KR850006845A - Printed Circuit Board Laminating Equipment - Google Patents

Printed Circuit Board Laminating Equipment Download PDF

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Publication number
KR850006845A
KR850006845A KR1019850001702A KR850001702A KR850006845A KR 850006845 A KR850006845 A KR 850006845A KR 1019850001702 A KR1019850001702 A KR 1019850001702A KR 850001702 A KR850001702 A KR 850001702A KR 850006845 A KR850006845 A KR 850006845A
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KR
South Korea
Prior art keywords
substrate
access hole
film
cutting
transfer
Prior art date
Application number
KR1019850001702A
Other languages
Korean (ko)
Other versions
KR900002373B1 (en
Inventor
쇼지 다나까
Original Assignee
야마모도 다꾸마
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP59049232A external-priority patent/JPS60193653A/en
Priority claimed from JP59055247A external-priority patent/JPS60200331A/en
Priority claimed from JP59056150A external-priority patent/JPS60201900A/en
Priority claimed from JP59056152A external-priority patent/JPS60201031A/en
Application filed by 야마모도 다꾸마, 후지쓰 가부시끼가이샤 filed Critical 야마모도 다꾸마
Publication of KR850006845A publication Critical patent/KR850006845A/en
Application granted granted Critical
Publication of KR900002373B1 publication Critical patent/KR900002373B1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223One or more of the layers being plastic
    • B32B37/226Laminating sheets, panels or inserts between two continuous plastic layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/18Handling of layers or the laminate
    • B32B38/1825Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833Positioning, e.g. registration or centering
    • B32B38/1841Positioning, e.g. registration or centering during laying up
    • B32B38/185Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers

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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

내용 없음No content

Description

인쇄회로기판 적층장치Printed Circuit Board Laminating Equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명에 따른 인쇄회로기판 적층장치(Iaminator) 실시예의 외부사시도.1 is an external perspective view of a printed circuit board laminating apparatus (Iaminator) embodiment according to the present invention.

제3도는 각각 적층기의 전구조를 개략적으로 설명하는 평면도 및 측면도.3 is a plan view and a side view schematically illustrating the overall structure of the lamination machine, respectively.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

2 : 타이밍부 3 : 적층부2: timing portion 3: lamination portion

4 : 절단부 5 : 기판이송기4: cutting part 5: substrate transfer machine

8 : 지지로울러 11 : 급이송벨트8: support roller 11: quick feed belt

17 : 스토퍼 18 : 안내로울러17: stopper 18: guide roller

19 : 정렬로울러 40 : 다이펀치장치19: alignment roller 40: die punch device

54 : 이송벨트 63 : 전단기이송기54: conveying belt 63: shearing machine conveyer

Claims (18)

