JPS6296245A - Conveying device for substrate - Google Patents

Abstract

PURPOSE:To laminate a thin film on a substrate in an accurate manner, by installing a substrate width adjusting device shifting mechanism which accords the center line of a substrate width adjusting device with that of the thin film to be stuck to the substrate. CONSTITUTION:The center line of a substrate 17 is conveyed up to a thermal pressure deposite position in the state that it accords with the center line of a conveying device 16. At this time, with a substrate position sensor, drive of feed rollers 16A is stopped, while a tension member 24 comes to shift beneath and hold the substrate 17, making it unmovable. Simultaneously with this, a substrate support member 25 comes to be projected, supporting the substrate 17 so as not to be dropped. Afterward, thermal pressure deposite rollers 14 move to the left toward the substrate 17, and hold the substrate 17 in between as interposing a laminated body 1B being temporarily subjected to thermal pressure deposition. In this state, these thermal pressure deposite rollers 14 and feed rollers 16A are driven so that the laminated body 1B is laminated on the substrate 17 by means of thermal pressure deposition.

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Purpose of the invention [Industrial field of application] The present invention relates to a substrate conveyance device, and particularly relates to a thin film pasting device!
The present invention relates to a technique that is effective when applied to a substrate transport device used in an 8A position.

[Prior Art] A printed wiring board used in electronic equipment such as a computer has a predetermined pattern of wiring made of copper or the like formed on the surface or both surfaces of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, a laminate consisting of a photosensitive resin (photoresist) layer and a transparent resin film (protective film) to protect it is thermocompression laminated (attached) onto a conductive layer provided on an insulating substrate. . This thermocompression bonding lamination I- is carried out in mass production using a thin film pasting device called a laminator. Thereafter, a wiring pattern film is placed on the laminate, and the photosensitive resin layer is exposed to light for a predetermined period of time through the wiring pattern film and the transparent resin film. After the transparent resin film 1 is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern.

Thereafter, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is further removed to form a printed wiring board having a predetermined wiring pattern.

[Problems to be solved by the invention] 'I!' of the aforementioned printed wiring board. The 5 manufacturing process requires a step of thermocompression laminating (adhering) a laminate consisting of a photosensitive resin layer and a translucent resin film to a substrate having conductive layers on both sides of an insulating substrate.

The laminate to be applied to the substrate is obtained by pulling out the laminate continuously wound around the supply roller of the thin film adhering device and cutting it in accordance with one method of the substrate.

The substrate conveying device that conveys the substrate to the position of the thermocompression roller is provided with a plurality of rotating bodies each having a plurality of disc-shaped rollers (pinch rollers) inserted therein, and rotates the rotating bodies to move the substrate. When approaching the thermocompression roller, the board is moved to the center line in the transport direction using a fixed guide member.
It is caught in a thermocompression roller.

However, even if the substrate is accurately set on the transport center line, the supply position of the thin film to be lane met and the set position of the substrate may deviate from each other, and in such a case, it is difficult to correct the amount of deviation.

The above-mentioned and other problems and novel features to be solved by the present invention will become clear from the description of this specification and the accompanying drawings.

(2) Structure of the Invention [Means for Solving Problems] Among the inventions disclosed in this application, a brief overview of typical inventions is as follows.

That is, the present invention is a substrate conveyance device that conveys a substrate using a conveyance roller and a holding roller.

A substrate width adjustment (course correction) device that matches the center line in the transportation direction of the substrate transportation device with the center line in the substrate transportation direction, and a center line of the substrate width adjustment device and J! The present invention is equipped with a substrate alignment device movement mechanism that temporarily aligns the center line of the thin film to be laminated, and further includes a substrate position detection sensor that starts the operation of the substrate width alignment device, and stops the tIJ operation of the substrate width alignment device. The present invention is characterized in that it includes a substrate width detection sensor for detecting the width of the substrate.

