed circuit board in the printed circuit board stacking step.

According to the characteristics of the present invention, a printed circuit board is composed of lamination means for continuously transferring a long film and laminating the film on the substrate surface, and substrate transfer means for backing the substrate at a predetermined interval and transferring the substrate to the lamination means at a constant speed. Groups are provided.

According to another aspect of the present invention, a lamination means for continuously transferring a long film to a stacking position to continuously stack the film on the substrate surface, and an access hole for manufacturing an access hole in the film while transferring the film to the stacking position so as to be aligned with the indexing hole on the substrate. Provided is a printed circuit board laminate configured as a manufacturing means.

According to still another aspect of the present invention, there is provided a lamination means for continuously transporting a long film and continuously laminating a film on a substrate surface, and cutting means for cutting a film corresponding to a gap between the substrates continuously transported by the lamination means. A printed circuit board laminate is provided.

According to still another aspect of the present invention, there is provided a printed circuit board stacker composed of the lamination means, substrate transfer means, access deduction means and cutting means. With reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

In FIG. 1, FIG. 2, and FIG. 3, reference numeral 1 denotes a stacker which basically includes a timing section 2, a stacking section 3, and a cutout section 4. As shown in FIG.

In Figs. 2 and 3, reference numeral 5 denotes a substrate transfer device for transferring the substrate P from the preceding substrate treatment portion or substrate accumulator (not shown) to the stacker 1.

First, the general configuration and operation of the substrate transferer 5 and the sections 2, 3, and 4 of the laminator 1 will be described with reference to FIGS. 2 and 3. The substrate transferer 5 is horizontally supported by a pulley 6 and horizontally moves the substrate P in the direction of the arrow A along the horizontal transfer path T (indicated by the dotted line in Fig. 3). It includes a pair of transfer belts 7 for feeding and supplying to the timing unit 2 of the stacker 1 via a support roller 8 capable of freely rotating the substrate.

The timing section 2 of the stacker 1 includes a quick-feed belt 11, a stopper 17, a guide roller device 18 and an alignment roller 19 (FIG. 2). And a substrate transfer mechanism at regular intervals, each of which includes a cram roller 21, transfer rollers 22 and 23, and a spacing pin 25.

The timing unit 2 continuously transfers the substrate P supplied from the substrate transfer unit 5 to the stacking unit 3, wherein the substrate has a predetermined interval d (for example, 2 to 3 mm). And aligned, exactly directed in the substrate transfer direction, and moved at a predetermined constant speed V (eg, 0.5-2 m / min).

The lamination section 3 includes a lamination mechanism and a die composed of a transfer roller 31, 32, 33, 34, a lamination roller 35, a freely rotatable support roller 36 and a resist film veil 37. An access hole manufacturing mechanism composed of a die-punch unit 40 is provided.

The stacking portion 3 continuously transports the substrate P, which has been transferred from the previous timing portion 2, which is maintained at a constant speed V while maintaining a constant interval d, and has the same speed roll as the substrate transfer speed. Two long resist films F (hatched portions in FIG. 2) are continuously supplied. In addition, the laminated part 3 makes the access hole Hf (FIG. 2) in the resist film F corresponding to the indexing hole Hp (FIG. 2) in the substrate P, The resist film is successively laminated by thermocompression applied to the top and bottom surfaces, and then the laminated plate P and the resist film F are sent to the next cutout 4.

The cutout portion 4 has a cutting mechanism including a transfer roller 51, a transfer belt 54, and a cutter 6, and a laminated substrate P and a resist film F transferred from the lamination portion 3. The resist film F is cut at portions corresponding to the intervals between the substrates P to separate the substrates, and thereafter, as shown by the arrow B, The parts 2, 3, and 4 will be described in more detail.

[Timing part]

When the timing section refers to FIGS. 4 and 5 in which the substrate transfer unit 5 and the stacking section 3 are shown together, the feed belt 11 of the substrate transfer mechanism at a predetermined interval in the timing section 2 is provided. Is adjacent to the substrate transfer machine 5 and is arranged along the substrate transfer path T (FIG. 5).

The feed belt 11 is horizontally supported by a pair of pulleys 12 and 13 and driven by a double speed motor M1 connected to the pulley 13 by a belt or chain 14 so that the substrate ( Two speeds (V ₁ ) and low speed (V ₂ ) (V <V ₂ <V ₁ ) are provided for fast conveying P). Reference characters S1, S2, and S3 are an extractor that detects whether the substrate P is fed from the substrate feeder 5 to the feed belt 11 and then conveyed at a desired speed.

These detectors are photosensors each consisting of a light-emitting cell and a photoelectron receiving cell.

As indicated by the thick line in FIG. 5, the belt upper surface is the lower (original position) below the level of the substrate transport path T and the dotted line on the upper surface of the belt is actually on the same level as the substrate transport path T. The feed belt 11 is mounted on the support 15 which is vertically movable by the linear motor M2 in such a way that the feed belt 11 is moved up and down between the upper positions shown in FIG. do.

