JPS60201900A - Laminating device for printed substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention: Technical Field of the Invention The present invention relates to an apparatus used for manufacturing printed circuit boards, and more particularly to a printed circuit board laminating apparatus for laminating dry film photoresist, protective film, etc. on the surface of a printed board substrate. It is.

In this specification, the substrate of a printed board is abbreviated as a "printed board" or simply "substrate," and film members such as a dry film photoresist or protective film are collectively referred to as a "photoresist film" or "photoresist film."
Abbreviated as "resist film".

Background of the Technology In recent years, the mainstream method for manufacturing printed circuit boards is to form a photoresist layer on the surface of a conductor layer of a board such as a copper-clad board, and to form a wiring pattern using photolithography technology. In this case, the method of forming the photoresist layer is mainly by laminating a dry film of photoresist on the surface of the substrate.

In the past, resist film was laminated onto printed circuit boards by cutting a long strip of resist film to the length of the board and then cutting it one by one, but this method was inefficient and hindered mass production. Lacks sex.

Therefore, in recent years, a laminating apparatus has been developed that can continuously laminate a resist film in the form of a long strip onto a printed circuit board without cutting it. However, conventional laminating apparatuses of this type have problems as described below, and countermeasures have been desired.

Prior Art and Problems Conventional laminating equipment as described above laminates the printed circuit board on the surface of the printed circuit board by continuously feeding a long strip of resist film while continuously feeding the printed circuit board with a feed roller or the like at intervals. It is configured to be laminated by continuous thermocompression bonding using rolls.

In such a laminating apparatus, the printed circuit boards laminated with resist films are sent out from the laminating apparatus in a state where they are interconnected by the resist film, and the resist film is cut between each board to separate the boards into one piece.
You need to separate each piece. Further, the printed circuit board has reference holes formed therein to be used for alignment in various subsequent steps, and therefore it is necessary to form escape holes in the resist film to escape the reference holes of the substrate.

However, conventional laminating equipment does not have the function of cutting the resist film and forming the escape holes, and therefore, after the lamination process, the operator manually cuts the film and forms the escape holes using a knife or the like. . This not only hinders labor-saving or unmanned printed board manufacturing lines, but also inefficiencies and low productivity.Furthermore, defects in film cutting and escape hole machining, as well as chips from resist films and substrates, cause problems in subsequent production. Problems tend to occur in the photolithography process, resulting in poor quality printed boards and lower yields. - Furthermore, in the above-mentioned laminating apparatus, the interval between the printed circuit boards supplied to the laminating apparatus from the preceding printed circuit board processing section or printed circuit board or stock section becomes an important issue. For example, if the spacing between the substrates is too narrow, it will be difficult to cut the resist film after lamination, and if the spacing is too wide, the edges of the resist film protruding from the substrate after cutting will tend to curl up or wrap around. This will increase such problems.

Purpose of the Invention In view of the above-mentioned prior art, the present invention provides a method for feeding a printed circuit board at regular intervals, forming escape holes in a resist film before lamination, continuously laminating a resist film on a printed circuit board, and cutting the resist film after lamination. The purpose of the present invention is to provide a printed circuit board laminating device that can automatically and efficiently perform the following steps, thereby automating the printed circuit board laminating process, improving productivity, improving the quality of printed circuit boards, and ultimately improving yield. It is.

Structure of the Invention The printed circuit board laminating apparatus according to the present invention includes (a) continuous lamination on the surface of the printed circuit board by continuously feeding the printed circuit boards at intervals and continuously supplying a long strip-shaped film member; (b) a board constant-space feeding mechanism that feeds the printed circuit boards supplied from the printed board supply unit to the laminating mechanism while aligning them at regular intervals; an escape hole processing mechanism that processes escape holes in correspondence with the reference holes of the printed circuit board; and (d) the laminated printed circuit board and film member sent out from the lamination mechanism while continuously feeding the film member. The present invention is configured to include a cutting mechanism that cuts the printed circuit board at the gap portion.

Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same reference numerals indicate the same parts throughout the design.

FIG. 1 is a perspective view schematically showing the external appearance of an embodiment of the printed circuit board laminating apparatus (hereinafter simply referred to as "laminator") according to the present invention, and FIGS. 2 and 3 schematically show the overall structure thereof. They are a plan view and a side view, respectively. In these figures, reference numeral 1 indicates the entire laminator, and the laminator 1 basically includes a timing adjustment section 2, a laminate section 3,
and a cutting section 4. Also, Figures 2 and 3
Reference numeral 5 in the figure indicates a board supply unit that supplies the printed circuit board P to the laminator 1 from an upstream printed board processing unit or a printed board stock unit (not shown).

First, referring to FIGS. 2 and 3, the substrate supply section 5 and each section 2, 3, 4 of the laminator 1. The overall structure and operation of the system will be briefly explained. The substrate supply unit 5 transports the substrate P through a horizontal feeding path T (
3) in the direction of arrow A, and passes through free support roller 8 to laminator I.
It is configured such that the signal is supplied to the timing adjustment section 2 of.

