JPS646919B2 - - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to an apparatus used for manufacturing printed circuit boards, and more particularly to a printed circuit board laminating apparatus for laminating a dry film-like photoresist or a protective film on the surface of a printed circuit board substrate. It is.

In this specification, the substrate of a printed circuit board is abbreviated as a "printed circuit board" or simply "substrate," and dry film photoresist or film members such as a protective film are collectively referred to as a "photoresist film" or "resist film.""Film"
It is abbreviated as

Background of the Technology In recent years, the method of manufacturing printed circuit boards involves forming a photoresist layer on the surface of a conductor layer of a board such as a copper-clad board.
The mainstream method is to form wiring patterns using photolithography technology. In this case, the method of forming the photoresist layer is mainly by laminating a dry film photoresist on the surface of the substrate.

Previously, resist film was laminated onto printed circuit boards by cutting a long strip of resist film to the length of the board and then cutting it one by one, but this method was inefficient and difficult to mass-produce. It lacks.

Therefore, in recent years, a laminating apparatus has been developed that can continuously laminate a resist film in the form of a long strip onto a printed circuit board without cutting it. However, conventional laminating apparatuses of this type have problems as described below, and countermeasures have been desired.

Prior Art and Problems The conventional laminating apparatus as described above laminates the printed circuit board on the surface of the printed circuit board by continuously feeding a long strip of resist film while continuously feeding the printed circuit board with a feed roller or the like at intervals. It is configured to be laminated by continuous thermocompression bonding using rolls.

In such a laminating apparatus, the printed circuit boards after resist film lamination are sent out from the laminating apparatus while being interconnected by the resist film, and the resist film is cut between each board to separate the boards one by one. I need to do it. In addition, the printed circuit board has a reference hole formed therein that will be used for alignment in various subsequent steps, so it is necessary to form an escape hole in the resist film to escape the reference hole of the board. .

However, conventional laminating equipment does not have the function of cutting the resist film and forming the escape holes, and therefore, after the lamination process, the operator manually cuts the film and forms the escape holes using a knife or the like. . This not only hinders labor-saving or unmanned printed board manufacturing lines, but also inefficiencies and low productivity.Furthermore, defects in film cutting and clearance hole machining, as well as chips from resist films and circuit boards, cause problems in subsequent production. Problems tend to occur in the photolithography process, resulting in poor quality printed boards and lower yields.

Furthermore, in the above-described laminating apparatus, the interval between printed circuit boards supplied to the laminating apparatus from the preceding printed circuit board processing section or printed circuit board stock section becomes an important issue. For example, if the spacing between the substrates is too narrow, it will be difficult to cut the resist film after lamination, and if the spacing is too wide, the edges of the resist film that protrude from the substrate after cutting will tend to curl or curl. This will increase such problems.

Purpose of the Invention In view of the above-mentioned prior art, the present invention provides a method for feeding a printed circuit board at regular intervals, forming relief holes in a resist film before lamination, continuously laminating a resist film on a printed circuit board, and cutting the resist film after lamination. The purpose of the present invention is to provide a printed circuit board laminating device that can automatically and efficiently perform the following steps, thereby automating the printed circuit board laminating process, improving productivity, improving the quality of printed circuit boards, and ultimately improving yield. It is something.

Structure of the Invention The printed circuit board laminating apparatus according to the present invention has the following features: (a) While continuously feeding the printed circuit boards at intervals, a long strip-shaped film member is continuously supplied to continuously laminate the surface of the printed circuit board. (b) A laminating mechanism that feeds the printed circuit boards supplied from the printed circuit board supply unit faster than the board feeding speed of the laminating mechanism, adjusts the substrates to each other at a constant interval, and aligns them in the feeding direction to the laminating mechanism. A feeding mechanism for supplying substrates at regular intervals; an escape hole machining mechanism for machining escape holes; and (d) a cutting mechanism that cuts the laminated printed circuit board and film member sent from the laminating mechanism while continuously feeding the film member at the gap between the printed circuit boards. This configuration has the following features.

Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same reference numerals indicate the same parts throughout the figures.

FIG. 1 is a perspective view schematically showing the appearance of an embodiment of a printed circuit board laminating apparatus (hereinafter simply referred to as a "laminator") according to the present invention, and FIGS. 2 and 3 schematically show the overall structure thereof. They are a plan view and a side view, respectively. In these figures, the reference numeral 1 indicates the entire laminator, and the laminator 1 basically consists of a timing section 2, a laminating section 3, and a cutting section 4. Also, Figures 2 and 3
Reference numeral 5 in the figure indicates a board supply unit that supplies the printed circuit board P to the laminator 1 from an upstream printed board processing unit or a printed board stock unit (not shown).

First, with reference to FIGS. 2 and 3, the substrate supply section 5
The overall structure and operation of each part 2, 3, 4 of the laminator 1 will be briefly explained. Substrate supply section 5
The substrate P is sent horizontally in the direction of arrow A along a horizontal feeding path T (indicated by a dashed line in FIG. 3) using a pair of feeding belts 7 wound horizontally around a pulley 6.
It is configured to be supplied to the timing adjustment section 2 of the laminator 1 via a free support roller 8.