The lifting stroke of the quick feed belt 11 is, for example, 15 to 20 mm. The stoppers 17 are arranged adjacent to the end of the feed belt 11 when they are in the home position. The stopper 17 stops the substrate P which is conveyed by the feed belt 11 at a desired speed at a predetermined standby position as described later. Reference characters S4 and S5 denote detectors for detecting whether the quick feed belt 11 is above the home position, respectively. These detectors are the photodetectors or mechanical microswitches described above.

In FIG. 4, the alignment roller device 19 which can move the fixed guide roller device 18 and the horizontal direction (indicated by the arrows Z1 and Z2) on each side of the feed belt 11 is the substrate feed path T. Was wit vertically. The alignment roller device 19 is driven by, for example, a cylinder operator SY1 using compressed air, and pushes the substrate P, which is placed in the standby position on the feed belt 11, against the roller 18 as a guide roller. By attaching, the substrate P is positioned at a predetermined position to ensure that the substrate is oriented exactly in the feeding direction.

The spring 20 is used to adjust the force for pushing the substrate of the cylinder operator SY1. In FIG. 5 the cramp rollers 21 are arranged on the feed belt 11 and opposite the pulley 13. The cramp roller 21 is normally downwardly applied by the spring 21a, and when the feed belt 11 is at the upper portion, the clamp pressure is applied to the substrate P and cooperates with the feed belt 11 to be described later. As described above, the substrate P is transferred at a low speed v ₂ .

The feed rollers 22, 23 are arranged next to the cramp rollers 21, ie in the region adjacent to the stack 3.

The lower transfer roller 22 is always driven by the belt or chain 24 in synchronism with the transfer roller 31 in the stack 3 to transfer the substrate P at a constant speed V. The upper feed roller 23 is a driving roller which can be moved up and down by, for example, a cylinder operator SY2 using compressed air.

The upper feed roller 23 is normally placed in the upper position (original position) so that the substrate P is freely moved between the feed rollers 22 and 23 when the feed belt 11 and the cram roller 21 are transferred at a desired speed. Can pass. However, after the fast substrate transfer is completed, the upper feed roller 23 moves downward to fix the substrate P and cooperates with the lower transfer roller 22 to move the substrate P at a constant speed V as described below. Transfer.

Reference numerals S6, S7, S8 denote photodetectors as described above for detecting whether the substrate P is transported along the substrate feed path T at a desired speed or at a constant speed, and S9 denotes an upper feed roller ( 23) the above-described photodetector or micro switch for detecting the lower part.

The spacing pin 25 is arranged next to the transfer rollers 22, 23, ie in the region adjacent to the stack 3. The diameter of the spacing pins 25 is equal to the predetermined substrate spacing d, and the pins 25 are moved up and down by, for example, a cylinder operator SY3 using compressed air, and are pinched at intervals between the substrates P. FIG. I heard and came out.

The cylinder actuator SY3 is the front position indicated by the thick line of FIG. 5 where the spacing pin 25 is adjacent to the transport rollers 22 and 23, and the dotted line 25 'adjacent to the transport roller 31. It is fixed to the slider 28 which is engaged with the horizontal guide rod 27 fixed to the fixing unit 26 in such a way that it can be moved in parallel with the substrate transfer path T between the following positions shown.

As described below, the spacing pin 25 is usually at the bottom (original position) and is moved as shown in FIG. 5 after the trailing end of the substrate P passes through the spacing pin 25.

When the next substrate P is then conveyed by the feed belt 11 and the cram roller 21 at the desired speed, the spacing pin 25 is moved forward as shown by the dotted line 25 'in FIG. Since the rear end of the substrate P is pushed by the front end of the subsequent substrate, the distance d between the front and the subsequent is maintained.

Therefore, the spacing pin 25 protrudes in the gap between the substrates and is returned to the home position by the return switch 29 set between the mounting portion 26 and the cylinder 28. Reference character S10 denotes the above-described photodetector or microswitch for detecting the position next to the slider 28, i.e., the position 25 'of the space pin 25.

The above-described constant distance transfer performed by the timing unit 2 will be described in detail with reference to FIGS. 6A to 6K and 7. 6A to 6K show only relevant parts and FIG. 7 shows the operation of the detectors S1 to S10, the motors M1 and M2 and the cylinder operators SY1 to SY3.

Assume that the feed belt 11, the upper feed roller 23 and the spacing pin 25 are all in their original positions at the start of operation in FIG. 6A. In this state, the first substrate p1 is transferred by the conveyance belt 7 of the substrate transfer machine 5, and the leading edge of the substrate is moved when the leading half of the substrate passes through the support roller 8. The substrate is tilted until it relies on the feed belt 11.

The class is a conveyance belt (11) when the detector (S1) in Fig. 6b detect the substrate (P1) driven by a motor (M1) at a high speed substrate (P1) is conveyed at a high speed (V _1).

In FIG. 6C, when the detector S2 detects the front end of the substrate P1, the motor M1 is switched to a low speed operation so that the substrate P1 is decelerated at a low speed V ₂ to move toward the stopper 17. .