인쇄회로기판의 기판표면에 막을 적층하기 위한 인쇄회로기판 적층장치에 있어서, 상기 기판에 인덱싱공이 마련되고, 연속적으로 긴 막을 적층위치로 보내고 연속적으로 기판의 면상에 막을 적층하기 위한 적층수단과 기판상호간에 일정한 간격을 갖고 기판을 정렬하고 상기 적층수단에 정상속도로 기판을 이송하기 위한 기판 이송수단으로 구성된 것을 특징으로 하는 인쇄회로기판 적층장치.In a printed circuit board laminating apparatus for laminating a film on a substrate surface of a printed circuit board, an indexing hole is provided in the substrate, and the laminating means and the substrate are mutually stacked to send a long film to a stacking position continuously and to stack the film on the surface of the substrate continuously. Printed circuit board laminating apparatus comprising a substrate conveying means for aligning the substrates at regular intervals in the substrate and transferring the substrate to the lamination means at a normal speed. 제1항에 있어서, 정상속도로 상기 적층수단에 선행하는 기판을 연속적으로 보내기 위한 정상속도 이송기구, 대기위치로 후행의 기판을 이송하고 상기 정상속도보다 빠른 속도로 정상속도 이송기구쪽으로 이송하기 위한 급속이송기구, 및 선행기판과 후행의 기판사이의 간격이 일정하게 되도록 상기 선행기판과 상기 후행기판의 간격을 조절하기 위한 스페이싱 기구로 구성된 상기 이송기구를 특징으로 하는 장치.The apparatus of claim 1, further comprising: a normal speed transfer mechanism for continuously sending the substrate preceding the lamination means at a normal speed, for transferring a trailing substrate to a standby position and at a speed higher than the normal speed toward the normal speed transfer mechanism; And a fastening mechanism, and a spacing mechanism for adjusting a gap between the preceding substrate and the trailing substrate so that the distance between the preceding substrate and the trailing substrate is constant. 제1항 또는 제2항에 있어서, 상기 기판이송수단이 급송이송기구를 상부위치와 하부위치 사이에서 상하 이동하기 위한 상승수단을 더 포함하고, 급송이송수단이 기판을 대기위치로 이송하고 또 기판을 정상속도 이송기구로 이송하기 위한 급속이송수단인 것을 특징으로 하는 장치.3. The substrate transport apparatus according to claim 1 or 2, wherein the substrate transport means further includes an elevating means for vertically moving the rapid transport mechanism between an upper position and a lower position, wherein the rapid transport means transports the substrate to a standby position and further Apparatus characterized in that the rapid transport means for transporting to the normal speed transport mechanism. 제2항 또는 제3항에 있어서, 상기 급송이송수단이 정상속도보다 빠른 두종류의 다른 속도로 급속이송수단을 구동하기 위한 2속도 구동수단을 포함하는 것을 특징으로 하는 장치.4. An apparatus according to claim 2 or 3, wherein the rapid traverse means comprises two speed drive means for driving the rapid traverse means at two different speeds faster than the normal speed. 제2항 내지 제4항중 어느 하나의 항에 있어서, 상기 기판이송수단이 기판의 이송방향에 정렬되어 대기 위치로 이송된 기판을 고정하기 위한 정렬수단을 포함하는 것을 특징으로 하는 장치.The apparatus according to any one of claims 2 to 4, wherein the substrate transfer means includes alignment means for fixing the substrate, which is aligned in the transport direction of the substrate and transported to the standby position. 제2항 내지 제5항중 어느 하나의 항에 있어서, 상기 스페이싱 기구가 선행기판과 후행기판사이의 간격으로부터 빠지거나 삽입되게 이동할 수 있는 스페이싱 요소를 더 포함하는 것을 특징으로 하는 장치.6. The apparatus of any one of claims 2 to 5, wherein the spacing mechanism further comprises a spacing element that is movable away from or inserted into the spacing between the preceding and trailing substrates. 제1항 내지 제6항중 어느 하나의 항에 있어서, 기판상의 인덱싱공과 정렬될 수 있게 하기 위하여 적층위치로 막의 이송통로에 상기 막에 엑세스공을 형성하기 위한 엑세스공 형성수단을 더 포함하는 것을 특징으로 하는 장치.7. The apparatus according to any one of claims 1 to 6, further comprising access hole forming means for forming an access hole in the film in the transfer passage of the film to the stacking position so as to be aligned with the indexing hole on the substrate. Device. 제7항에 있어서, 상기 엑세스공 형성수단이 기판의 인덱싱공을 검출하기 위하여 기판의 이송통로상의 적층위치에 배치된 검출기를 포함하고, 막 이송통로상의 한점에 배치되고, 막에 엑세스공을 형성하기 위하여 상기 검출기로부터 인덱싱공 검출신호에 응답하는 엑세스공 형성장치를 특징으로 하는 장치.8. The apparatus according to claim 7, wherein the access hole forming means includes a detector disposed at a stacking position on a transfer path of the substrate for detecting the indexing hole of the substrate, and is disposed at a point on the membrane transfer path, and forms an access hole in the film. And an access hole forming device responsive to the indexing hole detection signal from the detector. 제8항에 있어서, 상기 검출기와 상기 엑세스공 형성장치가 적층위치로부터 동등한 거리를 두고 배치되고, 엑세스공 형성장치가 엑세스공을 형성하고, 동시에 검출기가 인덱싱공을 검출하는 것을 특징으로 하는 장치.The apparatus according to claim 8, wherein the detector and the access hole forming apparatus are arranged at an equal distance from the stacking position, the access hole forming apparatus forms the access hole, and at the same time, the detector detects the indexing hole. 제8항에 있어서, 엑세스공 형성장치와 적층위치 사이의 거리(ℓ2)가 검출기와 적층위치 사이의 거리(ℓ1)보다 작고, 검출기가 인덱싱공을 검출한 후에 기판과 막의 이송속도(V)와 상기 거리들의 차(ℓ1-ℓ2)에 의하여 결정되는 시간(ℓ1-ℓ2)/V)이 경과한 후에 엑세스공 형성장치가 엑세스공을 형성하는 것을 특징으로 하는 장치.9. The transfer speed (V) of the substrate and the film according to claim 8, wherein the distance (L 2 ) between the access hole forming apparatus and the stacking position is smaller than the distance (L 1 ) between the detector and the stacking position, and the detector detects the indexing hole. And an access hole forming apparatus forms an access hole after a time (l 1 -l 2 ) / V determined by the difference between the distances (l 1 -l 2 ) and e). 