The timing adjustment section 2 of the laminator 1 has a fast-feeding belt 1
1. It is equipped with a substrate constant interval feeding mechanism having a stopper 17, a guide roller 18, a width adjusting roller 19 (Fig. 2), a clamping roller 21, feeding rollers 22 and 23, a spacing pin 25, etc. The substrates P supplied from the substrate supply section 5 are aligned with a predetermined gap d (e.g. 2 to 3 ms+) from each other and are oriented correctly in the substrate feeding direction, and are then moved at a predetermined speed (e.g. 0.5 ms). 2 mm/min) to the next laminating section 3.

The laminating section 3 includes feed rollers 3L32, 33.34,
A laminating mechanism including a laminating roll 35, a free support roller 36, a resist film reel 37, etc.;
It is equipped with an escape hole machining mechanism having a punch unit 40, etc., and continuously feeds the substrate P fed from the timing adjustment section 2 in the previous stage at a constant speed V while maintaining the gap d between them. , a long strip-shaped resist film F (clearly indicated by hatching in FIG. 2) is continuously supplied at a speed equal to the feeding speed of the substrate, and the reference hole Hp ( Figure 2) and the corresponding escape hole Hf
After processing (FIG. 2), a resist film F is continuously thermocompressed onto both upper and lower surfaces of the substrate P, and the laminated substrate P and resist film F are sent to the next cutting section 4.

The cutting section 4 is equipped with a cutting mechanism having a feed roll 51, a feed belt 54, a cutter 60, etc., and cuts the resist while continuously feeding the laminated substrate P and the printing resist film F sent out from the laminating section 3. The film F is cut at the gap between the substrates P, and the substrates P are separated one by one and sent as indicated by arrow B to a subsequent substrate processing section or substrate stock section (not shown).

Next, each part 2, 3.4 of the laminator 1. I will explain in detail.

4 and 5, the timing adjustment section 2 is connected to the substrate supply section 5.
, and a plan view and a side view, respectively, shown together with a portion of the laminate part 3. The substrate constant interval feeding mechanism of the timing adjustment section 2 includes a pair of fast-feeding bells (11) provided at the front stage near the substrate supply section 5 along the substrate feeding path T (FIG. 5).
have. This fast-feeding belt 11 is a pulley 12.
13 horizontally wound around the belt or chain I
Driven by a two-speed variable speed motor M1 connected to a pulley 13 at 4, it is possible to perform two types of rapid forwarding of the board P at high speed v1 and low speed V2 (however, V<v, <v) as shown below. It is composed of Note that symbols S1, S2, and S3 indicate sensors for detecting the substrates P that are fed from the substrate supply section 5 to the fast-feeding belt 11 and are fast-forwarded, and although these sensors are not clearly shown in the figure, they each have light-emitting elements and It is a photosensor consisting of a light receiving element.

The fast-feeding belt 11 is mounted on a support base 15 that can be raised and lowered vertically by a linear morph M2, and is placed in the upper direction N (initial position ) and an upper position where the upper surface of the belt is approximately at the same level as the substrate feeding path T as shown by the dotted line 11'.The lifting stroke is, for example, 15 to 20 mo+.This fast-feeding belt A stopper 17 is arranged near the rear end when the stopper 11 is at the initial position (lower position).
As will be described later, this is for stopping the substrate P fast-forwarded by the fast-forwarding belt 11 at a predetermined standby position. Incidentally, reference numerals s4 and S5 indicate sensors for respectively detecting the initial position and the upper position of the fast-feeding belt 11, and these are the aforementioned photosensors or mechanical microswitches.

As shown in FIG. 4, fixed guide rollers 18 and adjustment rollers 19 movable in the horizontal direction (arrows z1, Z2) perpendicular to the substrate feeding path T are arranged on both sides of the fast-feeding belt 11, respectively. The width adjustment roller 19 is driven by a cylinder SYI using air or the like, and presses the substrate P at the standby position on the fast-feeding belt 11 against the guide roller 18 so that the substrate P is in a predetermined position and faces straight in the substrate feeding direction. It has the effect of cent. Note that the spring 2° is used to adjust the substrate pressing force of the cylinder SYI.

As shown in FIG. 5, a clamping roller 21 is provided above the fast-feeding belt 11 and facing the pulley 13 thereof. The clamping roller 21 is always urged downward by a spring 21a, and as described later, a fast forwarding bell)
When the belt 11 rises, it clamps the substrate P placed on it, and works together with the fast-forwarding belt 11 to move the substrate P at a low speed V,
This is a fast feed method.

A pair of feeding rollers 22 and 23 are arranged downstream of the clamping roller 21, that is, on the side of the laminating section 3. The lower roller 22 is constantly driven by a belt or chain 24 in synchronization with the feed roller 31 of the laminating section 3, and can feed the substrate P at a predetermined speed V. The upper roller 23 is a driven roller that can be moved up and down by a cylinder SY2 using air or the like. This upper feeding roller 23 is normally in the upper position (initial position),
The substrate P rapidly fed by the fast feeding belt 11 and the clamping roller 21 can freely pass between the feeding rollers 22 and 23, but as will be described later, when the substrate fast feeding ends, the substrate P is moved downward. It is configured to be clamped between the feed roller 22 and feed the substrate P at a constant speed V.