The timing adjustment section 2 of the laminator 1 includes a fast-feeding belt 11, a stopper 17, a guide roller 18, a width adjusting roller 19 (Fig. 2), a clamping roller 21, feeding rollers 22 and 23, and a spacing pin 2.
The device is equipped with a substrate constant-space feeding mechanism having a substrate feeder 5, etc., and feeds the substrates P supplied from the substrate supply unit 5 with a predetermined gap d (for example, 2 to 3 mm) from each other and correctly orients them in the substrate feeding direction. The sheets are aligned in the same state as they were, and are continuously fed to the next laminating section 3 at a predetermined speed V (for example, 0.5 to 2 mm/min).

The laminating section 3 has feed rollers 31, 32, 3
3, 34, a laminating mechanism having a laminating roll 35, a free support roller 36, a resist film reel 37, etc., and a die punch unit 4
0, etc., and continuously feeds the substrate P fed from the timing adjustment section 2 in the previous stage at a constant speed V while maintaining the gap d between them, and cuts the substrate P into a long strip shape. resist film F (second
(clearly indicated by hatching in the figure) is continuously supplied at the same speed as the feed speed of the substrate, and the escape hole Hf (the escape hole Hf) corresponding to the reference hole Hp (Fig. 2) of the substrate P is supplied to the resist film F in advance 2), a resist film F is continuously thermocompressed onto both upper and lower surfaces of the substrate P, and the laminated substrate P and resist film F are sent to the next cutting section 4.

The cutting section 4 includes a feed roll 51 and a feed belt 5.
4. Equipped with a cutting mechanism having a cutter 60 etc.
While continuously feeding the laminated substrate P and resist film F sent out from the laminating unit 3, the resist film F is cut at the gap between the substrates P to separate the substrates P one by one. The substrate is sent to the subsequent substrate processing section or substrate stock section as shown by arrow B.

Next, each part 2, 3, 4 of the laminator 1 will be explained in detail. Figures 4 and 5 show timing adjustment section 2.
FIG. 2 is a plan view and a side view, respectively, showing parts of a substrate supply section 5 and a laminate section 3. FIG. The substrate constant interval feeding mechanism of the timing adjustment section 2 has a pair of rapid-feeding belts 11 provided at a front stage near the substrate supply section 5 along the substrate feeding path T (FIG. 5). This fast-feeding belt 11 has pulleys 12 and 13
A two-speed variable speed motor M is wound horizontally around the motor M and is connected to a pulley 13 by a belt or chain 14.
2 at high speed v ₁ and low speed v ₂ (where V<v ₂ <v ₁ ) of the substrate P as described below.
It is configured to allow various types of fast forwarding. Note that symbols S1, S2, and S3 indicate sensors for detecting the substrates P that are fed from the substrate supply section 5 to the fast-feeding belt 11 and are fast-forwarded, and although these sensors are not clearly shown in the figure, they each have a light emitting element and It is a photo sensor consisting of a light receiving element.

The fast-feeding belt 11 is mounted on a support base 15 that can be raised and lowered in the vertical direction by a linear motor M2, and is at a lower position (initial position) where the upper surface of the belt is lower than the substrate feeding path T, as shown by the solid line in FIG. and an upper position where the upper surface of the belt is approximately at the same level as the substrate feeding path T as shown by a dotted line 11'. For example, the lifting stroke is 15~
It is 20mm. A stopper 17 is disposed near the rear end of the fast-feeding belt 11 when it is at its initial position (lower position). This stopper 17 is for stopping the substrate P fast-forwarded by the fast-forwarding belt 11 at a predetermined standby position, as will be described later. Incidentally, reference numerals S4 and S5 indicate sensors for respectively detecting the initial position and the upper position of the fast-feeding belt 11, and these are the aforementioned photo sensors or mechanical microswitches.

As shown in FIG. 4, fixed guide rollers 18 and width adjusting rollers 19 movable in the horizontal direction (arrows Z1, Z2) perpendicular to the substrate feeding path T are arranged on both sides of the fast-feeding belt 11, respectively. The width adjusting roller 19 is driven by a cylinder SY1 using air or the like, and presses the substrate P at a standby position on the fast-feeding belt 11 against the guide roller 18 to keep the substrate P in a predetermined position and straighten the substrate feeding direction. It has the effect of setting it so that it is facing the right direction. In addition, spring 20
is for adjusting the board pressing force of cylinder SY1.

As shown in FIG. 5, a clamping roller 21 is provided above the fast-feeding belt 11 and facing the pulley 13 thereof. The clamping roller 21 is always urged downward by a spring 21a.
As will be described later, when the fast-feeding belt 11 rises, it clamps the substrate P placed on it, and cooperates with the fast-feeding belt 11 to rapidly feed the substrate P at a low speed _v2 .

