JPH0653536B2 - Substrate transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (1) Object of the Invention [Industrial field of use] The present invention relates to a substrate transfer apparatus, and more particularly to a thin film stripping apparatus,
The present invention relates to a technique effectively applied to a substrate transfer device used for a thin film sticking device or the like.

[Prior Art] A printed wiring board used in an electronic device such as a computer is one in which a predetermined pattern of wiring such as copper is formed on one side or both sides of an insulating substrate.

This type of printed wiring board can be manufactured by the following manufacturing process.

First, a laminated body including a photosensitive resin (photoresist) layer and a translucent resin film (protective film) that protects the photosensitive resin (photoresist) layer is thermocompression-bonded laminated (attached) on a conductive layer provided on an insulating substrate. . This thermocompression-bonding lamination is mass-produced by a thin film sticking device, a so-called laminator. After this,
A wiring pattern film is superposed on the laminate, and the photosensitive resin layer is exposed for a predetermined time through the wiring pattern film and the transparent resin film. Then, the translucent resin film is peeled off by a thin film peeling device, a so-called peeler, and then the exposed photosensitive resin layer is developed to form an etching mask pattern. After that, unnecessary portions of the conductive layer are removed by etching, and the remaining photosensitive resin layer is removed to form a printed wiring board having a predetermined wiring pattern.

[Problems to be Solved by the Invention] In the above-described manufacturing process of a printed wiring board, a step of peeling a transparent resin film on a photosensitive resin layer with a thin film peeling device before developing the photosensitive resin layer. Is needed. The substrate is transported to the thin film peeling device by a substrate transport device having a disc-shaped or column-shaped transport roller.

In this type of substrate transfer apparatus, the center line in the transfer direction of the substrate is aligned with the center line of the substrate transfer path so that the substrate is transferred to the accurate peeling position of the thin film peeling apparatus. . This alignment is performed by a fixed guide member provided on the substrate transfer path of the substrate transfer device.

However, the contact between the substrate and the transport roller has an appropriate frictional force so that slippage or the like does not occur when the substrate is transported. For this reason, particularly in a thin substrate, there is a problem in that a curve is generated during alignment, accurate alignment cannot be performed, and the substrate is damaged.

The above and other problems and novel features to be solved by the present invention will be apparent from the description of the present specification and the accompanying drawings.

(2) Configuration of the Invention [Means for Solving the Problems] In order to achieve the above object, the present invention is a substrate transfer device for transferring a substrate by rollers, wherein a center line in the transfer direction of the substrate transfer device is provided. And a substrate center aligning device that aligns the center line of the substrate in the transport direction, and a substrate is floated from the roller so as to reduce the frictional force between the substrate and the roller during the operation of the substrate center aligning device. A substrate levitation device, a substrate leading end detection means for detecting a leading end portion of a substrate to be transported, which is provided at a predetermined position of a substrate transport path, and a movable portion of the substrate center alignment device, which is provided at a predetermined position. The transfer board side edge detecting means for detecting the side edge of the board and the operation of the board levitation apparatus and the board center aligning apparatus are started based on the output signal of the board tip detecting means, Based on the output signal of the end detecting means, characterized by comprising a means for stopping the operation of the substrate center alignment apparatus.

[Operation] According to the above-mentioned means, the leading edge of the substrate conveyed by the substrate leading edge detection means is detected, and the side edge portion of the transported substrate is detected by the transportation board side edge detection means. The operation of the substrate levitation device and the operation of the substrate center alignment device are started based on the output signal of the substrate leading edge detection means, and the operation of the substrate center alignment device is stopped based on the output signal of the transfer substrate side edge detection device. As a result, the center line of the substrate transfer device in the transfer direction can be accurately and easily aligned with the center line of the substrate transfer direction. In particular, even a thin substrate can be aligned without causing bending or damage. Moreover, since the above-mentioned alignment can be automatically performed during the transportation of the substrate, the manufacturing time can be significantly shortened.