[Operations] In the present invention, the conveyance roller is driven to convey the substrate on the conveyance roller while being pressed by the presser roller. When a substrate is being transported, the leading edge or trailing edge of the transported substrate is detected by a substrate position detection sensor, and this detection signal starts the operation of a substrate width adjustment (course correction) device. A substrate width detection sensor attached to a substrate width adjustment (substrate course correction) device detects both ends of the substrate, and this detection signal causes the operation of the substrate width adjustment device to be stopped. As a result, the substrate can be transported to the thermocompression roller position with the center line of the substrate in the transport direction accurately and easily aligned with the center line of the substrate in the transport direction.

In addition, even if the substrate is set accurately on the center line of the substrate transfer device, if the supply position of the thin film to be lane met is misaligned with the set position of the substrate, the substrate width adjustment device moving mechanism will move the substrate width adjustment device. The amount of deviation can be corrected by aligning the center line with the center line of the thin film laminated on the substrate.

[Example 1] The present invention was applied to a substrate conveying device used in a thin film pasting device (laminator) for thermocompression laminating a laminate consisting of a photosensitive resin layer and a transparent resin film to a printed wiring board. An applied example will be described with reference to the drawings.

It should be noted that in all the examples, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

FIG. 2 shows a schematic configuration of a thin film pasting device using a substrate conveying device according to an embodiment of the present invention.

In the thin film pasting device of this embodiment, as shown in FIG. is wrapped around. The laminate 1 of the supply roller 2 is a laminate made of a transparent resin film (protective film) IA, a photosensitive resin layer with the - side (adhesive side) exposed, and a transparent resin film by the peeling roller 3. It is separated into IB.

The separated translucent resin film IA is configured to be wound up by a winding roller 4.

The leading end of the laminate IB in the supply direction is configured to be attracted to the main vacuum plate 6 via a tension roller 5 that applies appropriate tension. The main vacuum plate 6 is supported by a frame 8 via an air cylinder 7 whose position can be varied in the direction of the arrow. The main vacuum plate 6 is attached to the laminated body IB to prevent wrinkles etc. from occurring together with the tension roller 5.
is configured so as to supply it to the substrate 17 side.

The arc-shaped portion 6A at the tip of the main vacuum plate 6 is
A heater 6B is provided inside the laminate I.
The tip portion of B is laminated onto the conductive layer of the substrate 17 by thermoforming and pressure bonding.

A rotary cutter 9 for cutting the continuous laminate IB in accordance with the dimensions of the substrate 17 is provided at a position close to the arc-shaped portion 6A.

A sub-vacuum plate 1o is provided at a position facing the rotary cutter 9 to attract the seat end portion of the cut laminate IB to the arc-shaped portion 6A. This sub-vacuum plate 1o is supported by the frame 8 via an air cylinder 11 whose position can be varied in the direction of arrow B.

A frame 8 that supports the main vacuum plate 6 and the sub-vacuum plate 10 is supported by a frame 13 of the main body of the apparatus via an air cylinder 12 whose position can be varied in the direction of arrow C.

The laminated body IB is laminated on the conductive layer of the substrate 17 with a circular arc-shaped portion 6A at its tip by thermoforming and press-bonding.

The entire body is laminated by thermocompression using a thermocompression roller 14. The thermocompression roller 14 is a laminate I.
After the tip of B is temporarily thermocompressed with the arc-shaped portion 6A, it is moved from the position indicated by the dotted line marked 14' in FIG. 2 to the position indicated by the solid line.

The rear end portion of the laminate IB cut by the rotary cutter 9 is guided by a diagonal rotary vacuum plate 11 to prevent wrinkles, etc., and is laminated by thermocompression bonding with a thermocompression roller 14. has been done.

The thin film tensioning (=1) device configured in this manner is transported by the substrate transporting device 16 consisting of transport rollers 16A, presser rollers 16B, etc., according to the above-mentioned configurations. The laminate IB is thermocompression laminated on a substrate 17 having a conductive layer on one side (one side). The substrate 17 is configured to be laminated with Hp pressure bonding on the substrate 17 so that the conductor 7IiWJ surface is bonded to the substrate 17. It is about to be removed.

The IIIfA8 configuration of the substrate transport device 16 is shown in FIG.