Reference numerals S6, S7, and S8 indicate the above-mentioned photosensors for detecting the substrate P that is fed rapidly or at a constant speed along the feeding path T, and S9 indicates the upper feeding roller. 23 shows a photosensor or microswitch as described above for detecting the lower position of 23.

Further, two spacing pins 25 on the left and right (see FIG. 4) are provided at the rear stage of the feeding rollers 22 and 23, that is, on the side of the laminating section 3. The spacing pin 25 is made equal to a predetermined substrate spacing d, and is configured to be inserted between the substrates P by being driven up and down by a cylinder SY3 using air or the like. On the other hand, the cylinder SY3 is attached to a slider 28 attached to a horizontal guide rod 27 of a fixed support 26', so that the spacing pin 25 is connected to the feed roller 22.
Feed roller 31 shown in forward position near 23 and dotted line 25'
It is movable in parallel to the substrate transport path T between the rear position close to As will be described later, the spacing pin 25 is normally located at the lower front position (initial position), and the rear end of the board P is located at the spacing pin 2.
5, it is raised as shown in FIG. When the subsequent substrate P is rapidly fed by the fast-feeding belt 11 and the clamping roller 21, the front end of the succeeding substrate P pushes the trailing substrate P as shown by the dotted line 25' in FIGS. 4 and 5, and the rear end of the preceding substrate P is is confronted with. As a result, the distance between the front and rear substrates P is set to d. After that, the spacing pin 25 is removed from between the substrates P, and the support base 26 and the slider 28
It is returned to the initial position by a return spring 29 stretched therebetween. Incidentally, the reference numeral SlO indicates the above-mentioned photosensor or microswitch for detecting the rear position 25' of the slider 28, that is, the spacing pin 25.

Now, the constant interval feeding of the substrates P by the timing adjustment section 2 as described above will be explained in detail based on the process diagrams shown in FIGS. 6A to 6 and the time chart shown in FIG. 7. Furthermore, the 6th A
Only related parts are schematically shown in the sixth to fifth figures, and only the operations of the sensors S1 to SIO, the motor ML M2, and the cylinders SYI to SY3 are shown in FIG.

(a) First, as shown in FIG. 6A, it is assumed that at the time of starting, the fast-feeding bell l-11, the upper feeding roller 23, and the spacing pin 25 are all in their initial positions. In this state, when the first substrate P1 is sent by the feed belt 7 of the supply section 5,
When the substrate P1 passes over the support roller 8 by more than half, it tilts diagonally and the front end rests on the fast-feeding belt 11.

(As shown in FIG. 6B), when the sensor s1 detects the substrate PL, the motor M1 drives the fast-feeding belt 11 at high speed, and the substrate P1 is fast-forwarded at a high speed v1.

(C) Next, as shown in FIG. 6C, when the sensor S2 detects the front end of the substrate P1, the dirt M1 is switched to low speed drive, and the substrate P1 is decelerated to a low speed v2 and hits the stopper 17. Then sensor S3 detects substrate P1,
The driving of the motor M1, that is, the fast-feeding belt 11 is stopped, and the substrate P1 is made to stand by at that position. At the same time, as shown in FIG. 4, the cylinder SYI is actuated by the signal from the sensor s3 to drive the width adjustment roller 19 in the direction of arrow Z1, thereby pressing the substrate PL against the guide roller 18 and setting it at a predetermined position and in the correct direction.

Td1 Furthermore, the signal from the sensor S3 causes the motor M2 to operate as shown in FIG.
The substrate P1 is raised to the upper position as shown in FIG.
It is clamped by a clamping roller 21 at the upper feeding position. Incidentally, when the fast-feeding belt 11 reaches the upper position, it is detected by the sensor s5 and the motor M2 is stopped.

te1 Next, the motor M1 is again driven at a low speed as shown in FIG. 6E by the same signal from the sensor 4J:S5, and the substrate P1 is moved from the feeding position to the feeding rollers 22 and 23 by the fast-feeding belt 11 and the clamping roller 21. It is fed quickly at low speed v2.

ffl Then, as shown in FIG.
1 stops. At the same time, the cylinder SY2 is actuated and the upper feeding roller 23 descends in the direction of arrow Y3, clamps the substrate P1, and starts feeding it at a predetermined speed (2). On the other hand, the lowering of the upper feeding roller 23 is detected by the sensor S9, and the motor M2 is reversely driven by the signal, and the fast-feeding belt 11 is lowered as shown by the arrow Y2, and when it returns to the initial position, this is detected by the sensor S4. Motor M2 stops. Furthermore, as shown in FIG. 4, the cylinder SYI is actuated by the signal from the sensor S9, and the width adjusting roller 19 returns to the direction of the arrow Z2.

(g1 Next, as shown in Fig. 6G, feed rollers 22, 2
The first substrate P1, which is fed at a constant speed at step 3, is fed to the feed roller 31 of the laminating section 3, and then continues to be fed at a constant speed V.

On the other hand, the second substrate P2 from the substrate supply section 5 is transferred to the fast-forwarding belt 11 which has returned to the initial position as described in (C) above with reference to FIGS. 6A to 6C. It is supplied, fast-forwarded at high speed V and low speed V2, and then brought to a widthwise position and waits at a predetermined position.