Further, since the transfer board side edge detecting means for detecting the side edge of the transfer board is provided at a predetermined position of the moving portion of the board center aligning device, the transfer direction of the board transfer apparatus regardless of the size of the board. It is possible to accurately and easily match the center line in the substrate transfer direction with the center line.

[Examples] Hereinafter, the present invention was applied to a substrate transfer device used in a thin film peeling device (peeler) for peeling a translucent resin film that protects a photosensitive resin layer that is thermocompression-laminated on a printed wiring board. An embodiment will be described with reference to the drawings.

In all the drawings of the embodiments, those having the same function are designated by the same reference numerals, and the repeated description thereof will be omitted.

FIG. 1 (schematic configuration diagram) shows a thin film peeling apparatus and a substrate transfer apparatus connected to the thin film peeling apparatus, which is an embodiment of the present invention.

The printed wiring board 1 (see FIG. 4) is an insulating board 1A on which conductive layers 1B such as copper are formed on both surfaces (or one surface). A photosensitive resin layer 1C and a translucent resin (protection) film 1D are sequentially laminated and integrated on a conductive layer 1B of a printed wiring board (hereinafter, simply referred to as a board) 1.

The substrate 1 on which a predetermined wiring pattern film is stacked and the photosensitive resin layer 1C is exposed by the exposure device is configured to be transported in the arrow direction along the substrate transport path indicated by the line AA in FIG. . A thin film peeling device I and a substrate transfer device II, each of which has a transfer roller 2 for transferring the substrate 1 and a transfer control roller 3, are provided on the substrate transfer path.

The transport roller 2 and the transport control roller 3 are composed of a columnar member (solid or hollow: preferably hollow) made of fiber reinforced plastic. A plurality of transport rollers 2 and transport control rollers 3 are rotatably attached to the respective body frames of the thin film peeling apparatus I and the substrate transport apparatus II. The transport roller 2 and the transport control roller 3 are arranged at a predetermined interval so that the end of the thin substrate 1 does not hang down. The transport control roller 3 is partially or wholly connected to a drive source (not shown). Further, the transport roller 2 is not connected to the drive source, but may be connected to the drive source as necessary.

The pair of upper and lower conveyance control rollers 3 (or may be the conveyance rollers 2) are configured to hold down the substrate 1 being conveyed. This is especially designed to correct the curvature and the like of the thin substrate 1. Further, when the substrate 1 having a relatively large thickness and a small curvature is used, the transport roller 2 and the transport control roller 3 may be configured by a rotating body in which a plurality of disc-shaped members are skewered.

The thin film peeling device I is mainly composed of a protrusion pressing mechanism 4, a fluid spraying mechanism 5, and a thin film carrying-out mechanism 6.

The substrate transfer device II is mainly composed of a substrate center alignment mechanism 7 and a substrate floating mechanism 8 and is connected to the thin film stripping device I.

As shown in FIGS. 1 and 2 (perspective view), the substrate center alignment mechanism 7 of the substrate transfer device II is configured to match the center line in the transfer direction of the substrate 1 with the center line in the transfer direction. Has been done. Substrate center alignment mechanism 7
Means that the substrate alignment members 7B and 7A are attached to the support members 7A and 7A '.
It is configured to support B '. Board alignment member 7
B and 7B 'are in contact with the end portions in the width direction (direction substantially perpendicular to the transport direction) of the substrate 1 transported on the substrate transport path AA, and the substrates are aligned with the center line in the transport direction of the substrate transport device II. 1
It is configured so as to match the center line of the conveyance direction. The substrate alignment members 7A and 7A 'are formed in a cylindrical shape, but may be formed in a plate shape, for example.

The support members 7A and 7A 'are slidably attached to the support rod 7C, respectively. The support members 7A and 7A 'are pinion (gear) 7D and racks 7E,
It is connected via 7E '. The support member 7A has an L
An air cylinder (or hydraulic cylinder) 7F is attached via a character-shaped member (no reference numeral is attached).
The substrate center aligning mechanism 7 configured as described above is configured such that when the shaft of the air cylinder 7F is moved in the direction of the arrow B, the substrate aligning members 7B and 7B 'approach each other. This board center alignment mechanism 7
It is supported by the frame 7G.