Next, the detector S3 detects the substrate P1 and stops the motor M to stop the feed belt 11 so that the substrate P1 is in the standby position.

At the same time, the output signal from the detector S3 causes the cylinder operator SY1 to actuate the alignment roller device in the direction of the arrow Zi as shown in FIG. 4 so that the substrate P1 is opposite to the guide roller device 18. Pushed out, the substrate P1 is aligned in the correct position and the substrate is oriented correctly.

In Fig. 6d, the output signal from the detector S3 further actuates the motor M2 to raise the feed belt 11 upwards as indicated by the arrow Y1 so that the substrate P1 is on the transfer path T. It is fixed in the belt 11 and the cramp rollers 21 at the transfer position. When the quick feed belt 11 reaches the upper position, the detector S5 detects the position and determines the motor M2.

Next, in FIG. 6E, the output signal of the detector S5 operates the motor M1 again at a low speed so that the substrate P1 is moved from the transfer position by the feed belt 11 and the cram roller 21 to the feed roller 22. FIG. , 23) at low speed (V ₂ ).

In FIG. 6F, when the front end of the substrate P1 is detected by the detector S8, the motor M1 is stopped and thus stopped by the feed belt 11.

At the same time, the cylinder operator SY2 is operated to move the upper feed roller 23 downward in the direction of the arrow Y3 so that the substrate P1 is fixed and conveyed at the normal speed V. FIG.

On the other hand, the detector S9 detects whether the upper feed roller 23 is moved to the lower position and causes the motor M2 to be driven backward so that the quick feed belt 11 is moved downward in the direction of the arrow Y2. .

When returning to the original position, the quick feed belt 11 is detected by the detector S4 and the motor M2 is stopped. The output signal from the detector S9 also causes the cylinder operator to operate the arrangement roller 19 in the direction of arrow Z2 as shown in FIG.

In FIG. 6C, the first substrate P1 is transported at the normal speed V by the transport rollers 22 and 23, and then continues in the stacking section 3 into the transport roller 31. Is transferred to). Meanwhile, the second substrate P2 is transferred from the substrate transfer machine 5 to the feed belt 11 returned to its original position, and then transferred to the high speed V ₁ and the low speed V ₂ and stopped at the standby position. It is pushed sideways in the same manner as described in Figures 6a-6c.

In FIG. 6h, when the trailing edge of the first substrate P1 passes through the detector S6, the motor M2 is operated to raise the feed belt 11 and the second substrate P2 to the cram roller 21. Is fixed.

In FIG. 6i, when the trailing edge of the first substrate P1 passes through the detector S7, the cylinder operator SY3 is activated to raise the spacing pin 25 and is inserted between the substrates P1 and P2. At the same time, the cylinder operator SY2 is activated to return the upper feed roller 23 to the original position by raising in the direction of the arrow Y4.

At the same time, since the motor M1 is operated at a low speed, the second substrate P2 is transferred at a low speed V ₂ by the feed belt 11 and the cramp roller 21.

In FIG. 6j, the second substrate P2 transported at a low speed V _{2 follows} the first substrate P1 transported at the normal speed V (V ₂ > V), and the spacing pin 25 is formed. 1 The front end pushes the spacing pin 25 until it hits the tail of one board | substrate P1.

As a result, the predetermined interval d is maintained between the first substrate P1 and the second substrate P2.

In FIG. 6k, when the spacing pin 25 has reached the next position, the detector S10 detects this position and causes the cylinder operator SY2 to operate the upper feed roller 23 and in the direction of the arrow Y3. It moves down to fix the second substrate P2. At the same time the cylinder operator SY3 is operated to pull the spacing pin 25 out of the gap between the substrates P1 and P2 in the direction of the arrow Y6.

As a result, the substrates P1 and P2 are continuously transferred at the normal speed V with a predetermined distance d therebetween.

The basing pin 25 extracted downward is returned by the return spring 29 to the previous home position in the direction of the arrow X2. At the same time, the downward movement of the upper feed roller 23 is detected by the detector S9, and as described above, the rapid feeding belt 11 is moved downward by the motor M2 and returned to the home position.

Thereafter, the same steps as described above with respect to the second substrate P2 are repeated for the third substrate P3 (Fig. 6K) and all subsequent substrates.

As is apparent from FIG. 7, the detector 8 is used only to detect the first substrate P1.

Subsequently, even when the substrate price is irregular when the substrate is transferred by the above method, the substrate P transferred from the substrate transfer machine 5 is rearranged in the timing unit 2 so as to have a predetermined predetermined interval therebetween, and the lamination is performed. It is conveyed continuously to the part 3.

[Laminated part]

In FIG. 8, the lamination mechanism in the lamination part 3 is arranged substantially equidistantly along the transfer rollers 31, 32, 33, 34 and the substrate transfer path T, and is constantly driven to rotate synchronously with each other. The substrate P, which is transferred from the timing unit 2 by having the stacked rollers 35, passes through the stacked rollers 35 at a normal speed V while maintaining a predetermined distance d in the direction of the arrow. Conveyed continuously.