A pair of feeding rollers 22 and 23 are arranged downstream of the clamping roller 21, that is, on the laminating section 3 side. The lower roller 22 is constantly driven by a belt or chain 24 in synchronization with the feed roller 31 of the laminating section 3, and can feed the substrate P at a predetermined speed V. The upper roller 23 is a driven roller that can be moved up and down by a cylinder SY2 using air or the like. This upper feeding roller 23 is normally located at the upper position (initial position), and the fast-feeding belt 11 and the clamping roller 2
1, the substrate P that is rapidly fed is fed by the feeding roller 22,
23, but as will be described later, when this substrate rapid feeding is completed, it descends to clamp the substrate P between the lower feeding roller 22 and feed the substrate P at a constant speed V. It is composed of Incidentally, reference numerals S6, S7, and S8 indicate the above-mentioned photo sensors for detecting the substrate P that is fed rapidly or at a constant speed along the feeding path T, and reference numeral S9 indicates the lower part of the upper feeding roller 23. A photo sensor or micro switch as described above is shown for detecting position.

Further, two spacing pins 25 on the left and right (see FIG. 4) are provided at the rear stage of the feeding rollers 22 and 23, that is, on the side of the laminating section 3. The spacing pins 25 are set equal to a predetermined substrate spacing d, and are configured to be freely inserted and removed between the substrates P by being driven up and down by a cylinder SY3 using air or the like. On the other hand, the cylinder
SY3 is the horizontal guide rod 27 of the fixed support base 26
The spacing pin 25 is attached to a slider 28 mounted on the slider 28, so that the spacing pin 25 extends between a forward position near the feed rollers 22, 23, shown in solid lines in FIG. Board feed path T
It can move freely in parallel to the As will be described later, the spacing pin 25 is normally at a lower front position (initial position), and when the rear end of the substrate P passes the spacing pin 25, it is raised as shown in FIG. When the succeeding substrate P is rapidly fed by the fast-feeding belt 11 and the clamping roller 21, the leading substrate P is pushed by the front end of the succeeding substrate as shown by the dotted line 25' in FIGS. 4 and 5. It hits the rear end. As a result, the distance between the front and rear substrates P is set to d. Thereafter, the spacing pin 25 is removed from between the substrates P and returned to the initial position by a return spring 29 stretched between the support base 26 and the slider 28. Incidentally, the reference numeral S10 designates the aforementioned photo sensor or microswitch for detecting the rear position 25' of the slider 28, that is, the spacing pin 25.

Now, the constant interval feeding of the substrates P by the timing adjustment section 2 as described above will be explained in detail based on the process diagrams of FIGS. 6A to 6K and the time chart of FIG. 7. 6A to 6K only the relevant parts are schematically shown, and FIG. 7 shows the sensors S1 to S1.
0, from motors M1, M2, and cylinder SY1
Only the operation of SY3 is shown.

(a) First, as shown in FIG. 6A, it is assumed that the fast-feeding belt 11, upper feeding roller 23, and spacing pin 25 are all in their initial positions at the time of startup. In this state, when the first substrate P1 is fed by the feed belt 7 of the supply section 5, the substrate P1 tilts diagonally when it passes more than half the support roller 8, and the front end climbs up onto the fast-feeding belt 11.

(b) As shown in Figure 6B, the substrate P1 is connected to the sensor S1.
When detected, the fast-feeding belt 11 is driven at high speed by the motor M1, and the substrate P1 is fast-forwarded at high speed _v1 .

(c) Next, as shown in FIG. 6C, when the sensor S2 detects the front end of the board P1, the motor M1 is switched to low speed drive, and the board P1 is decelerated to a low speed _v2 and hits the stopper 17. Then, the sensor S3 detects the substrate P1, the driving of the motor M1, that is, the fast-forwarding belt 11 is stopped, and the substrate P1 is made to stand by at that position. At the same time, the signal from sensor S3 causes the cylinder to move as shown in FIG.
SY1 operates and moves the width adjusting roller 19 in the direction of arrow Z1
direction, and presses the substrate P1 against the guide rollers 18 to set it in a predetermined position and in the correct orientation.

(d) Furthermore, the motor M2 is actuated by the signal from the sensor S3 as shown in FIG.
is raised to an upper position as shown by an arrow Y1, and the substrate P1 is clamped by the clamping roller 21 at the feeding position on the feeding path T. Incidentally, when the fast-feeding belt 11 reaches the upper position, it is detected by the sensor S5 and the motor M2 is stopped.

(e) Next, the motor M1 is again driven at a low speed as shown in FIG. 6E by the signal from the sensor S5, and the substrate P1 is moved from the feeding position to the feeding roller 22,
23 at a low speed _v2 .

(f) Then, as shown in FIG. 6F, when the sensor S8 detects the front end of the substrate P1, the drive of the motor M1, that is, the fast-feeding belt 11 is stopped. At the same time, the cylinder SY2 is actuated and the upper feeding roller 23 descends in the direction of the arrow Y3, clamps the substrate P1, and starts feeding it at a predetermined speed V.
On the other hand, the lowering of the upper feeding roller 23 is detected by the sensor S9.
The motor M2 is reversely driven by the signal, and the fast-forwarding belt 11 is lowered as shown by the arrow Y2, and when it returns to the initial position, it is detected by the sensor S4.
is detected and motor M2 is stopped. Furthermore, as shown in FIG. 4, the cylinder SY1 is actuated by the signal from the sensor S9, and the width adjusting roller 19 returns to the direction of the arrow Z2.