The nut member 7H provided on the bottom of the frame 7G (first
(Refer to the figure), the screw rod 7J rotated by the control handle 7I
Are engaged. The frame 7G has a control handle 7I
Is rotated to move in the width direction of the substrate 1 (direction of arrow C). This moving mechanism (or fine adjustment mechanism) is configured to match the center line of the substrate transfer device II in the transfer direction and the center line of the substrate center alignment mechanism 7 when they are misaligned. The position of the moving mechanism (substrate center alignment mechanism 7) is fixed by the screw rod 7i that fixes the rotation of the screw rod 7J.

The substrate position detection sensor S ₁ shown in FIG. 1 detects the front end (or the rear end) of the substrate 1 in the transport direction and generates a drive start signal for the substrate alignment members 7B and 7B ′ of the substrate center alignment mechanism 7. It is supposed to do. The substrate position detection sensor S ₁ is supported by the frame 7G or the frame of the substrate transfer device II. The substrate position detection sensor S ₁ is, for example,
A reflective optical sensor is used.

The substrate position detection sensor S ₂ shown in FIGS. 1 and 2 detects both ends of the substrate 1 in the width direction, and generates a drive stop signal for the substrate alignment members 7B and 7B ′ of the substrate center alignment mechanism 7. It is supposed to do. This substrate position detection sensor S
₂ is provided on the support members 7A, 7A 'on the center line side of the substrate alignment members 7B, 7B'. The substrate position detection sensor S ₂ is configured to stop the substrate alignment members 7B and 7B 'when the center line of the substrate transfer device II in the transfer direction matches the center line of the substrate 1 in the transfer direction. There is. Substrate alignment members 7B, 7
The control of B ′ is performed by using the delay circuit to detect the substrate position detection sensor S
_This can be easily realized by generating the drive operation stop signal with a slight delay after both ends of the substrate 1 are detected by ₂ . The substrate position detection sensor S ₂ is, for example, a transmissive optical sensor.

In this way, the substrate center position alignment mechanism 7 for aligning the center line in the transport direction of the substrate 1 with the center line in the transport direction of the substrate transport device II is provided, and the substrate position detection for starting the operation of the substrate center alignment mechanism 7 is performed. By providing the substrate position detection sensor S ₂ that stops the operation of the sensor S ₁ and the substrate center alignment mechanism 7, the center line of the substrate transport device II in the transport direction is set to the substrate 1 in the transport direction center line of the substrate transport device II. Accurate and easy matching (positioning) can be achieved without causing bending or damage.

Further, since the transfer board side edge detecting means for detecting the side edge of the transfer board is provided at a predetermined position of the moving portion of the board center aligning device, the transfer direction of the board transfer apparatus regardless of the size of the board. It is possible to accurately and easily match the center line in the substrate transfer direction with the center line.

The support members 7A, 7A of the substrate center alignment mechanism 7
The moving mechanism of A'is racks 7E, 7E 'and pinion 7D.
Instead of this, a belt and a pulley may be used. Further, the support members 7A and 7A 'are replaced by the air cylinder 7F,
The pinion 7D may be directly rotated by the servo motor to move the pinion 7D.

As shown in FIG. 1, FIG. 2 and FIG. 3 (perspective view), the substrate levitation mechanism 8 is configured so that the substrate 1 and the conveyance roller 2 or the conveyance control roller 3 are activated during the operation of the substrate center alignment mechanism 7. Is configured to reduce the frictional force (friction resistance).
The substrate floating mechanism 8 includes movable members 8B, 8 having a dogleg shape and having rollers 8A, 8A 'for reducing frictional force in the width direction of the substrate 1.
It is rotatably attached to one end of B '. Roller 8
A and 8A ′ may be made of the same material as the transport roller 2 or the transport control roller 3, for example. Movable members 8B, 8
B'is a T-shaped support member 8 rotatably about a rotary shaft 8C.
It is supported by D and is attached to the frame 8E. The support member 8D supports two movable members 8B and 8B '. The frame 8E includes a board center alignment mechanism 7
It is attached to the frame 7G.