It should be noted that conventional lamination systems or vacuum systems are used in the present invention with respect to the lamination system.

The described embodiment uses a vacuum system and the opposite transport rollers 31 and 34 maintain the airtight condition as a seal roller.

As shown in FIG. 3, the register film rails 37 are disposed above and below the substrate transfer path T, respectively, and are loaded as a roll of the register film F. As shown in FIG.

The resist film F is released from these rails 37, and as shown in FIG. 8, the long film is maintained in an unbroken state, via the guide roller 38, and the speed of conveying the substrate P ( It is transferred to the stacking roll 35 at the same speed as V) and is sequentially stacked on the upper and lower surfaces of the substrate P by thermal compression, respectively.

When the resist film is wound as shown at the intersection in FIG. 9, both surfaces thereof are covered with a protective thin film Fa, for example, polyethylene. When released from the rail 37, the protective film Fa on one side is peeled off by a stripper (not shown) and the resistor film F is peeled off by the protective film peeled off surface as shown at the intersection of FIG. It is laminated on the substrate P.

In general, the register film F has a width smaller than the width of the substrate P, as shown in FIGS. 2 and 10, and is laminated on the substrate P in the center region, and on the side region where the conductor pattern is not formed. Not stacked.

In the resist film cutting step described later, the photodetector detects the substrate gap in the side region of the substrate on which the resist films are not stacked, and performs the film cutting operation.

The access manufacturing apparatus in the stacking section 3 detects the indexing hole Hp, and is disposed in the substrate transfer path T adjacent to the stacking roll 35, and each of the light emitting cells 48a and the photovoltaic cells. The die punch device 40 which manufactures the photodetector S11 equipped with the receiving cell 48b, and the access hole Hf in the register film F which matches the indexing hole Hp in the board | substrate P. FIG. It consists of.

The device 40 is disposed between the register film 37 (FIG. 3) and the stacked roll 35, respectively.

As can be seen from FIGS. 2 and 4, the indexing holes Hp are formed in both sides of the substrate P, so that the indexing hole detectors S11 are disposed on both sides of the substrate transfer path T. And four die-punch devices 40 are also arranged on two upper and lower devices on both sides, ie on each side.

However, only one detector S11 and two die punch devices 40 on one side are shown in the figure.

As described in the sectional view of FIG. 8, the die punch device 40 has a die 41 and a punch 42 facing each other, and the register film F is continuously supplied therebetween. The punch 42 is connected to the piston rod 44 of the cylinder operator 43 using, for example, compressed air.

When the detector S11 detects the indexing hole Hp, the output signal from the detector causes the cylinder operator 43 to move the punch 42 toward the die 41 as indicated by the arrow a. As described above, the resist film F is punched to form an access hole Hf.

When the photodetector S12 disposed on the side of the die 41 detects that the die 42 has reached the die 41 through the register film F, the cylinder operator 43 is indicated by an arrow b. As described above, the punch 42 is extracted from the die 41 and the register film F by operating in the reverse direction. Reference numeral 47 denotes a stripper used to pull out the punch 42. An optical path for the detector S12 is provided by making slits or small holes in a portion of the die 41. The punched scrap of the resist film F is received in the receiver 45 fixed to the die 41, and thus, debris is removed from the surface of the substrate and the inside of the device to maintain cleanness.

When the access hole is punched, since the resist film F is continuously supplied at a constant speed V, the die-punch 40 moves from the original position to the punch completed position 40 'as indicated by the arrow c. Move to and apply with (F). Therefore, while the punch 42 is inserted into the die 41, the device 40 is moved by the register film F to the vicinity of the punching completed position 40, and the cylinder operator 43 moves in the reverse direction. When actuated, the punch 42 exits from the die 41 and the register film F, and the device 40 returns to its original position as indicated by the arrow d by the return string 46.

The detector 11 and the die punch device 40 for detecting the indexing hole have a distance of l ₁ and l ₂ from the stacked roll 35, respectively, and are spaced apart from each other so as to be l ₁ and l ₂ . While the detector S11 detects the indexing hole Hp on the substrate P, the die-punch device 40 makes the access hole Hf on the register film F. As shown in FIG. As a result, the access hole Hf is formed at the same distance from the stacked roll 35 as that of the indexing hole Hp detected by the detector S11.

Thus, as illustrated in FIG. 8, when the holes Hp and Hf reach the stacked roll 35, these holes are exactly aligned with each other.

According to this arrangement of the detector S11 and the die punch device 40, even if the transfer speed of the substrate P and the register film F is changed, the positional relationship between the indexing hole Hp and the access hole Hf Does not change and thus maintains accurate positional relationship without the need for other adjustments.

On the other hand, the distance detector (S11) and a punch device _{(40) (l 1, l} 2) may be different from each other.