(g) Next, as shown in Fig. 6G, feed roller 2
The first substrate P1 fed at a constant speed in steps 2 and 23 is fed to the feed roller 31 of the laminating section 3, and then continues to be fed at a constant speed V. On the other hand, the second substrate P2 from the substrate supply section 5 is transferred to the fast-forwarding belt 11 which has returned to the initial position as described in (a) to (c) above with reference to FIGS. 6A to 6C. It is supplied, fast-forwarded at high speed v ₁ and low speed v ₂ , and then brought to the width and then waiting at a predetermined position.

(h) Then, as shown in Fig. 6H, when the rear end of the first substrate P1 passes the sensor S6, the motor M2 is activated, and the fast-forwarding belt 11 is raised as in the case of Fig. 6D explained in (d) above. The second substrate P2 is then clamped by the clamping rollers 21.

(i) Next, as shown in Fig. 6I, when the rear end of the first substrate P1 passes the sensor S7, the cylinder SY3
is activated, and the spacing pin 25 rises in the direction of arrow Y5 and is inserted between the substrates P1 and P2. At the same time, the cylinder SY2 operates, and the upper feeding roller 23 ascends back to the initial position as shown by arrow Y4. At the same time, motor M1 is driven at low speed again.
The second substrate P2 is rapidly fed by the fast-feeding belt 11 and the clamping roller 21 at a low speed _v2 .

(j) Then, as shown in Fig. 6J, the second substrate P2, which is being fed rapidly, follows the first substrate P1, which is being fed at a constant speed, while pushing the spacing pin 25 at its front end (v ₂ > V ), butts against the rear end of the first substrate P1 via the spacing pin 25. Thereby, the gap d between the first substrate P1 and the second substrate P2 is set to a predetermined value.

(k) When the spacing pin 25 reaches its rear position, this is detected by the sensor S10, and the cylinder SY2 is actuated as shown in FIG.
3 descends in the direction of arrow Y3 and clamps the second substrate P2. At the same time, the cylinder SY3 operates again to remove the spacing pin 25 from between the substrates P1 and P2 in the direction of arrow Y6. As a result, the substrates P1 and P2 are continuously fed at a constant speed V while maintaining a predetermined distance d from each other. On the other hand, the spacing pin 25 that has been removed downward is moved by the arrow X by the return spring 29.
As shown in 2, it returns to the initial position in front (indicated by the dotted line). At the same time, the lowering of the upper feeding roller 23 is also detected by the sensor S9, and as described above, the fast feed belt 11 is lowered and returned to the initial position by the motor M2.

(l) Thereafter, the same steps as in the case of the second substrate P2 explained in the above (g) to (k) are repeated for the third substrate P3 (FIG. 6K) and subsequent substrates.
Furthermore, as is clear from FIG. 7, the sensor S8
is used only to detect the first substrate P1.

In this way, the substrates P supplied from the substrate supply section 5 are aligned at a predetermined interval with each other in the timing alignment section 2 and are continuously transferred to the laminate section 3 even if there are variations in the substrate spacing at the time of supply. It will be shipped.

Next, FIG. 8 is an enlarged side view of the main part of the laminate section 3. As shown in FIG. The laminating mechanism of the laminating part 3 is
Feed rollers 31, 32, 33, which are arranged at approximately equal intervals along the substrate feed path T and are constantly rotated in synchronization with each other by a drive mechanism (not shown).
34 and a laminating roll 35, whereby the substrate P fed from the timing adjustment section 2 in the previous stage is continuously sent through the laminating roll 35 in the direction of the arrow at a constant speed V while maintaining the interval d between them. . Note that there are two types of lamination methods: a normal pressure method and a vacuum method, and the present invention can be used with either method, but the illustrated example is a vacuum method.
The feed rollers 31 and 34 at both ends also serve as seal rolls to maintain airtightness.

Further, as shown in FIG. 3, resist film reels 37 are provided above and below the substrate feeding path T, and a roll-shaped resist film F is loaded onto these reels. The resist film F is pulled out from these upper and lower reels 37 and transferred to the eighth film in the form of a long strip.
As shown in the figure, it is supplied to the laminate roll 35 via a guide roller 38 at the same speed as the feed speed V of the substrate P, and is continuously bonded to the upper and lower surfaces of the substrate P by thermocompression.

As shown in the cross section in FIG. 9, the resist film F is wound into a roll with a thin protective film Fa made of polyethylene or the like coated on both upper and lower surfaces, and when pulled out from the reel 37, the protective film on one side is removed.
Fa is peeled off by a peeling means (not shown),
As shown in cross section in FIG. 10, the surface from which the protective film has been removed is laminated onto the substrate P. In addition, the width of the resist film F is generally narrower than the width of the substrate P, and as is clear from FIGS. 2 and 10, the resist film F is laminated to the central portion of the substrate P, leaving both sides where the conductor pattern is not formed. be done. In the resist film cutting process described later,
A photo sensor detects the substrate spacing d at the side of the substrate where the resist film F is not laminated, and the film is cut.