The other end portion of the movable member 8B, 8B 'are sliding member 8G ₁ to 8 g ₄ which slides a guide member 8F which is provided on the frame 8E
Is attached to. Movable member 8B, 8B ', as a rotation about the rotation axis 8C, is configured to rotate the sliding of the sliding member 8G ₁ ~8G _4. Movable members 8B, 8
B 'is so as to rotate smoothly with the rotating shaft 8C, is attached to the sliding member 8G ₁ to 8 g ₄ through a hole in a relatively flexibility and long hole, the large diameter hole. Between the guide member 8F and the sliding member 8G ₁ to 8 g _4, the sliding member 8G
_It has an appropriate clearance so that _{1 to} 8 G ₄ can slide smoothly.

The sliding members 8G ₁ and 8G ₂ and 8G ₃ and 8G ₄ are connected by a connecting member 8g, respectively, and are configured to slide in the same direction. The sliding members 8G ₁ and 8G ₃ are configured to have a longer dimension than the sliding members 8G ₂ and 8G ₄ , and the rotating shaft 8H
They are connected via a rotating member 8I that rotates with. The connecting portion between the rotating member 8I and the sliding member 8G ₁ or 8G ₃ is configured to be pressed by the shaft of the air cylinder (or hydraulic cylinder) 8J. In addition, the connecting portion of the rotating member 8I allows the sliding members 8G ₁ and 8G ₃ to slide,
It is composed of long holes. Further, elastic members 8K that pull each other are connected to the sliding members 8G ₁ and 8G ₄ .

The substrate floating mechanism 8, operating the shaft of the air cylinder 8J in the direction of arrow D, the rotary member 8I is rotated in the arrow E direction, the sliding member 8G ₁ to 8 g ₄ is moved in the arrow F, F 'direction Is configured. This sliding member 8G ₁
The movement of ~ 8G ₄ is to move the rollers 8A, 8 around the rotary shaft 8C.
A'can be rotated in the directions of arrows G and G '. The rotation of the rollers 8A and 8A 'causes the substrate 1 to float above the transport roller 2 or the transport control roller 3.

Like the substrate center alignment mechanism 7, the substrate levitation mechanism 8 is configured such that the substrate position detection sensor S ₁ starts its operation and the substrate position detection sensor S ₂ stops its operation.

Further, the substrate position detecting sensor of the substrate floating mechanism 8 may be provided separately from the substrate center position adjusting mechanism 7.

Further, the substrate levitation mechanism 8 may float the substrate 1 with a spherical member instead of the rollers 8A and 8A ′ so that the frictional force between the substrate 1 and the transport roller 2 or the transport control roller 3 is reduced.

Thus, the substrate center alignment mechanism 7 for aligning the center line of the substrate transport device II in the transport direction with the center line of the substrate 1 in the transport direction is provided. By providing the substrate levitation device 8 that levitates the substrate 1 so as to reduce the frictional force with the transport roller 2 or the transport control roller 3, the center line in the transport direction of the substrate transport device II is aligned with the center line in the transport direction of the substrate transport device II. The lines can be accurately and extremely easily aligned without causing the substrate 1 to be curved or damaged. The substrate floating device 8 is particularly effective for the thin substrate 1.

The substrate levitation device 8 can automatically levitate the substrate 1 by operating the substrate position detection sensor S ₁ and stopping the operation by the substrate position detection sensor S ₂ .

In this substrate transfer device II, the substrate 1 that has been subjected to the above-described alignment is transferred to the thin film peeling device I.