제8항 내지 제10항중 어느 하나의 항에 있어서, 엑세스공을 형성할 때, 상기 엑세스공 형성장치가 막의 이송방향으로 막과 함께 이동가능하고, 엑세스공 형성장치를 엑세스공이 형성된 후에 본래위치로 복위하기 위한 복원스프링을 더 포함하는 것을 특징으로 하는 장치.11. The method according to any one of claims 8 to 10, wherein in forming the access hole, the access hole forming apparatus is movable together with the membrane in the conveying direction of the membrane, and the access hole forming apparatus is returned to its original position after the access hole is formed. The apparatus further comprises a restoring spring for restoring. 제8항 내지 제11항중 어느 하나의 항에 있어서, 상기 엑세스공형성장치가 펀치와 다이사이에 막이있고 서로 대향하여 위치한 펀치와 다이 및 상기 펀치를 구동하기 위한 구동수단을 포함하는 것을 특징으로 하는 장치.12. The apparatus as claimed in any one of claims 8 to 11, wherein the access hole forming apparatus includes a punch and a die having a film between the punch and the die and opposed to each other, and driving means for driving the punch. Device. 제8항 내지 제12항중 어느 하나의 항에 있어서, 상기 엑세스공 형성장치가 엑세스공이 형성될때 산출된 스크랩을 수납하기 위한 수납기를 포함하는 것을 특징으로 하는 장치.The apparatus according to any one of claims 8 to 12, wherein the access hole forming apparatus includes a receiver for receiving scrap calculated when the access hole is formed. 제1항 내지 제13항중 어느 하나의 항에 있어서, 연속적으로 상기 적층수단에 의하여 연속적으로 이송되는 적층된 기판들 사이의 틈새에 해당하는 위치에서 막을 절달하기 위한 절단수단을 더 포함하는 것을 특징으로 하는 장치.The cutting apparatus according to any one of claims 1 to 13, further comprising cutting means for delivering the film at a position corresponding to a gap between the laminated substrates continuously conveyed by the laminating means. Device. 제14항에 있어서, 절단수단이 적층된 기판과 막의 이송속도와 같은 속도로 그리고 같은 방향으로 이동하는 절단기대를 포함하고, 절단기날이 상기 절단기대에 의하여 고정되고 적층된 기판과 막의 이동방향에 수직하게 이동하고, 그것에 의하여 이송중 막이 기판들 사이의 틈새에 해당하는 위치에서 절단되는 것을 특징으로 하는 장치.15. The method according to claim 14, wherein the cutting means includes a cutting bar moving at the same speed and in the same direction as the feed rate of the laminated substrate and the film, wherein the cutting blade is fixed by the cutting bar and moves in the direction of movement of the stacked substrate and film. Moving vertically, whereby the film is cut at a position corresponding to the gap between the substrates during transfer. 제14항에 있어서, 절단수단이 적층된 기판과 막의 이송속도와 같은 속도로 그리고 같은 방향으로 이동하는 절단기대를 포함하고, 절단기날이 상기 절단기대에 의하여 고정되고 적층된 기판과 막의 이송방향에 수직하게 연장되고, 상기 절단기날이 막의 폭보다 큰 길이를 갖고 그것에 의하여 이송중 기판들 사이의 간격에 해당하는 부분에서 절단되는 것을 특징으로 하는 장치.15. The method according to claim 14, wherein the cutting means includes a cutting bar moving at the same speed and in the same direction as the feeding speed of the laminated substrate and the film, wherein the cutting blade is fixed by the cutting bar and is moved in the feeding direction of the laminated substrate and film. Extending vertically, said cutter blade having a length greater than the width of the film and thereby being cut at a portion corresponding to the spacing between substrates during transfer. 제16항에 있어서, 상기 절단수단이 절단기날을 가열하기 위한 가열기를 더 포함하는 것을 특징으로 하는 장치.17. An apparatus according to claim 16, wherein the cutting means further comprises a heater for heating the cutter blade. 제14항 내지 제17항중 어느 하나의 항에 있어서, 상기 절단수단이 정상의 이송속도 보다 빠른 속도로 절단에 의하여 다른 기판과 분리되도록 하는 이송수단을 포함하는 것을 특징으로 하는 장치.18. An apparatus as claimed in any one of claims 14 to 17, wherein the cutting means comprises transfer means for separating from other substrates by cutting at a rate faster than the normal transfer speed. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019850001702A 1984-03-16 1985-03-16 Printed circuit board laminating apparatus KR900002373B1 (en)

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
JP59049232A JPS60193653A (en) 1984-03-16 1984-03-16 Processor for escape hole of film member for laminating
JP84-49232 1984-03-16
JP59-49232 1984-03-16
JP59055247A JPS60200331A (en) 1984-03-24 1984-03-24 Coordinate input device
JP84-55247 1984-03-24
JP84-56150 1984-03-26
JP84-56152 1984-03-26
JP59056150A JPS60201900A (en) 1984-03-26 1984-03-26 Laminating device for printed substrate
JP59056152A JPS60201031A (en) 1984-03-26 1984-03-26 Apparatus for controlling operation of internal- combustion engine
JP84-56153 1984-03-26

Publications (2)

Publication Number Publication Date
KR850006845A true KR850006845A (en) 1985-10-16
KR900002373B1 KR900002373B1 (en) 1990-04-12

Family

ID=27462324

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850001702A KR900002373B1 (en) 1984-03-16 1985-03-16 Printed circuit board laminating apparatus

Country Status (1)

Country Link
KR (1) KR900002373B1 (en)

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Publication number Publication date
KR900002373B1 (en) 1990-04-12

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