Furthermore, the escape hole machining mechanism of the laminate portion 40 is as follows:
A light emitting element 48a and a light receiving element 48b are arranged on the way to the laminating roll 35 on the substrate feeding path T.
A photo sensor S11 for detecting the reference hole Hp of the substrate P, which is arranged in the resist film supply path between the resist film reel 37 (FIG. 3) and the laminating roll 35, and a photo sensor S11 for detecting the reference hole Hp of the substrate P. It has a die punch unit 40 for machining an escape hole Hf for escaping. In the illustrated embodiment, reference holes Hp are formed on both left and right sides of the substrate P, as shown in FIGS. There are two sets of die punch units 40 on the left and right sides, two on the top and two on the top and a total of four die punch units 40, but the figure shows one set of sensors S11 on one side and two die punch units 40. only is shown.

The die punch unit 40, as shown in cross section in FIG.
It has a die 41 and a punch 42 that face each other with the die 41 and the punch 42 facing each other. The punch 42 is a cylinder 4 that uses air or the like.
As will be described later, when the sensor S11 detects the reference hole Hp, the cylinder 43 is actuated based on the signal and the punch 42 is connected to the piston rod 44 of the punch 42.
is driven toward the die 41 as shown by arrow a,
Punch out resist film F and process escape hole Hf. And a sensor S provided on the die 41 side
When the punch 12 detects that the punch 42 has penetrated the resist film F and reached the die 41, the cylinder 43 is reversely operated and the punch 42 is pulled out from the die 41 and the resist film F as shown by arrow b. Reference numeral 47 indicates a stripper for pulling out this punch. Note that the optical path of the sensor S12 can be secured by providing a through hole or a notch in a part of the die 41. The scraps of the resist film F are accommodated in the accommodating portion 45 provided in the die 41, thereby preventing contamination of the surface of the substrate P and the inside of the apparatus. During punching of escape holes, since the resist film F is continuously fed at a constant speed V, the die punch unit 40 moves the resist film F from its initial position as indicated by arrow c to the punching end position indicated by reference numeral 40'. It is configured so that it can be moved to. That is, while the punch 42 is inserted into the die 41, it is pulled by the resist film F and reaches near the punching end position 40', and when the cylinder 43 is reversely operated and the punch 42 is pulled out from the die 41 and the resist film F. The return spring 46 causes the die punch unit 40 to return to its initial position as shown by arrow d.

In the illustrated example, the distances l ₁ and l ₂ from the respective laminating rolls 35 of the reference hole detection sensor S11 and the die punch unit 40 are equal (l ₁
= l ₂ ). The die punch unit 40 is configured to form an escape hole Hf in the resist film F at the same time as the sensor S11 detects the reference hole Hp of the substrate P.
As a result, the escape hole Hf is machined at a position equidistant from the laminating roll 35 with respect to the reference hole Hp detected by the sensor S11, and therefore, as shown in FIG. The holes Hp and Hf will be accurately overlapped. According to such an arrangement of the sensor S11 and the die/punch unit 40, even if the feed speed V of the substrate P and the resist film F is changed, the relative position between the reference hole Tp and the relief hole Hf remains unchanged.
Accurate overlay is always obtained without the need for any adjustments.

On the other hand, it is also possible to configure the distances l ₁ and l ₂ between the sensor S11 and the die punch unit 40 to be different. However, in this case, the configuration is such that l ₁ > l ₂ , and after the sensor S11 detects the reference hole Hp, the difference between the two distances (l ₁ −l ₂ ) and the feeding speed V of the substrate and resist film are determined. Therefore, the die punch unit 40 may be configured to perform the escape hole processing after a predetermined period of time (l ₁ -l ₂ )/V.
For example, as shown in the block diagram of FIG. 11, the control circuit 49 of the escape hole processing mechanism is provided with a pulse generator and a pulse counter that generate a number of pulses proportional to the feeding speed V of the substrate and resist film. After inputting the reference hole detection signal from the sensor S11, the die punch unit 4 counts a certain number of pulses corresponding to time (l ₁ - l ₂ )/V.
This is possible by configuring it to output a drive signal of 0.

As described above, in the laminating section 3, the processing mechanism processes the relief holes in the resist film F before lamination, and the laminating mechanism processes the substrate P.
The resist film F can be laminated automatically and efficiently and satisfactorily.

The laminated substrates P are interconnected by resist films F at predetermined intervals d and are sent to the next cutting section 4 via a rear feed roller 34 and a support roller 36.

Next, FIG. 12 is a perspective view showing the configuration of the cutting section 4, and FIGS. 13, 14, and 15 are detailed views of the main parts thereof. As is clear from FIGS. 3 and 12, in the cutting section 4, a feed roller 51 is provided at the front stage along the substrate feeding path T, and pulleys 52 and 53 (particularly clearly shown in FIG. 3) are provided at the rear stage. Two horizontally wound feed belts 54 are provided, and a driven roller 55 (only one is shown in FIG. 12) is provided above the pulley 52. The feed roller 51 and the feed belt 54 move a row of substrates P (hereinafter referred to as a "substrate row") interconnected by the resist film F sent out from the laminate section 3 at a substrate feed speed V of the laminate section 3. The structure is such that it can be continuously fed in the direction of arrow B at substantially the same speed as . That is, as shown in FIGS. 12 and 13, the pulley 52 of the feed belt 54 is connected to the main shaft.
The main shaft MS is rotated in the direction of arrow N1 by the main motor M3 via the worm gear W, and drives the feed belt 55 in the same direction. On the other hand, the feed roller 51 is connected to the sprocket of the main shaft MS.
SP1 and sprocket SP2 of lower feed roller 51
(Fig. 12) It is driven by a chain CH1 interposed therebetween. In this case, sprocket SP1
and SP2 have more teeth in the latter (SP1<SP
2) The peripheral speeds of the feed roller 51 and the feed belt 54 are respectively set to a constant speed V and a slightly higher speed V'(V<V'). The advantages of such a configuration will be discussed later.