As shown in FIG. 4 (schematic configuration diagram), the projection pressing mechanism 4 of the thin film peeling device I is provided with a needle-shaped projection pressing member 4A on the end portion of the photosensitive resin layer 1C and / or the translucent resin film 1D. It is configured to apply stress. Specifically, first, when the front end of the substrate 1 is detected by the substrate position detection sensor S ₃ , the front end of the substrate 1 in the carrying direction and the position setting shown in FIGS. 4 and 5 (perspective view) are set. The member 4B abuts. The substrate position detection sensor S ₃ is composed of, for example, a transmissive optical sensor. Position setting member 4B is a detection signal of the substrate position detection sensor S _3, an air cylinder, and is configured to move up and down in the arrow H direction by the drive device 4C such as an electromagnetic solenoid. Next, the tip of the projection pressing member 4A is brought into contact with the conductive layer 1B at the end in the transport direction of the photosensitive resin layer 1C and the translucent resin film 1D. Protrusion pressing member 4
A is configured so as to be movable in the direction of arrow I by gears 4E and 4F centering on a rotating shaft 4D. Then, the protrusion pressing member 4 is moved by the operation in the arrow J direction by the gear 4G and the rack 4H.
A is moved in the direction of arrow J '(rightward in the figure) (the gears 4E, 4F move with the movement of the protrusion pressing member 4A). By the movement of the projection pressing member 4A, as shown in FIG. 6 (enlarged cross-sectional view of the main part), stress is applied to the end portions of the photosensitive resin layer 1C and / or the translucent resin film 1D.
Thereafter, as shown in FIG. 4, the projection pressing member 4A is retracted in the arrow J'direction (left direction in the drawing). Retraction of the projection pressing member 4A is mainly performed by the rack 4H and an elastic member (not shown) provided on the shaft 4D and acting in the arrow J direction (left direction in the drawing).

In this way, by applying stress to the end portions of the photosensitive resin layer 1C and / or the translucent resin film 1D of the substrate 1 with the needle-shaped protrusion pressing member 4A, as indicated by reference numeral K in FIG. 7, A gap can be formed between the photosensitive resin layer 1C and the translucent resin film 1D. This gap is a material in which the photosensitive resin layer 1C is considerably softer than the translucent resin film 1D, and when the end portion of the photosensitive resin layer 1C is pushed in,
It occurs because the end of the translucent resin film 1D is raised.

Further, a gap can be formed between the photosensitive resin layer 1C and the translucent resin film 1D by the protrusion pressing member 4A having a simple needle-like structure.

Further, by providing the protrusion pressing member 4A in the substrate transporting path of the substrate 1, it is possible to automatically form a gap between the ends of the photosensitive resin layer 1C and the translucent resin film 1D.

The photosensitive resin layer 1C and the translucent resin film 1D, which have a gap, do not generate heat even if pressed by the transport roller 2 or the transport control roller 3 while being transported to the fluid spraying mechanism 5. Since they are not crimped, they will not be glued again.

In addition, in this embodiment, the photosensitive resin layer 1C is applied to the substrate 1.
Considering that the transparent resin film 1D and the transparent resin film 1D are distorted and thermo-laminated, three protrusion pressing members 4A are provided in the transport direction of the substrate 1, but the present invention is not limited to this. That is, if stress is applied to the end portions of the photosensitive resin layer 1C and the transparent resin film 1D without fail, one, two,
The protrusion pressing mechanism 4 may be configured by one or four or more protrusion pressing members 4A.

In addition, since the distance from the position where the front end of the substrate is detected by the substrate position detection sensor S ₁ to the position of the substrate position detection sensor S ₃ is predetermined at the stage of designing the transport path, the number of substrate transport rollers is increased. The distance can be calculated by Therefore, the counted number of rotations of the substrate feed rollers as a base point a position where the tip of the substrate is detected by the substrate position detection sensor S _1, the tip of the substrate is detected by the O connexion substrate position detection sensor S ₁ to the rotational speed Since the distance from the open position to the position of the substrate position detection sensor S ₃ can be calculated, the substrate stop can be controlled. Thereby, the substrate position detection sensor S ₃ can be omitted.