In this case, in any case, l ₁ will be greater than l ₂ (ie l ₁ > l ₂ ), and the die punch device 40 is accessed some time after the detector S11 detects the indexing hole Hp. The ball must be formed and this time is determined by the difference in distance (ie l ₁ -l ₂ , the feed rate of the plate (V) and the speed of the resist film, ie (l ₁ -l ₂ ) / V). This corresponds to, for example, a pulse generator for generating pulses proportional to the transfer speed of the register film and the substrate, and a time of (l ₁ -l ₂ ) / V after receiving the indexing hole detection signal from the detector S11. The control circuit 49 of the access hole forming mechanism as described in the block diagram is provided in FIG. 11 with a pulse counter which generates an operation signal of the die punch device 40 after the pulse of the second integer is counted. Can be.

In the above-described method, the lamination section 3 can automatically, effectively and accurately form the access holes in the register film F prior to lamination by using the access hole forming mechanism, and the substrate by the use of the laminating mechanism. The resist film F can be laminated on (P). After lamination, the substrate P is continued through the transfer roller 34 and the support roller 36, and the cutting section 4 continues while being interconnected by the register film F at a predetermined distance d therebetween. Is transferred to).

[Cutting section]

3 and 12, in the cutting section 4, the transfer roller 51 is disposed in the preceding area, and the two transfer belts 54 are located in the next area along the substrate transfer path T. Is placed. The conveying belt 54 is horizontally supported by the pulleys 52 and 53, as shown in FIG. 3, and the driving roller 55 is disposed on the pulley 52. Only one driving roller is made. The transfer roller 51 and the transfer belt 54 are discharged from the stacking section 3 and registered in the direction of the arrow B at the same speed as the speed V of the substrate in the stacking section 3). The heat of the substrates P interconnected by the film is continuously transferred. Thus, with reference to FIGS. 12 and 13, the pulley 52 for the conveying belt 54 is fixed to the main shaft which rotates in the direction of the arrow N1 so that the conveying belt 54 is driven in the same direction, where The main shaft MS is driven by the main motor M3 through the worm and the gear W.

Meanwhile, the feed roller 51 is driven by the chain CH1, and the sprocket wheel SP2 (see FIG. 12) fixed to the lower feed roller 51 and the sprocket wheel SP1 fixed to the main shaft MS. Is coupled to

Preferably, the number of sprockets of the wheel SP2 should be larger than the number of sprocket wheels SP1.

Thus, the outer circumferential speed of the feed roller 51 should coincide with the normal speed V while the speed of the feed belt 54 coincides with the speed V 'which is slightly larger than the speed V (that is, V &lt; V'). .

Substrate at the portion (S13) and the gap (d) to detect the gap (d) between the substrates (P) of the transfer substrate row that is continuously supplied between the transfer roller 51 and the transfer belt 54 A cutting machine 60 for cutting the row of register films F is arranged.

The detector S13 is a photodetector having a light emitting cell 66a and a light storing cell 66b as shown in FIG. 15, and is disposed on one side of the substrate heat transfer path T so that the substrate spacing d is As described above, the register film F is detected on one side of the substrate P which is not laminated.

Referring to FIG. 12, the cutter 60 has a cutter stage 61, which is disposed on the substrate heat passage T perpendicular to the substrate heat transfer direction B. As shown in FIG.

The cutting stage 61 is supported at opposite ends on the support plate 62, the support plate 62 is movable along the guide rail (not described) and the guide rail is in a direction parallel to the substrate heat transfer direction B ( In Fig. 12, arrows X3 and X4) are arranged on opposite sides of the substrate heat transfer passage T.

The cutter bar 61 is provided with a cutting feeder 63, and the cutter feeder is a horizontal direction perpendicular to the substrate heat transfer direction B (indicated by arrows Z3 and Z4 in FIG. 12), that is, a longitudinal guide of the cutting stand. Reciprocating movement is possible along the rail (not described). The cutting feeder 63 is provided with a cutter fixing device 64, and the cutter fixing device can move up and down (indicated by arrows Y7 and Y8 in FIG. 15) by a cylinder operator SY4 and have a blade-like shape. Secure the cutter blade (65).

When the cutter holder 64 swings in the direction of the arrows Y7 and Y8 by the cylinder operator SY4, the cutter blade 65 has its original position located on the upper surface of the substrate row and protruded cutting position below the lower surface of the substrate row. (Figure 15)

The cutter has a reversible motor M5, a chain CH6 for driving the cutting feeder 63, and a cutter blade 65 in the directions of arrows Z3 and Z4.

The chain CH6 is supported by the sprocket wheels arranged at the opposite ends of the cutter stand 61, and both ends thereof are fixed to the cutter feeder 63. As shown in FIG.

The motor M5 is fixed to one of the cutter support plates 62 and connected to one of the sprocket wheels for the chain CH6. Therefore, when the motor M5 rotates in the normal direction, the cutter feeder 63 moves from the original position shown in FIG. 12 to the cut-off position opposite in the direction of the arrow Z3 on the substrate row.