Further, a sensor S13 is provided between the feed roller 51 and the feed belt 54 for detecting the gap d between the substrates P in the row of substrates that are continuously fed by these two;
A cutter 60 is provided for cutting the resist film F of the substrate row at the gap d. The sensor S13 is a photo sensor consisting of a light emitting element 66a and a light receiving element 66b, as shown in FIG. The substrate gap d is detected at the side portions.

As shown in FIG. 12, the cutter 60 has a cutter base 61 that is longer than the width of the substrate P and is arranged to extend above the substrate row feeding path T at right angles to the substrate row feeding direction B. The cutter base 61 is supported at both ends by support plates 62, and these cutter base support plates 62 move in the substrate row feeding direction B along guide rails (not shown) provided on both sides of the substrate row feeding path T. Parallel direction (arrows X3 and X in Figure 12)
It is possible to move back and forth to 4).

On the cutter base 61, a cutter support plate 63 is movable back and forth along a guide rail (not shown) in its longitudinal direction, that is, in a horizontal direction perpendicular to the board row feeding direction B (arrows Z3 and Z4 in FIG. 12). It is provided. A cutter holder 64 is provided on the cutter support plate 63 so as to be movable up and down in the vertical direction (arrows Y7 and Y8 in FIG. 15) by a cylinder SY4, and a razor-shaped cutter blade 65 is held in this holder 64. There is. cylinder SY
4, move the cutter holder 64 to arrows Y7 and Y8.
By raising and lowering the cutter blade 65
is raised and lowered between an initial position higher than the top surface of the substrate row and a cutting position protruding from the bottom surface of the substrate row (FIG. 15).

Further, a cutter support plate 63, that is, a cutter blade 65 is attached to the cutter base 61 as indicated by the arrow Z3,
A reversible motor M5 and a chain CH6 are provided for driving in the Z4 direction. Chain CH6
is wound around sprockets provided at both ends of the cutter base 61, and both ends are attached to the cutter support plate 63.
is combined with The motor M5 is installed on the cutter base support plate 62 on one side, and the motor M5 is connected to the chain CH6.
It is connected to one of the sprockets. Therefore, the cutter support plate 63 moves from the initial position shown in FIG. 12 above the substrate array in the direction of arrow Z3 to the cutting end position on the opposite side due to the forward rotation of the motor M5, and also due to the reverse rotation of the motor M5. Therefore, it moves from the cutting end position in the direction of arrow Z4 and returns to the initial position. Note that reference numerals S14 and S15 (FIG. 12) indicate photo sensors or microswitches for detecting the initial position and cutting end position of the cutter support plate 63, respectively.

Furthermore, the cutter base 61 is reciprocated in the directions of arrows X3 and X4 by the following drive mechanism. That is, as shown in FIG.
Two chains CH5 are each wound around four sprockets in a rectangular shape when viewed from the side, and both ends of each chain CH5 are connected to the front and rear ends of each cutter base support plate 62. One of the four sprockets of each chain CH5 is connected to a common second subshaft AS2, and this second subshaft AS2 is connected to the first subshaft by two chains CH4.
It is connected to sprocket SP6 at both ends of AS1 (especially shown in Figures 13 and 14). This first
There are also two sets of sprockets SP4 on the subshaft AS1,
SP5 and magnetic clutches MC1 and MC2 are provided, and as clearly shown in FIG. 13, the first sprocket SP4 is connected to the sprocket SP3 of the main shaft MS by a chain CH2, and the second sprocket SP5 is connected to a subsprocket SP3 by a chain CH3. It is connected to the output shaft of motor M4. magnetic clutch
MC1 and MC2 connect and disconnect sprockets SP4 and SP5, respectively, and the first sub-shaft AS1 using electromagnets, and normally both clutches are connected to each other.
Both MC1 and MC2 are in the "OFF" state, and sprockets SP4 and SP5 are both in a free state. In this state, the first sub-shaft AS1
is not driven by either the motors M3 or M4, and therefore the cutter base 61 is not driven and is stopped at an initial position biased towards the feed roller 51 side. Then, the first clutch MC1 is “ON”
Then, the first sub-shaft AS1 is connected to the sprocket SP4, and is driven to rotate forward in the same direction N1 by the main shaft MS (that is, the main motor M3) via the chain CH2. Therefore, as is clear from Fig. 12, chain CH4, second sub-shaft AS2, and chain CH
5, the cutter base 61 is driven in the same direction as the substrate row feeding direction (arrow X3). Note that the driving speed of the cutter base 61 in the direction of arrow X3 is the same as the substrate feeding speed V. Also, when the first clutch MC1 is turned "OFF" and the second clutch MC2 is "ON", the first subshaft AS1 is turned to the sprocket.
Disconnect from SP4 and connect the other sprocket SP5
auxiliary motor M4 through chain CH3.
, the rotation direction N1 of the main shaft MS is opposite to the rotation direction N1.
2, it will be rotated in the opposite direction. Therefore, the 12th
As shown in the figure, chain CH4, second sub-shaft AS2,
Chain CH5 is also driven in the opposite direction, and cutter base 61 is driven in the direction of arrow X4 and returned to the initial position. In addition, the code S16 (first
FIG. 2) shows a photo sensor or micro switch for detecting the initial position of the cutter base support plate 62, that is, the cutter base 61.