As shown in FIG. 1, the substrate conveyance device 16 is a thin film pasting device! ! (Laminator) 1.

The conveyance rollers 16A are made of a cylindrical member (solid or hollow, preferably hollow) made of fiber-reinforced plastic, and the number of conveyance rollers 16A is rotatably attached to the frame 2o of the main body of the substrate conveyance device 16. There is. The plurality of transport rollers 16A are arranged at predetermined intervals so that the ends of the thin substrate 17 do not sag. Also, every other conveyance roller 16A among the plurality of conveyance rollers 16A
only one is connected to a driving source (not shown). Kuki I again! JJ'g may be connected to every second conveyance roller 16Δ or all conveyance rollers 16A k: as necessary.

The substrate 17 is placed on the conveyance roller 16A, and is conveyed while being pressed by a presser roller 16B.Waviness and warping of the thin substrate 17 is corrected. This pressing roller 16B is used to hold the substrate 17 when using a very thin substrate that is easily wavy or warped.
It is made of a cylindrical member like the conveyance roller 16A, and is rotatably attached to the frame 20 so that the end portion thereof is not stopped by being caught by a rotating body made of a disc-like member. Although the presser roller 16B is not connected to a drive source, it may be connected. Furthermore, when using the substrate 17 which is not very thin and is less susceptible to waving or warping, the pressing roller 16B may be a rotating body having a plurality of disc-shaped members inserted therein.

Reference numeral 21 denotes a substrate width adjustment device, which is used to align the center line in the transportation direction with the center line of the substrate 17 in the transportation direction.This substrate width adjustment device 21 is shown in FIG. As shown in FIG. 4 (cross-sectional view) and FIG.

21A' are each slidably attached to the support rod 2IC. And the support members 21A, 21A'
are attached to an endless belt 21E that is wound around a pulley 21D and a pulley 21D' so that when the endless bell 1-21E moves in the direction of the arrow, they approach each other. Support member 21A.

The sliding movement of 21A' is performed by an air cylinder 211 provided on support member 21A'. The pulley 21D
, 2 L D' are inverted-shaped support members 21 F, respectively.
, 21 F'. These inverted-shaped support members 21F, 21F' are engaged with the screw studs 21G. A handle 21H is attached to the screw stud 21G, and by rotating the handle 2LH, the inverted-shaped support member 21F is opened.

21F' is configured to move left and right while keeping the distance therebetween constant. This moving mechanism (or fine-adjustment mechanism) can be used in the event that the center line in the transport direction of the substrate 17 and the center line in the transport direction of the laminate IB to be laminated by thermocompression bonding, that is, the center line of the board transport bag [16] are misaligned. , In order to match both, the board width adjustment device i! 2
This is to adjust the 21st place. Board width adjustment device 16
The position of is fixed using the screw 2 that fixes the rotation of the threaded rod 21G.
It will be held in 1J.

Reference numeral 22 denotes a substrate position detection sensor for detecting the front end (or rear end) of the substrate 17, and is used to generate a driving start signal for the substrate width shifting members 21B and 21B' of the substrate width shifting device 21. This substrate position detection sensor 22 is attached to the frame 20 via a support frame 228. The substrate value In output sensor 22 uses, for example, a reflective optical sensor.

Reference numerals 23Δ and 23B are substrate width detection sensors that detect both ends of the substrate 17, respectively, and are used to generate drive stop signals for the substrate width adjustment members 21B and 21B' of the substrate width adjustment device 21. This board width detection sensor 23Δ, 23B
are attached near the tips of the supporting members 2IA, 21A' in the transport direction, and inside the substrate width adjusting members 21B, 21B'. That is, the substrate width detection sensors 23A and 23B detect when the center line of the substrate 17 and the center line of the substrate transport device 16 match.

It is provided at a position where the board width adjustment members 21B, 21B' are stopped. The board width adjusting device 21 is controlled by a board width detection sensor 23A using a delay circuit.