As shown in FIG. 1 and FIG. 8 (schematic configuration diagram of main part), the fluid spraying mechanism 5 is a fluid to which pressure is applied from a nozzle 5A, for example, air, gas such as inert gas, liquid such as water. Is configured to blow out. This fluid spray mechanism 5 is
The printed wiring board 1 is configured so that a fluid is directly blown to a gap portion formed between the photosensitive resin layer 1C and the translucent resin film 1D. The nozzle 5A is generally configured to be set at a position quite close to the gap portion in order to enhance the peeling effect (initial peeling effect) of the translucent resin film 1D. The substrate 1 is configured to be transported by the transport control roller 3 to a predetermined position of the fluid spraying mechanism 5. Then, as indicated by reference numeral 5A ′ in FIG. 8, the nozzle 5A is provided so that the photosensitive resin layer 1C is not damaged when the transparent resin film 1D is peeled off and the substrate 1 is conveyed. It is configured so that the set angle can be changed. The setting angle of the nozzle 5A can be changed by, for example,
It can be performed with a servo motor, an air cylinder, or the like.

In this way, the fluid is sprayed by the fluid spraying mechanism 5 to the gap between the photosensitive resin layer 1C and the translucent resin film 1D generated by the protrusion pressing member 4A, so that the photosensitive resin layer 1C and the translucent resin are transparent. Since the fluid is blown into the film 1D, the translucent resin film 1D can be simply and instantly and reliably peeled off.

Further, by configuring the setting angle of the fluid spraying mechanism 5 to be variable, the nozzle 5A can be brought close to the gap portion to enhance the peeling effect, and then the nozzle 5A is separated from the gap portion and the substrate 1 to be transported is conveyed. Particularly photosensitive resin layer 1C
It is possible to prevent damage.

The thin film unloading mechanism 6 is composed of a fixed belt conveyor 6A, a thin film peeling guide member 6B, a movable belt conveyor 6C, and a thin film discharging transport belt mechanism 6D.

The fixed belt conveyor 6A has a plurality of pairs of rollers 6A as shown in FIGS. 1, 8, and 9 (perspective view of essential parts).
a and a plurality of belts 6Ab wound around the pair of rollers 6Aa.

As shown in FIGS. 1 and 8, the movable belt conveyor 6C includes a pair of rollers 6Ca and a pair of rollers 6Ca.
The belt 6Cb is wound around. The movable belt conveyor 6C is movable by an air cylinder 6Cc centering on one roller 6Ca, and the fixed belt conveyor 6A.
The belt 6Ab or the thin film peeling guide member 6B is configured to be close to or in contact with the belt 6Ab.

Fixed belt conveyor 6A and movable belt conveyor 6C
Is the translucent resin film 1 peeled off by the fluid spraying mechanism 5.
By sandwiching D (the position shown by the dotted line in FIG. 8) and driving the pair of rollers 6Aa and the pair of rollers 6Ca, respectively, the transparent resin film 1D is sequentially peeled and discharged. .

The thin film peeling guide member 6B is a fixed belt conveyor 6
It is provided on the frame of the thin film peeling apparatus I on the A side, and is arranged between the belts 6Ab.

The thin film peeling guide member 6B is the translucent resin film 1
Prevents the peeling position from varying during peeling of D, prevents uneven release stress, and prevents damage and destruction of the photosensitive resin layer 1C,
The structure is such that the translucent resin film 1D is peeled and guided. Therefore, the thin film peeling guide member 6B has a peeling angle θ of the translucent resin film 1D thus pulled up (an angle formed by the translucent resin film 1D before the peeling and the translucent resin film 1D after the peeling). ) Is formed at a right angle to a pure angle (90 to 150 [degrees]: preferably substantially right angle) with respect to the substrate 1.

The thin film peeling guide member 6B is set at a position close to the substrate 1 with a gap so as not to rub against the substrate 1, so that the photosensitive resin layer 1C is not damaged when the substrate 1 is transported. It is configured to be movable in the arrow K direction from the set position.