The cutting of the resist film F of the substrate array in the cutting section 4 as described above is performed as follows. The row of substrates sent out from the laminating section 3 in the previous stage is kept at a constant speed V by the feed roller 51 and the feed belt 54.
As shown in FIG.
When the cutter blade 65 reaches the position of the sensor S13, the sensor S13 detects the rear end of the preceding substrate P, the cylinder SY4 is activated, and the cutter blade 65 is lowered to the cutting position as shown by the arrow Y7. At the same time, motor M5
is activated, and the cutter support plate 63 is driven in the direction of arrow Z3. Furthermore, at the same time as the cutter blade 65 descends, the first clutch MC1 turns "ON".
The cutter base 61 is moved by the arrow X by the main motor M3.
It is driven at a constant speed V in three directions. As a result, the cutter blade 65 moves in the same direction X3 at the same speed V as the substrate row, as shown in FIG. (The actual trajectory of the cutter blade 65 is
The upper and lower resist films F are cut approximately along the center line of the gap d (obliquely with respect to the substrate row feeding direction B as shown by the dotted line in the figure). In this case, the preceding substrate P is sent by the feeding belt 54, and the following substrate P is sent by the feeding roller 51, but as described above, the feeding speed of the feeding belt 54 is
Since V' is slightly faster than the feed speed V of the feed roller 51, a slight tension acts on the resist film F connecting both substrates P, allowing for good cutting.

After cutting, when the cutter blade 65 reaches the cutting end position (indicated by reference numeral 65' in FIG. 2),
This is detected by the sensor S15, the cutter drive motor M5 stops, the cutter support plate 63 stops, and at the same time, the first clutch MC1 is turned OFF, the cutter base 61 stops, and the cylinder SY4 is reversed again. The cutter blade 65 is pulled up to the initial position as shown by arrow Y8. After that, the motor M5 reverses and the cutter support plate 63
returns to the initial position as shown by arrow Z4, is detected by sensor S14, and stops. At the same time, the second clutch MC2 is turned ON again, and the cutter base 61 is returned to the initial position by the auxiliary motor M4.
It is detected by sensor S16 and stopped.

On the other hand, the substrate P, which has been separated from the substrate row by cutting the resist film F, is moved by the feed belt 54 at a speed slightly higher than the substrate row feeding speed V, as described above.
Arrow B while gradually increasing the distance from the board row at V'.
direction, and is delivered to the next substrate processing section or substrate stock section (not shown).

As described above, the cutting section 4 can automatically and efficiently cut the resist film F after lamination without causing harmful damage to the substrate P and the resist film F.

Next, FIG. 16 is a perspective view of a second embodiment of the cutting section, and FIG. 17 is a detailed view of the main part thereof. The basic structure and operation of this cutting section 4A are almost the same as those of the above-mentioned cutting section 4, and only the structure and operation of the cutter 70 are partially different from the above-mentioned cutter 60. That is, the substrate array from the laminating section 3 is sent by the feed roller 51 and the feed belt 54 in the same way as in the first embodiment, and the gap d is the sensor S.
13. The cutter 70 also has a cutter base 71 and a cutter base support plate 72 that are almost the same as those of the cutter 60 described above, and the cutter base 71 is driven by the arrow arrow by a drive mechanism that is exactly the same as that of the cutter 60. It is driven back and forth in the X3 and X4 directions. Therefore, below, cutter 7
Only the differences between the cutter 60 and the cutter 60 will be explained.

The cutter base 71 of the cutter 70 has one left and right one.
A pair of cutter support plates 73 are fixed, and a cutter holder 74 is provided on each of these cutter support plates 73 so as to be movable up and down in the vertical direction (arrows Y7 and Y8 in FIG. 17) by a cylinder SY5 using air or the like. As shown in the figure, a cutter blade 75 longer than the width of the resist film F is held in these holders 74 via a heat insulating material. A heater 76 such as a nichrome wire heater is attached to the upper part of the cutter blade 75, and the cutting edge portion of the cutter blade 75 is heated to a required temperature (for example, 70 to 80°C).
℃). Although the cutter blade 75 can be cut without heating, cutting becomes extremely easy if the cutter blade 75 is heated. Also,
Instead of attaching the heater to the cutter blade 75, a large cutter holder may be used and the heater may be housed therein. The cutter blade 75 is moved between the initial position and the cutting position (the 17th
(Figure). In addition, the code S17,
S18 indicates a photo sensor or a micro switch for detecting the initial position and cutting position of the cutter blade 75, respectively.