(hl and as shown in FIG. 6H, when the rear end of the first substrate P1 passes the sensor S6, the motor M2 is activated and the (
As in the case of FIG. 6D described in d), the fast-feeding belt 11 rises and the second substrate P2 is moved to the clamping roller 2.
Clamped at 1.

(11) Next, as shown in FIG. 61, when the rear end of the first substrate P1 passes the sensor S7, the cylinder SY3 is actuated, and the spacing pin 25 is raised in the direction of arrow Y5 and inserted between the substrates P1 and 22. At the same time, cylinder SY2 operates,
The upper feed port/-ra 23 returns to the initial position as shown by arrow Y4. At the same time, motor M1 is driven at low speed again.
The second substrate P2 is rapidly fed by the fast-feeding belt 11 and the clamping roller 21 at a low speed v2.

0) Then, as shown in Fig. 6J, the second substrate P2, which is being fed in rapid traverse, follows the first substrate P1, which is being fed at a constant speed, while pushing the spacing pin 25 at the front end (V2 > v) ,
It abuts against the rear end of the first substrate PlO via the spacing pin 25. As a result, the gap d between the first base FiPI and the second substrate P2
is set to a predetermined value.

(k) When the spacing pin 25 reaches its rear position, this is detected by the sensor SlO, and the cylinder S
Y2 is activated, and the upper feeding roller 23 descends in the direction of arrow Y3 to clamp the second substrate P2. At the same time, the cylinder SY3 operates again to remove the spacing pin 25 from between the substrates P1 and P22 in the direction of the arrow Y6. As a result, the substrates P1 and P
2 are continuously fed at a constant speed V while maintaining a predetermined distance d from each other. On the other hand, the spacing bin 25 that has been pulled out downward is returned to the initial position (indicated by the dotted line) in the front direction by the return spring 29 as shown by the arrow X2. At the same time, the lowering of the upper feeding roller 23 is also detected by the sensor S9, and as described above, the fast-feeding belt 11 is lowered and returned to the initial position by the motor M2.

After +11, the same steps as in the case of the second substrate P2 explained in (g) to (kl) are repeated for each substrate after the third substrate P3 (FIG. 6). As is clear from the figure, the sensor S8 is connected to the first substrate P1.
It is only used for detection.

In this way, the substrates P supplied from the substrate supply section 5 are aligned at predetermined intervals in the timing alignment section 2 and are continuously transferred to the laminate section 3 even if there are variations in the substrate spacing at the time of supply. It will be shipped.

Next, FIG. 8 is an enlarged side view of the main part of the laminate section 3. As shown in FIG. The laminating mechanism of the laminating unit 3 includes feed rollers 31, 32, 33, 34 and a laminate, which are arranged at approximately equal intervals along the substrate feed path T and are constantly rotated in synchronization with each other by a drive mechanism (not shown). It has a roll 35, whereby the substrates P fed from the timing adjustment section 2 in the previous stage are continuously fed through the laminating roll 35 in the direction of the arrow at a constant speed 2 while maintaining the distance d between them.

There are two types of lamination methods: normal pressure method and vacuum method.
Although the present invention can be used in either method, the illustrated example is a vacuum method, in which the feed rollers 31 and 34 at both ends also serve as seal rolls to maintain airtightness.

Further, as shown in FIG. 3, resist film reels 37 are provided above and below the substrate feeding path T, and a roll-shaped resist film F is loaded onto these reels. The resist film F is pulled out from these upper and lower reels 37,
As shown in FIG. 8, the long strip is passed through the guide roller 38 and transferred to the laminating roll 35 at the same speed as the feeding speed V of the substrate P.
and are continuously thermocompression bonded to the upper and lower surfaces of the substrate P, respectively.

As shown in cross section in FIG. 9, the resist film F is wound into a roll with a thin protective film Fa made of polyethylene or the like applied to both upper and lower surfaces, and when pulled out from the reel 37, the protective film on one side is removed. Fa is peeled off by a peeling means (not shown) and laminated onto the substrate P on the surface from which the protective film has been peeled off, as shown in cross section in FIG. 1θ. In addition, the width of the resist film F is generally narrower than the width of the substrate P, and as is clear from FIG. 2 and FIG. be done.

In the resist film cutting step, which will be described later, the film is cut by detecting the substrate spacing d using a photosensor at the side of the substrate where the resist film F is not laminated.

Furthermore, the escape hole processing mechanism of the laminating section 40 includes a photo sensor for detecting the reference hole Hp of the substrate P, which is composed of a light emitting element 48a and a light receiving element 48b, and is arranged at a position on the way to the laminating roll 35 on the substrate feeding path T. Sll, and a guide for processing a relief hole Hf that is arranged in the resist film supply path between the resist film reel 37 (FIG. 3) and the laminate roll 35 and escapes the reference hole H9 of the substrate P. It has a punch unit 40.

In the illustrated embodiment, as shown in FIGS. 2 and 4, reference holes H are formed on both left and right sides of the substrate P, and therefore, the reference large detection sensor Sll is located on both left and right sides of the substrate feed T. There are two sets of Gouy Punch units 40 on both the left and right sides, two on the top and two on the top and a total of four, but the figure shows only one set of sensor Sll and two Gouy Punch units 40 on one side. This is an indication.