This can be easily realized by detecting the both ends of the substrate 17 by 23B and generating the drive operation stop signal for the substrate width adjustment members 21B and 21[3' with a slight delay. For example, a transmission type optical sensor is used as the substrate width detection sensors 23A and 23B.

In this way, the substrate width adjusting device 21 is provided to match the center line of the substrate 17 in the conveying direction with the center line of the substrate conveying bag [16] in the conveying direction.

By providing the substrate position detection sensor 22 that starts the operation of the substrate width adjustment device 21 and the substrate width detection sensors 23A and 23B that stops the operation of the substrate width adjustment device 21, it is possible to The 1 m board 17 can be accurately and easily transported to the thermocompression bonding start position in a state where the center line of the transport device 16 in the transport direction is aligned with the substrate 17 without causing any deflection.

In addition, in order to automatically control the substrate width adjustment device moving mechanism that matches the center line of the substrate width adjustment device and the center line of the thin film laminated on the substrate, the predetermined position of each of the upper and lower laminates 1 to the thin film supply path is adjusted. A thin film width detection sensor (not shown) for detecting the width of the laminated thin film is provided at the position, and these detection signals and oil mud substrate width detection sensors 23A, 2
Control 3B! (not shown), the upper and lower laminated thin films are aligned by software, and the substrate width adjusting device movement mechanism is controlled to laminate the substrate 17 with the center line of the board width adjusting device. It is also possible to match the center line of the thin film.

The substrate holding member 24 shown in FIG. 1 is used to fix the substrate 17 and hold it so that it does not fall when the substrate 17 reaches the thermocompression bonding starting position.

As shown in FIG. 5 (side view), this board holding member 24 is moved in the direction of arrow E by means of an air cylinder and a spring (not shown). There is. In addition, this board holding member 24
The substrate support member 25 protrudes in the direction of arrow F in conjunction with or in conjunction with the driving operation. The substrate support member 25 is controlled in the direction of arrow F by an air cylinder 25A provided on the +7f frame 20, as shown in FIG. 6 (side view). The operation of the substrate holding member 24 or the substrate supporting member 25 is controlled by a drive start signal or a 1 drive stop signal from a substrate position detection sensor (not shown).

By providing the substrate holding member 24 and the substrate support member 25 in this manner, when the substrate 17 reaches the thermocompression bonding starting position, the substrate 17 is supported so that it does not fall, and the thermocompression rollers sandwich the substrate 17 from above and below. Since the substrate 17 can be held in a predetermined position until the substrate 17 is removed, the laminate IB can be accurately thermocompressed and laminated onto the substrate 17.

Next, the operation of the substrate conveyance apparatus of this embodiment will be briefly described.

In FIG. 1, the substrate 17 is moved by driving a predetermined conveyance roller 16A among the plurality of conveyance rollers 16A.
It is conveyed toward the thermocompression roller 14 . When the substrate 17 is transported and its leading edge is detected by the substrate position detection sensor 22, the substrate width adjustment device 2 is activated by a drive start signal.
1 starts its operation. Board width adjustment device! ! 21 is
The substrate width adjusting members 21B and 21B' operate to align the center line of the substrate 17 and the center line of the substrate transport device 16. After that, the board width detection sensors 23A, 23
When both ends of the substrate 17 are detected by B, the operation of the substrate width adjusting device 21 is stopped by this drive operation signal. As a result, the substrate 17 is transported to the thermocompression bonding position in a state in which the center line of the substrate 17 in the transport direction matches the center line of the substrate transport device 16 in the transport direction. At this time, a substrate position detection sensor (not shown) stops the drive of the conveying roller 16Δ, and the holding member 24 moves downward to move the substrate 1.
Hold down 7 to prevent it from moving. At the same time, the substrate support member 25 protrudes and supports the substrate 17 so that it does not fall.

Thereafter, as shown in FIG. 2, the thermocompression roller 14 moves to the left toward the substrate 17, and the thermocompression bonded laminate I
The substrate 17 is sandwiched with B interposed therebetween.

In this state, the thermocompression roller 14 and the conveyance roller 16A are driven to press and laminate the laminate IB onto the substrate 17.