When the motor M5 rotates in the reverse direction, the cutter feeder 63 is moved in the direction of the arrow Z4 from the cut completed position to the original position.

Reference numerals S14 and S15 (FIG. 12) denote photodetectors or microswitches for detecting the original position and the cut-off position of the cutter feeder 63, respectively.

The cutting stage 61 reciprocates in the direction of the arrows X3 and X4 by the drive mechanism described below.

As shown in FIG. 12, at each side of the substrate heat transfer path T, the chain CH5 is supported by four sprocket wheels and is arranged in a rectangular shape as viewed from the side, and both ends thereof have a corresponding cutter-to-support plate 62. ) Is fixed to the front and rear ends. One of the four sprocket wheels for the chain CH5 is connected to the sprocket wheel SP6 at the opposite end of the first secondary shaft AS1 (which can be clearly seen in FIG. 14) by the two chain CH4. Is connected to the second auxiliary shaft AS2.

13 and 14, the first auxiliary shaft AS1 is provided with two pairs of rocket wheels SP4 and SP5 and magnetic clutches MC1 and MC2. The first sprocket wheel SP4 is fixed to the main shaft MS by the chain CH2 and the second sprocket wheel SP5 is connected to the output shaft of the auxiliary motor M4 by the chain CH3.

The magnetic clutches MC1 and MC2 connect or disconnect the first auxiliary shaft and the sprocket wheels SP4 and SP5, respectively, by using an electromagnetic force. Under normal conditions, the clutches MC1 and MC2 are OFF and the sprocket wheels SP4 and SP5 are separated.

In this state, the first auxiliary shaft AS1 is driven by the motors M3 and M4, and the cutting machine base 61 is not driven to its original position adjacent to the feed roller 51.

When the first clutch MC1 is ON, the first auxiliary shaft AS1 is connected to the sprocket wheel SP4 and is driven by the main shaft MS (that is, the main motor M3) through the chain CH2. Driven thereby, as shown in FIG. 12, the cutting stage 61 is driven through the chain CH4, the second auxiliary shaft AS2 and the chain CH5, and the same as the substrate heat transfer direction B. Direction (the direction of arrow X3).

The movement speed in the direction of the arrow X3 of the cutting table 61 coincides with the substrate transfer speed V. FIG.

When the first clutch MC1 is "off" and the second clutch MC2 is "on", the first auxiliary shaft AS1 is separated from the sprocket wheel SP4 and connected to another sprocket wheel SP5 so that the chain It is driven by the auxiliary motor M4 through CH3 and reverses in the direction opposite to the rotational direction of the main shaft MS.

Therefore, as shown in FIG. 12, the chain CH4, the second auxiliary shaft AS2, and the chain CH5 are driven in the reverse direction, and the cutting rod 61 is driven in the direction of the arrow X4 to be in the original position. Return to.

Reference numeral S16 designates a photodetector or microswitch for detecting the original position of the cutting stand support plate 62, that is, the cutting stand 61.

In the cut portion 4, the cutting of the register film F in the substrate row is performed as follows.

When the substrate heat emitted from the preceding stack 3 is conveyed by the conveying belt 54 and the conveying roller at the normal speed V as shown in FIG. 15, the gap d of the substrate P becomes a detector. Arriving at the position of S13 and detecting the end of the substrate P to be advanced next, the cylinder operator SY4 is operated to cut the cutting edge 65 downward to the cutting position as indicated by the arrow Y7. Move.

At the same time, the motor M5 is activated to move the cutting feeder 63 in the direction of the arrow Z3. Furthermore, the first clutch is turned on as the cutter blade 65 moves downward and the cutter stage 61 is driven by the main motor M3 in the direction of the arrow X3 at the normal speed V.

Accordingly, as shown in FIG. 15, the cutter blade 65 has a gap between the register films F on both sides in the direction of the arrow Z3 (FIG. 12) while moving in the direction of the arrow X3 at the same speed as the substrate row. substrate rows through the distance d between the substrates (the movement trajectory of the cutter blade 65 is inclined with respect to the substrate heat transfer direction B, as indicated by the dotted lines in FIG. 2) to be cut along the centerline of d). To move across.

In this case, the preceding substrate P is conveyed by the conveyance belt 54 and the next substrate P is conveyed by the conveyance roller 54.

As described above, the moving speed V 'of the conveying belt 54 is slightly larger than the conveying speed of the conveying roller 51, and as a result, the resist film F, which is mutually coupled with the substrate P, receives a slight tension. , Thereby assuring good cutting.

When cutting is completed and the cutting blade 65 reaches the cutting completion position (indicated by 65 'in FIG. 2), the detector S15 detects this state and stops the cutter drive motor M5 to cut the cutter feeder ( 65) Stop. At the same time, the first clutch MC1 is turned off to stop the cutting stand 61, and furthermore, the cylinder operator SY4 operates in the opposite direction as indicated by the arrow Y8 to move the cutting blade 65. FIG. . Thereafter, the motor 5 is operated in the opposite direction, so that the cutter feeder 63 returns to its original position in the direction indicated by the arrow Z4 and stops when it is detected that it has come to that position by the detector S14.