As shown in cross section in FIG. 8, the gouy punch unit 40 has a die 41 and a punch 42 facing each other with a continuously supplied resist film F in between. The punch 42 is connected to a piston rod 44 of a cylinder 43 using air or the like, and as described later, when a sensor Sll detects the reference hole Hp, the cylinder 43 is actuated based on the signal, and the punch 42 moves the die 41 as shown by arrow a. is driven towards
The resist film F is punched out to form escape holes Hf. When the sensor S12 provided on the gouer 41 side detects that the punch 42 has broken through the resist film F and reached the die 41, the cylinder 43 is reversely operated and the punch 42 moves between the die 41 and the resist film as shown by the arrow. Pulled out from F. Reference numeral 47 indicates a stripper for pulling out this punch. Note that the optical path of the sensor S12 is
This can be ensured by providing a through hole or notch in a part of the die 41. The scraps of the resist film F are accommodated in a housing section 45 provided in the die 41, thereby preventing contamination of the surface of the substrate P and the inside of the device. In addition, when punching such escape holes,
Since the resist film F is continuously fed at a constant speed, the goo-punch unit 40 is configured to be movable together with the resist film F from the initial position as indicated by arrow C to the punching end position indicated by reference numeral 40'. There is. That is, while the punch 42 is inserted into the die 41, it is pulled by the resist film F and reaches near the punching end position 40', and when the cylinder 43 is reversely operated and the punch 42 is pulled out from the die 41 and the resist film F. The return spring 46 causes the gouy punch unit 40 to move in the direction of arrow d.
It returns to the initial position as shown in .

In the illustrated example, the reference size detection sensor 311 and the Gui Punch unit 40 are located at a distance from each laminating roll 35! 1 and 2 are arranged so that they are equal (z+ = Jz). And the sensor Sll is connected to the substrate P.
The Goo punch unit 40 is configured to form an escape hole Hf in the resist film F at the same time as detecting the reference hole Hp. As a result, the escape hole Hf is machined at a position equidistant from the laminating roll 35 with respect to the reference hole Hp detected by the sensor Sll, and therefore, when it is sent to the position of the laminating roll 35 as shown in FIG. The holes Hp and Hf will be accurately overlapped. Such a sensor Sll and Gui Punch Uni.
According to the arrangement of the groove 40, even if the feeding speed V of the substrate P and the resist film F is changed, the reference hole Hp and the relief hole Hp can be maintained.
The relative position with f does not change, and accurate overlay can always be obtained without any adjustment.

On the other hand, it is also possible to configure the distance β1.12 between the sensor Sll and the guide punch unit throat 40 to be different. However, in this case 2. >It2, and a certain period of time (j!+) determined by the difference between both distances (Ill-It2) and the feeding speed V of the substrate and resist film after the sensor Sll detects the reference hole Hp.
It is sufficient if the configuration is such that the gouging punch unit 40 performs the escape hole machining at )/Vt. This is, for example, the 11th
As shown in the block diagram in the figure, the control circuit 4 of the escape hole machining mechanism
9 is provided with a pulse generator and a pulse counter that generate a number of pulses proportional to the feeding speed V of the substrate and the resist film, and after inputting the reference hole detection signal from the sensor Sll, at the time Cj+l-z)/V. After counting the corresponding partial number of pulses, the Gui Punch unit 40
This is possible by configuring the drive signal to output a drive signal.

As described above, in the laminating section 3, the machining mechanism processes the relief holes in the resist film F before lamination.
Furthermore, the lamination mechanism allows the resist film F to be laminated onto the substrate P automatically and efficiently and satisfactorily.

The laminated substrates P are interconnected by a resist film F at a predetermined interval d and are sent to the next cutting section 4 via a rear feed roller 34 and a support roller 36.

Next, FIG. 12 is a perspective view showing the configuration of the cutting section 4, and FIGS. 13, 14, and 15 are detailed views of the main parts thereof.

As is clear from FIGS. 3 and 12, in the cutting section 4, a feed roller 51 is provided at the front stage along the substrate feeding path T, and pulleys 52, 53 (particularly clearly shown in FIG. 3) are provided at the rear stage. Two horizontally wound feed belts 54 are provided, and a driven roller 55 (12th
(Only one is shown in the figure). feed roller 5
1 and the feed heald 54 transfer the rows of substrates P (hereinafter referred to as "substrate rows") interconnected by the resist films F sent out from the laminate section 3 to the laminate section 3.
The structure is such that the substrate can be continuously fed in the direction of arrow B at substantially the same speed as the substrate feeding speed . That is, as shown in FIGS. 12 and 13, the feed belt 54 is
52 is connected to a main shaft MS, and this main shaft MS is connected to a main motor M.
3, it is rotated in the direction of arrow N1 via the worm gear W, thereby driving the feed heald 55 in the same direction. On the other hand, the feed roller 51 is driven by a chain CHI suspended between the sprocket SPI of the main shaft MS and the sprocket 5P2 (FIG. 12) of the lower feed roller 51. in this case,
The number of teeth of the sprockets SPI and SF3 is set so that the latter has a larger number of teeth (SPI<5P2)\, so that the circumferential speeds of the feed roller 51 and the feed belt 54 are constant speed V and slightly faster v''(v<v').The advantages of such a configuration will be described later.