Although the present invention has been specifically described above based on Examples, it goes without saying that the present invention is not limited to the above-mentioned Examples and can be modified in various ways without departing from the gist thereof.

For example, in the above embodiment, when correcting the positional deviation between the substrate and the thin film to be laminated by the substrate width adjustment device moving mechanism, the set positions of the upper and lower laminated thin films are detected and automatically controlled. However, it is also possible to fix one of the set positions of the upper and lower laminated thin films, make only the other set position movable, and detect the position of only the movable set position.

Further, the present invention can be applied to a substrate conveyance device used in a thin film attachment device.

[Effects of the Invention] As explained above, according to the present invention, a substrate width adjustment device is provided that matches the center line of the substrate in the transportation direction with the center line of the substrate transportation device in the transportation direction, and the substrate width adjustment device By providing a substrate width adjusting device movement mechanism for correcting the amount of deviation between the center line of the substrate and the center line of the thin film to be laminated on the substrate, it is possible to easily correct the positional deviation between the substrate and the thin film to be laminated. Because I can do both.

Thin films can be accurately laminated onto substrates.

Furthermore, by providing the center line of the substrate width adjustment device, a substrate position detection sensor that starts the operation of the substrate width adjustment device, and a substrate width detection sensor that stops the operation of the substrate width adjustment device, it is possible to maintain the center line of the substrate in the transport direction. The substrate can be accurately, precisely, and easily transported to the thermocompression bonding starting position in a state where the line and the center line in the transport direction of the substrate transport device are aligned without causing any deflection in the board.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a schematic configuration of a substrate conveyance device according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a schematic configuration of a thin film pasting device related to a substrate conveyance device of this embodiment. , FIG. 3 is a sectional view taken along the line Y--Y in FIG. 1, and FIG. 4 is a perspective view showing the configuration of the substrate width adjustment device in FIG. 3. 5 is a side view showing the structure of the substrate width detection sensor, the holding member, and the substrate support member shown in FIG. 1, and FIG. 6 is a side view showing the structure of the substrate support member shown in FIG. 1. In the figure, 16... Board transport device, 16A... Transport roller, 16B... Press roller, 20... Frame of main body of board transport device, 17... Board, 21... Board width adjustment Device, 21Δ, 2LA'...Support member, 21B. 21B'... Board width adjustment member, 21C... Support rod, 2
1E...Endless bell 1-521D, 2LD'...Pulley. 21F, 21F'...Inverted support member, 21G...Threaded rod, 211(...Handle, 21J...Fixing screw,
22: Substrate position detection sensor, 23A, 23B: Substrate width detection sensor, 24: Substrate holding member, 25: Substrate support member.

Claims (5)

[Claims] (1) A substrate conveyance device that conveys a substrate using a conveyance roller and a holding roller, comprising a substrate width adjustment device that aligns a center line in the conveyance direction of the substrate conveyance device with a center line in the conveyance direction of the substrate; 1. A substrate conveyance device comprising a substrate shifting device moving mechanism that aligns the center line of the substrate shifting device with the center line of a thin film attached to the substrate. (2) A substrate conveyance device that conveys a substrate using a conveyance roller and a holding roller, and a substrate width adjustment device that aligns a center line in the conveyance direction of the substrate conveyance device with a center line in the conveyance direction of the substrate; A substrate position detection sensor that starts the operation of the substrate width adjustment device, a substrate width detection sensor that stops the operation of the substrate width adjustment device, and a center line of the substrate width adjustment device and a center line of a thin film attached to the substrate. A substrate conveyance device characterized by comprising a substrate width adjustment device moving mechanism for matching. (3) The substrate transport device according to claim 2, wherein the substrate position detection sensor is installed at a predetermined position before the substrate width detection sensor. (4) The substrate transport device according to claim 2 or 3, wherein the substrate position detection sensor detects a leading end or a trailing end of the substrate. (5) The substrate conveying apparatus according to claim 2 or 3, wherein the substrate width detection sensor detects an edge of the substrate in the width direction.