At the same time, the second clutch MC2 is turned on, and the cutter stage 61 is driven by the auxiliary motor M4 to return to its original position and stops when it is detected that it has come to that position by the detector S16.

The substrate P may have a speed slightly higher than the substrate thermal speed V as described above, as the distance from the substrate row of the substrate P separated from the substrate row after the resistor film F is cut is gradually increased. V ') is conveyed by the conveyance belt 54 in the direction of the arrow B and sent to the next substrate processing section or substrate collector (not described).

As described above, the cutout portion 4 can cut the resist film after lamination without damaging the substrate P and the resist film with a good cutting result in an automatic and effective manner.

Next, a second embodiment of the cutout will be described. The cutouts 4A shown in FIGS. 16 and 17 are basically the cutouts 4 described above, except that the structure and the operation of the cutters 70 are slightly different from those of the cutters 60 described above. The structure and operation are the same.

That is, the substrate heat emitted from the stacking portion 3 is transferred by the transfer roller 51 and the transfer belt 54, and the gap d is detected by the detector S13 in the same manner as in the first embodiment. . Furthermore, the cutter 70 has a cutter stand 71 and a cutter stand support plate 72, the cutter stand and the cutter stand support plate being the same as those of the cutter 60 as described above, and the cutter stand 71 is The drive mechanism of the cutter 60 is reciprocated in the direction of the arrows X3 and X4 with the same drive mechanism. Therefore, only the difference between the cutter 60 and the cutter 70 is described next.

The cutter stand 71 of the cutter 70 is provided with a pair of cutter support plates 73 fixed to opposite ends thereof. These cutter support plates 73 are cutter holders 74 which can be shanghai (indicated by arrows Y7 and Y8 in FIG. 17) by a cylinder operator SY5 using such as compressed air. ) Is provided. The cutter holder 74 fixes the cutter blade attached to the cutter with a material having a heat insulating property positioned therebetween and having a length greater than the width of the resistor film F. The cutter blade 75 is mounted thereon with a heater 76 such as, for example, nickel chrome wire, which heats the cutting end of the cutter blade 75 to a predetermined temperature (for example, 70 to 80 ° C). Even when not heated, the cutter blade 75 can perform the cutting without difficulty. However, when the cutter blade 75 is heated, cutting becomes easier. The heater does not always need to be attached to the cutter blade 75 and can be coupled to a large size cutter holder. The cylinder operator SY5 moves up and down by operating the cutter holders 74 so that the cutter blade 75 reciprocates between the original position and the cutting position (FIG. 17). Reference numerals S17 and S18 denote photodetectors or micro switches that detect whether the cutter blade 75 is in the cutting position or the original position.

According to the above structure, when the detector S13 detects the substrate spacing d in the substrate row, the cylinder operator SY5 is operated to move the cutter blade 75 downward in the direction of the arrow Y7. At the same time, the first clutch MC1 is turned on so that the cutting stage 71 is driven by the main motor M3 in the direction of the arrow X3 at the normal speed V as in the case of the cutting machine 60.

Thus, while moving in the same direction at the same speed as the speed V of the substrate row as shown in FIG. 17, the cutter blade 75 moves downward in the direction of the arrow X7 through the gap d between the substrates P. FIG. By moving, the register film F on both sides is heated and cut. Reference numeral 77 (FIG. 17) denotes a shock absorber for the cutter blade 75. As shown in FIG. When the cutting is completed, the detector S18 causes the cylinder operator SY5 to operate in the opposite direction, so that the cutter blade 75 moves in the direction of the arrow Y8 to return to the original position. The detector S17 turns off the first clutch MO1 and turns on the second clutch MC2 in the same manner as in the case of the cutter 60, so that the cutter stand 71 is moved by the auxiliary motor M4 to the arrow ( It is driven in the direction of X4) to return to the original position and stops when it is detected by the detector S16 that the original position is detected.

In this way, the cutout portion 4A of the second embodiment automatically and effectively cuts the register film like the cutout portion 4 of the first embodiment.

The laminate described above has the following advantages. (1) It is possible to continuously transfer the substrate to the stacking portion by precisely aligning the substrate in the transfer direction at a predetermined constant interval by the substrate transfer mechanism at a predetermined interval. This enables effective and precise continuous stacking of long register films in the stack. (2) In the lamination section, the resist film is successively laminated on the substrate by the lamination mechanism, and before lamination, the access holes are formed in the register film in alignment with the indexing holes of the substrate by the access hole formation mechanism. Therefore, it is not necessary to form the access hole manually after lamination. Further, the access hole forming mechanism can form the access holes effectively and precisely without damaging the substrate and the resist film by scraping the resist film produced when the access holes are formed. (3) Moreover, the resist film of the substrate row after lamination can be effectively and precisely cut at the substrate gap portion by the cutting tool at the cut portion. Therefore, manual cutting is unnecessary.