Further, between the feed roller 51 and the feed belt 54, there is a sensor S13 for detecting the gap d of the substrates P of the substrate row continuously fed by these two, and a sensor S13 for cutting the resist film F of the substrate row at the gap d. A cutter 60 is provided for this purpose. The sensor 313 is a photo sensor consisting of a light emitting element 66a and a light receiving element 66b, as shown in FIG. The substrate gap d is detected at the side where the substrate is not exposed.

As shown in FIG. 12, the cutter 60 has a canter base 61 that is longer than the width of the substrate P and is disposed so as to extend above the substrate row feed T at right angles to the substrate row feed direction B. The cutter base 61 is supported at both ends by support plates 62, and these cutter base support plates 62 extend parallel to the substrate row feeding direction B along guide rails (not shown) provided on both sides of the substrate row feeding path T. Direction (arrows X3 and X in Figure 12)
It is possible to move back and forth to 4).

A cutter support plate 63 is attached to the cutter base 61 along a guide rail (not shown) in its longitudinal direction, that is, in a horizontal direction perpendicular to the board row feeding direction B (arrows Z3 and Z in FIG. 12).
4) so that it can be moved back and forth. A cutter holder 64 is provided on the cutter support plate 63 so as to be movable up and down in the vertical direction (arrows Y7 and Y8 in FIG. 15) by a cylinder SY4, and a razor-shaped canter blade 65 is held in this holder 64. . By raising and lowering the canter holder 64 in the directions of arrows Y7 and Y8 using the cylinder SY4, the cutter blade 65 is moved between an initial position higher than the top surface of the substrate row and a cutting position (15th
(Figure).

Further, the cutter base 61 is provided with a reversible motor M5 and a chain CH6 for driving the cutter support plate 63, that is, the cutter blade 65 in the directions of arrows Z3 and X4. The chain cH6 is wound around a sprocket 7) provided at both ends of a thin blade hese 61, and both ends are connected to a cutter support plate 63. The motor M5 is provided on the cutter base support plate 62 on one side, and is connected to the chain CH.
It is connected to one sprocket of 6. Therefore, the cutter support plate 63 moves from the initial position shown in FIG. 12 in the direction of arrow
By the reverse rotation of , it moves from the cutting end position in the direction of arrow X4 and returns to the initial position. In addition, the code S14.515 (12th
Fig. 1) shows a photosensor or a microswitch for detecting the initial position and cutting end position of the '117 tar support plate 63, respectively.

Further, the cutter base 61 is reciprocated in the directions of arrows X3 and X4 by the following drive mechanism.

That is, as shown in FIG. 12, two chains CH5 are each wound around four sprockets on both sides of the substrate row feeding path T in a rectangular shape when viewed from the side, and each chain CH5
Both ends of the cutter base support plate 62 are connected to the front and rear ends of each cutter base support plate 62. One of the four sprockets of each chain CH5 is connected to a common second subshaft AS2, and this second subshaft As2 is connected to sprockets SP6 at both ends of the first subshaft AS1 by two chains CH4. ing(
(Especially clearly shown in Figures 13 and 14). This first sub-axis ASI
is also provided with two sets of sprockets SP4, SF3 and magnetic clutches MCI, MC2, and as shown in FIG. 13, the first sprocket SP4 is connected to the sprocket SP3 of the main shaft MS by a chain CH2, and the second sprocket SP5 is It is connected to the output shaft of the sub motor M4 by a chain CH3. Magnetic clutches MCI and MC2 use electromagnets to connect and disconnect sprockets SP4 and SF3 with the first sub-shaft ASI, respectively, and normally both clutches MCI and MC2 are in the rOFF (off) state. Both sprockets SP4 and SF3 are in a free state. In this state, the first sub-shaft ASI is not driven by either of the motors M3 and M4, and therefore the cutter base 61 is not driven and is stopped at an initial position biased towards the feed roller 51 side. Then, when the first clutch MCI becomes rON (on), the first sub-shaft ASI is coupled to the sprocket SP4, and is driven to rotate forward in the same direction N1 by the main shaft MS (that is, the main motor M3) via the chain CH2. Ru. Therefore, as is clear from Fig. 12, the chain CH
4. The cutter base 61 is driven in the same direction as the substrate row feeding direction (arrow X3) via the second sub-shaft AS2 and the chain CH5. Note that the driving speed of the cutter base 61 in the direction of arrow X3 is the same as the substrate feeding speed (2).

Also, when the first clutch MCI is turned OFFJ and the second clutch MC2 is turned ON, the first sub-shaft As1 is shifted from the sprocket SF3 to the other sprocket SP5.
The rotation direction N1 of the main shaft MS is reversely rotated by the auxiliary motor M4 through the chain CH3 in a direction N2 opposite to the rotation direction N1 of the main shaft MS. Therefore, as shown in FIG. 12, the chain CH4, second sub-shaft AS2, and chain CH5 are also driven in the opposite direction, and the force and turbine base 61 are
It is driven in four directions and returned to its initial position. In addition, code 31
6 (FIG. 12) shows a photo sensor or microswivel notch for detecting the initial position of the cutter base support plate 62, that is, the cutter base 61.