The thin film peeling guide member 6B is configured to be variable by, for example, a servomotor, an air cylinder, etc. The movement of the thin film peeling guide member 6B is performed by the nozzle 5 of the fluid spraying device 5.
It is configured to be performed in synchronization with A. The thin film peeling guide member 6B is configured to move when it is sandwiched between the fixed belt conveyor 6A and the movable belt conveyor 6C. Further, the thin film peeling guide member 6B and the nozzle 5A are moved by the detection signals of the same or different sensors (not shown).

Note that the peeling angle θ of the thin film peeling guide member 6B may be configured to be changeable as necessary.

Further, the tip of the thin film peeling guide member 6B has an arc-shaped cross section with a small radius of curvature. For example, the radius of curvature is set to 3 mm or less.

By providing the thin film peeling guide member 6B in this way, the peeling position can be stabilized, and uniform peeling stress can be applied to the transparent resin film 1D and the photosensitive resin layer 1C.

Further, since the setting position of the thin film peeling guide member 6B is variable, the thin film peeling guide member 6B is brought close to the substrate 1 and the transparent resin film from the tip of the substrate 1 to the thin film peeling guide member 6B. Since the fluid can be efficiently sprayed over the entire peeling surface of 1D, the initial peeling effect can be enhanced and the translucent resin film 1D can be reliably attached to the thin film peeling guide member 6B. It is possible to prevent the photosensitive resin layer 1C from being damaged when the substrate 1 is transported away from the substrate 1.

As described above, the fixed belt conveyor 6A, the thin film peeling guide member 6B, and the movable belt conveyor 6C are used to transport the thin film discharge mechanism 6
By configuring the above, the translucent resin film 1D peeled by the fluid spraying mechanism 5 is guided by the thin film peeling guide member 6B, is sandwiched between the fixed belt conveyor 6A and the movable belt conveyor 6C, and is conveyed while peeling, It can be carried out in the discharge direction shown by the arrow OUT in FIG.

As shown in FIG. 1, the thin film discharging conveyor belt mechanism 6D is composed of a plurality of rollers 6Da and a pair of belts 6Db. The thin film discharging conveyor belt mechanism 6D is configured to discharge the transparent resin film 1D on the upper surface side of the substrate 1.

The movable belt conveyor 6C may be configured to be movable by an electromagnetic solenoid or a hydraulic cylinder instead of the air cylinder 6Cc.

In this way, the thin film unloading mechanism 6 is provided on the substrate transport path of the substrate 1.
Since the transparent resin film 1D peeled off by the fluid spraying mechanism 5 can be reliably discharged and automatically performed by providing the above, the working time can be significantly shortened.

When the translucent resin film 1D is peeled off by the fluid spraying mechanism 5 and the thin film unloading mechanism 6, the substrate 1 is transported to the developing device that develops the photosensitive resin layer 1C by the transport control roller 3 and the transport roller 2. .

It should be noted that the present invention is not limited to the above-mentioned embodiment, and it goes without saying that various modifications can be made without departing from the scope of the invention.

For example, the protrusion pressing member 4A may be configured as shown in FIGS. 10, 11 and 12 (perspective view). That is, the projection pressing member 4A shown in FIG. 10 has a wedge shape, the projection pressing member 4A shown in FIG. 11 has a flat plate shape, and the projection pressing member 4A shown in FIG. 12 has a curved wedge shape. ing.

Further, the projection pressing member 4A may give vibration.

Further, the projection pressing member 4A may be provided integrally or as a separate member at the tip of the nozzle 5A of the fluid spraying mechanism 5, as shown in FIG. In this case, since the stress is applied to the photosensitive resin layer 1C and the translucent resin film 1D, the part where the gap is generated and the part where the fluid is sprayed are always matched, so that the translucent resin film 1D is surely peeled off. be able to.

Further, the thin film unloading mechanism 6 is a combination of a rotating roller and a rotating roller, a combination of a fixed belt and a fixed belt, a method of winding a film around the rotating roller, a method of peeling and conveying a thin film by using suction force of a suction cup. You may use the thing etc.