As described above, the present invention provides a printed circuit board lamination apparatus. It is possible to carry out constant distance transfer of the substrate automatically, effectively and precisely, to form an access hole in the register film prior to the lamination, to continuously deposit the resist film on the substrate, and to cut the resist film after lamination. In conclusion, it can be seen that in the lamination step of the printed circuit board, automation of production, improvement of productivity, and improvement of quality can be achieved.

Therefore, the economic and technical effects of the present invention are very remarkable.

Claims (18)

In a printed circuit board laminating apparatus for laminating a film on a substrate surface of a printed circuit board, an indexing hole is provided in the substrate, and the laminating means for continuously depositing a film on the surface of the substrate and sending a long film to the lamination position continuously is uniform between the substrates. Printed circuit board laminating apparatus comprising a substrate transfer means for aligning the substrate at intervals and transferring the substrate to the lamination means at a normal speed. 2. The normal speed transfer mechanism according to claim 1, wherein the substrate transfer means transfers a substrate continuously to the standby position at a normal speed, and transfers a trailing substrate to a standby position and at a speed higher than the normal speed. And a spacing mechanism for adjusting a gap between the preceding substrate and the trailing substrate so that a gap between the preceding substrate and the trailing substrate is constant. 3. The apparatus of claim 2, wherein the substrate transfer means further includes an elevating means for moving the rapid transfer mechanism between an upper position and a lower position, wherein the rapid transfer means transfers the substrate to a standby position and transfers the substrate to a normal speed transfer mechanism. Printed circuit board laminating apparatus, characterized in that the rapid feeding means for conveying. 3. The printed circuit board laminating apparatus according to claim 2, wherein the rapid feeding means includes two speed driving means for driving the rapid feeding means at two different speeds faster than the normal speed. 3. The printed circuit board lamination apparatus according to claim 2, wherein the substrate transfer means further comprises alignment means for fixing the substrate, which is aligned in the transport direction of the substrate and transported to the standby position. 3. The printed circuit board stacking device according to claim 2, wherein the spacing mechanism is composed of a spacing element operative to be pulled out or inserted from a gap between the preceding substrate and the trailing substrate. The printed circuit board laminating apparatus according to claim 1, further comprising index hole forming means for forming an access hole in the film in a transfer path of the film to a stacking position to be aligned with the indexing hole on the substrate. 8. A method according to claim 7, wherein the access hole forming means is arranged at a position on the film transfer passage and a detector arranged at a stacking position on the transfer passage of the substrate to detect the indexing hole of the substrate, so as to form an access hole in the film. And an access hole forming device which responds to the indexing hole detection signal from the detector. 9. The printed circuit according to claim 8, wherein the detector and the access hole forming apparatus are arranged at equal distances from the stacking position, and the access hole forming apparatus simultaneously forms the access holes at the time when the detector detects the indexing holes. Substrate laminating apparatus. The method of claim 8, wherein the distance l ₂ between the access hole forming apparatus and the stacking position is smaller than the distance l ₁ between the detector and the stacking position, and the transport speed v of the substrate and the film after the detector detects the indexing hole. And the access hole forming apparatus forms the access hole after a time (l ₁ -l ₂ / V) determined by the distance difference (l ₁ -l ₂ ). 9. The apparatus of claim 8, wherein the access hole forming apparatus further comprises restoring spring means for moving with the film in the conveying direction of the film when the access hole is formed, and restoring to an original position after the access hole is formed. Printed circuit board laminating apparatus. 9. The printed circuit board stacking apparatus according to claim 8, wherein the access hole forming apparatus includes a film between the punch and the die, and includes driving means for driving the punch, the die, and the punch to face each other. The apparatus of claim 8, wherein the access hole forming apparatus includes a receiver for receiving scrap calculated when the access hole is formed. 8. The printed circuit board laminating apparatus according to claim 1 or 7, further comprising cutting means for cutting the film at a position corresponding to a distance between the laminated substrates continuously conveyed by the laminating means. 15. The cutting device as set forth in claim 14, wherein the cutting means comprises a cutter stage moving at the same speed and in the same direction as the feed rate of the laminated substrate and the film, and a cutter blade fixed perpendicularly to the moving direction of the laminated substrate and the film fixed by the cutter stage. And a film is cut at a position corresponding to a gap between the substrates during the transfer. 15. The cutting device according to claim 14, wherein the cutting means extends perpendicularly to the conveying direction of the substrate and the film, which are fixed and laminated by the cutting table and moved at the same speed and in the same direction as the conveying speed of the laminated substrate and the film. Printed circuit board laminating apparatus characterized in that the cutter blade is composed of a cutter blade having a length greater than the width of the film and the film is cut at the portion corresponding to the gap between the substrate during transfer. 17. The printed circuit board laminating apparatus according to claim 16, wherein the cutting means further comprises a heater for heating the cutter blade. 15. The printed circuit board laminating apparatus according to claim 14, wherein the cutting means comprises a transfer means for transferring a substrate separated from another substrate by cutting at a speed slightly higher than a normal transfer speed.

Images