The cutting of the resist film F of the substrate array in the cutting section 4 as described above is performed as follows. The row of substrates sent out from the laminating section 3 in the previous stage is sent at a constant speed ■ by the feed roller 51 and the feed heald 54, and when the gap d between the substrates P reaches the position of the sensor S13 as shown in FIG. 15, the sensor S13 detects the rear end of the preceding board P, and the cylinder SY
4 is activated, and the cutter blade 65 descends to the cutting position as shown by arrow Y7. At the same time, motor M5 is activated to drive cutter support plate 63 in the direction of arrow Z3.

Further, when the canter blade 65 is lowered, the first clutch MCI is turned ON, and the cutter base 61 is driven by the main motor M3 in the direction of the arrow X3 at a constant speed (3). As a result, the canter blade 65 moves in the same direction X3 at the same speed V as the substrate row, as shown in FIG. The actual locus of the canter blade 65 is oblique to the substrate array feeding direction B as shown by the dotted line in FIG. 2), and cuts the upper and lower resist films F approximately along the center line of the gap d. In this case, the preceding substrate P is sent by the feed belt 54, and the following substrate P is sent by the feed roller 51, but as described above, the feed speed v' of the feed belt 54 is higher than the feed speed of the feed roller 51. Since the speed is slightly faster than the speed V, a slight tension acts on the resist film F connecting both substrates P, and good cutting is possible.

After cutting, when the cutter blade 65 reaches the cutting end position (indicated by reference numeral 65' in FIG. 2), the sensor 5
15, the cutter drive motor M5 stops, the cutter support plate 63 stops, and at the same time, the first clutch MC
I becomes rOFFJ and the cutter base 61 stops,
Furthermore, the cylinder SY4 moves forward and is pulled up to the initial position as shown by the arrow Y8.Then, the motor M5 is reversed to increase the force and the vine support plate 6.
3 returns to the initial position as shown by arrow Z4, and sensor 31
It is detected and stopped at 4. At the same time, the second clutch MC
2 is turned "ON", the force/cutter base 61 is returned to the initial position by the auxiliary motor M4, is detected by the sensor S16, and is stopped.

On the other hand, the substrate P, which has been separated from the substrate row by cutting the resist film F, is moved by the feeding bell (544) at a speed slightly higher than the substrate row feed speed V' (as described above) to gradually increase the distance from the substrate row. The substrate is spread out and sent in the direction of arrow B, and sent to the next substrate processing section or substrate stock section (not shown).

As described above, the cutting section 4 can automatically and efficiently cut the resist film F after lamination, without causing harmful damage to the substrate P and the resist film F.

Next, FIG. 16 is a perspective view of the second embodiment of the cutting section, and FIG.
Figure 7 is a detailed diagram of the main part. The basic structure and operation of this cutting section 4A are almost the same as those of the above-mentioned cutting section 4, and the structure and operation of the force/tutter 70 are simply the same as those of the above-mentioned cutter 60.
There are only some differences. That is, the laminate part 3
The row of substrates from
13. Further, the force/cutter 70 has a cutter base 71 and a cuckoo base support plate 72 that are almost the same as those of the cutter 60 described above, and the cutter base 71 is driven by the arrow arrow by the drive mechanism completely similar to that of the force/cutter 60. It is driven back and forth in the X3 and X4 directions. Therefore, only the differences between Chikara Tsuta-70 and Kakuro 0 will be explained below.

A pair of left and right cutter support plates 73 are fixed to the cutter base 71 of the cutter 70, and a force/cutter holder 74 is attached to each of these cutter support plates 73 in the vertical direction (Fig. 1T) by a cylinder SY5 using air or the like. As shown in the figure, a cutter blade 75 longer than the width of the resist film F is operated by these holders 74 through a heat insulating material. A heater 76 such as a nichrome wire heater is attached to the upper part of the canter blade 75.
The blade edge portion of No. 5 is heated to a required temperature (for example, 70 to 80°C). It should be noted that although there is no problem in cutting even if the force/nozzle blade 75 is not heated, cutting becomes extremely easy if heated. In addition, the heater can be connected to Kanku Blade'I.
Instead of attaching it to the heater number 5, a large canter holder may be used to incorporate the heater number G therein. canter blade 75
is to operate the cylinder SY5 and apply force/7ter holder 74.
It is raised and lowered between the initial position and the cutting position (FIG. 17) by raising and lowering. Incidentally, symbols S17 and SI8 indicate photosensors or microswitches for detecting the initial position and cutting position of the force/7 turbine blade 75, respectively.

With the above-described configuration, when the sensor S13 detects the substrate row d, the cylinder SY5 is activated and the canterplane V is activated.
75 descends in the direction of arrow Y7, and at the same time cutter 6
As in the case of 0, the first clutch MC'l becomes rON'J, and the cutter blade 71 is driven by the main motor M3 at a constant speed V in the direction indicated by the arrow. As a result, the cutter blade 75 moves in the same direction X3 at the same speed as the substrate row as shown in FIG. Cut by heating at approximately center i of d. In addition, 7'f% 7"7"
(FIG. 17) A multi-solution for the vine blade 75 is shown from i. When cutting is completed, the cylinder SY5 is moved by the sensor S18, and the cutter blade 75 is moved to the mark Y.
'113 )Of (n 'l
” = return. Then, the sensor S17 causes the first clutch MCI to turn OFF as in the case of the cutter 60.
'', the second clutch Mcz,i<roNJ, and the force/judge pace 71 is driven in the direction of arrow X4 by the auxiliary motor M4, returns to the initial position, is detected by the sensor S16, and stops.