Further, the protrusion pressing member 4A may be provided in a direction intersecting the transport path instead of the transport direction.

Further, instead of the fluid spraying mechanism 5, the translucent resin film 1D may be peeled off with an adhesive tape, a roller or the like.

Further, in the above-described embodiment, an example in which the present invention is applied to a substrate transfer device used in a thin film peeling device for a printed wiring board has been described, but the present invention is not limited to this. For example, the present invention can be applied to a substrate transfer device used for a thin film sticking device (laminator) for thermocompression laminating a laminate including a photosensitive resin layer on a printed wiring board.

(3) Effects As described above, according to the present invention, the effects described below can be obtained.

That is, the leading edge of the substrate conveyed by the substrate leading edge detection means is detected, and the side edge of the transported substrate is detected by the transportation board side edge detection means. The operation of the substrate levitation device and the operation of the substrate center alignment device are started based on the output signal of the substrate leading edge detection means, and the operation of the substrate center alignment device is stopped based on the output signal of the transfer substrate side edge detection device. Therefore, the center line of the substrate transfer device in the transfer direction can be accurately and easily matched with the center line of the substrate transfer device in the transfer direction. In particular, even a thin substrate can be aligned without causing bending or damage.

Moreover, since the above-mentioned alignment can be automatically performed during the transportation of the substrate, the manufacturing time can be significantly shortened.

Further, since the transfer board side edge detecting means for detecting the side edge of the transfer board is provided at a predetermined position of the movable portion of the board center aligning device, the transfer direction of the board transfer apparatus regardless of the size of the board. It is possible to accurately and easily match the center line in the substrate transfer direction with the center line.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic configuration diagram of a thin film stripping apparatus and a substrate transfer apparatus connected thereto according to an embodiment of the present invention, and FIG. 2 is a substrate center alignment apparatus of the substrate transfer apparatus. FIG. 3, FIG. 3 is a perspective view of a substrate levitation device of a substrate transfer device, FIG. 4 is a schematic configuration diagram of a protrusion pressing mechanism of a thin film stripping device, and FIG. 5 is a position setting member of the protrusion pressing mechanism. FIG. 6 and FIG. 7 are enlarged perspective views of essential parts of a projection pressing mechanism and a substrate, and FIG. 8 is a schematic configuration diagram of essential parts of a fluid spraying mechanism and a thin film discharge mechanism of a thin film peeling device. FIG. 9 is a perspective view of a main part of the thin film carrying-out mechanism, FIGS. 10 to 12 are perspective views of a projection pressing member which is another embodiment of the present invention, and FIG. 13 is another embodiment of the present invention. It is a perspective view of an example projection press member. In the drawing, 1 ... Substrate, 2 ... Conveying roller, 3 ... Conveying control roller, 4 ... Projection pressing mechanism, 5 ... Fluid spraying mechanism, 6 ... Thin film unloading mechanism, 7 ... Substrate center alignment mechanism, 8 ... Substrate levitation device, S ... A substrate position detection sensor.

Claims (1)

[Claims] 1. A substrate carrying device for carrying a substrate by rollers, wherein a substrate center aligning device for aligning a center line in the carrying direction of the substrate with a center line in the carrying direction of the substrate carrying device, and the substrate center position. During the operation of the aligning device, the substrate levitation device that levitates the substrate from the roller and the substrate levitation device that is provided at a predetermined position of the substrate transportation path so as to reduce the frictional force between the substrate and the roller, Substrate leading edge detecting means for detecting, a conveying substrate side edge detecting means provided at a predetermined position of a movable part of the substrate center aligning device, and detecting a side edge of the conveying board, and an output of the substrate leading edge detecting means. The operation of the substrate levitation device and the operation of the substrate center alignment device are started based on the signal, and the operation of the substrate center alignment device is stopped based on the output signal of the transfer substrate side edge detection means. Substrate transfer apparatus is characterized in that comprising a stage.