In this manner, the resist film can be cut automatically and in a good manner in the case of the fourth embodiment of the second embodiment as well as in the fourth embodiment of the i-th embodiment.

The above laminator has the following advantages.

(B) First, in the timing adjustment section, the substrate fixed interval feeding mechanism can align the substrates P at predetermined intervals and with the substrate feeding direction correctly facing, and continuously feed them to the laminate section. Continuous lamination of a long strip-shaped resist film and cutting of the resist film at the cutting section can be performed efficiently and favorably.

(b) In addition, in the laminating section, the laminating mechanism continuously laminates the resist film onto the substrate, and prior to lamination, the relief hole processing mechanism forms relief holes corresponding to the reference holes of the resist film substrate. This eliminates the need for manual hole machining after the lamination process. In addition, the escape hole machining mechanism can efficiently and satisfactorily process escape holes, and there is no possibility of contamination of the substrate or equipment by chips during the escape hole machining process.

(c) Furthermore, the resist film of the laminated substrate array can be efficiently and favorably cut in the gap between the substrates by the cutting mechanism in the cutting section, thus eliminating the need for manual cutting.

Effects of the Invention As described above, according to the present invention, it is possible to feed printed circuit boards at regular intervals, to form escape holes in the resist film before laminating the printed circuit board, to continuously laminate the resist film to the printed circuit board, and to laminate the resist film after lamination. A laminating device that can automatically cut resist films efficiently and efficiently has been realized, and this technology has enabled automation of the printed circuit board lamination process, improved productivity, improved quality of printed circuit boards, and improved yield. The commercial and economic effects are significant.

[Brief explanation of drawings]

FIG. 1 is a perspective view schematically showing the external appearance of an embodiment of a printed x board laminating apparatus according to the present invention, FIGS. 2 and 3 are a plan view and a side view, respectively, schematically showing the overall structure of the laminating apparatus, and FIG. Figures 6 and 5 are plan and side views, respectively, of the timing adjustment section of the laminating apparatus, and Figures 6A to 6 and 7 are process diagrams and timing diagrams of feeding printed circuit boards at regular intervals in the timing adjustment section, respectively. Chart, FIG. 8 is a partially sectional side view showing the main parts of the laminating section of the laminating device, FIG. 9 is a cross-sectional view of the resist film, FIG. 10 is a cross-sectional view of the printed cutting board and resist film after lamination, and FIG. FIG. 11 is a block diagram of the control system of the clearance hole machining mechanism, FIG. 12 is a perspective view showing the configuration of the first embodiment of the cutting section of the laminating device, and FIGS. 13, 14, and 15 are FIG. FIG. 16 is a perspective view showing the configuration of a second embodiment of the cutting section, and FIG. 17 is a detailed view of the main portion of the cutting section in FIG. 16. DESCRIPTION OF SYMBOLS 1... Printed circuit board laminating device, 2... Timing alignment section, 3... Laminating section, 4.4A... Cutting section, 5... Board supply section, 7.-Feeding belt, 11.
... Rapid feed heald, 17... Stopper, 21... Clamping roller, 22.23... Feeding roller, 25.
... Spacing bins 31.32, 33.34... Feed roller, 35... Laminating roll, 37... Resist film reel, 40... Die/punch unit, 41
...Die, 42...Punch, 43...Cylinder,
51... Feed roller, 54... Feed belt, 60.
70... Cutter, 61.71... Cutter base, 65.75... Cutter, 76... Heater, P.
...Printed circuit board, Hp...reference hole, F...resist film, Hf...relief hole, T...board or board row feed path, 51~51B...sensor, Ml~+15・
...Motor, SYI~SY5...Cylinder. Patent applicant Fujitsu Limited Patent applicant Representative Patent attorney Akira Aoki Patent attorney Kazuyuki Nishidate Patent attorney Yukio Uchida Patent attorney Akira Yamaguchi Figure 6A Figure 6B Figure 60 Figure 6D Figure 6E Figure 1 Fig. 6F Fig. 6G Fig. 23 Fig. 6H Fig. 61 Fig. 6J Fig. 3 Fig. 6 Fig. 13 Fig. 513 Fig. 17 Fig. 76 13

Claims (1)

[Claims] 1. A printed circuit board laminating device that laminates a film member on the surface of a printed circuit board, comprising: (a) continuously feeding a long strip-shaped film member while continuously feeding the printed circuit board at intervals; a laminating mechanism that continuously laminates the printed circuit boards on the surface of the printed circuit board by supplying the printed circuit boards at regular intervals; (c) an escape hole machining mechanism for machining escape holes in the film member in correspondence with the reference holes of the printed circuit board while the film member is being supplied; and (d) a laminated print sent out from the lamination mechanism. A printed circuit board laminating apparatus comprising a cutting mechanism that cuts the film member at a gap between the printed circuit boards while continuously feeding the board and the film member.