With the above configuration, when the sensor S13 detects the substrate gap d between the substrate rows, the cylinder SY5 is actuated to lower the cutter blade 75 in the direction of the arrow Y7, and at the same time, the first clutch When MC1 is turned ON, the cutter base 71 is driven at a constant speed V by the main motor M3 in the direction of arrow X3. As a result, the cutter blade 75 moves in the same direction X3 at the same speed V as the row of substrates as shown in FIG.
is heated and cut approximately at the center of the gap d. still,
Reference numeral 77 (FIG. 17) designates a cushion for the cutter blade 75. When cutting is completed, the cylinder SY5 is moved backward by the sensor S18, and the cutter blade 75 is pulled up in the direction of the arrow Y8.
Return to initial position. Then, the first clutch is activated by the sensor S17 as in the case of the cutter 60.
MC1 is "OFF", second clutch MC2 is "ON"
Then, the cutter base 71 is driven in the direction of arrow X4 by the auxiliary motor M4 and returns to the initial position.
It is detected by sensor S16 and stopped.

In this way, in the case of the second embodiment 4A, as in the first embodiment 4, the resist film can be cut automatically and in a good manner.

The above laminator has the following advantages.

(b) First, in the timing adjustment section, the substrate fixed interval feeding mechanism can align the substrates P at predetermined intervals and with the substrate feeding direction correctly facing, and continuously feed them to the laminate section. Continuous lamination of the long strip-shaped resist film at the section and cutting of the resist film at the cutting section can be performed efficiently and favorably.

(b) In addition, in the laminating section, the laminating mechanism continuously laminates the resist film onto the substrate, and prior to lamination, the relief hole processing mechanism forms relief holes corresponding to the reference holes of the resist film substrate. This eliminates the need for manual hole machining after the lamination process. In addition, the escape hole machining mechanism can efficiently and satisfactorily process escape holes, and there is no possibility of contamination of the substrate or equipment by chips during the escape hole machining process.

(c) Furthermore, the resist film of the laminated substrate array can be efficiently and favorably cut in the gap between the substrates by the cutting mechanism in the cutting section, and manual cutting is therefore unnecessary.

Effects of the Invention As described above, according to the present invention, it is possible to feed a printed circuit board at regular intervals, to form escape holes in a resist film before lamination, to continuously laminate a resist film to a printed circuit board, and to cut the resist film after lamination. A laminating device that can automatically and efficiently perform this has been realized,
Therefore, it is possible to automate the printed circuit board lamination process, improve productivity, improve the quality of printed circuit boards, and improve yield, which has significant technical and economical effects.

[Brief explanation of drawings]

FIG. 1 is a perspective view schematically showing the external appearance of an embodiment of a printed circuit board laminating apparatus according to the present invention, FIGS. 2 and 3 are a plan view and a side view, respectively, schematically showing the overall structure of the laminating apparatus, and FIG. 4 and Fig. 5 are respectively a plan view and a side view of the timing adjustment section of the laminating apparatus, Fig. 6A to Fig. 6K, and Fig. 7.
The figures are a process diagram and a time chart for feeding printed circuit boards at regular intervals in the timing alignment section, Figure 8 is a partially cross-sectional side view showing the main parts of the laminating unit of the laminating device, and Figure 9 is a cross-sectional view of the resist film. , FIG. 10 is a cross-sectional view of the printed circuit board and resist film after lamination, No. 1
Figure 1 is a block diagram of the control system of the relief hole machining mechanism, Figure 12 is a perspective view showing the configuration of the first embodiment of the cutting section of the laminating device, Figures 13, 14, and 1.
5 is a detailed view of the main parts of the cutting section in FIG. 12, FIG. 16 is a perspective view showing the configuration of the second embodiment of the cutting section, and FIG.
FIG. 7 is a detailed view of the main part of the cutting section in FIG. 16. 1...Printed circuit board laminating device, 2...Timing unit, 3...Laminating unit, 4, 4A
... Cutting section, 5 ... Substrate supply section, 7 ... Feed belt, 11 ... Rapid feed belt, 17 ... Stopper,
21... Clamping roller, 22, 23... Feeding roller, 25... Spacing pin, 31, 32, 33,
34...Feed roller, 35...Lamination roll, 37...Resist film reel, 40...
Die punch unit, 41...Die, 42...
Punch, 43... Cylinder, 51... Feed roller, 54... Feed belt, 60, 70... Cutter, 61, 71... Cutter base, 65, 75
... cutter, 76 ... heater, P ... printed circuit board, Hp ... reference hole, F ... resist film,
Hf...Escape hole, T...Board or board row feed path,
S1-S18...Sensor, M1-M5...Motor, SY1-SY5...Cylinder.

Claims (1)

[Scope of Claims] 1. A printed circuit board laminating device for laminating a film member on the surface of a printed circuit board, comprising: (a) continuously feeding a long belt-shaped film member while continuously feeding the printed circuit boards at intervals; (b) a laminating mechanism that continuously laminates the printed circuit boards on the surface of the printed circuit boards by supplying the printed circuit boards to the substrate; a fixed interval feeding mechanism for adjusting and aligning substrates in the feeding direction to the laminating mechanism; (c) detecting a reference hole in a printed circuit board being fed through the laminating mechanism; (d) an escape hole processing mechanism for forming an escape hole in the film member while the film member is being fed; A printed circuit board laminating apparatus comprising: a cutting mechanism that cuts the printed circuit board at a gap portion of the printed circuit board.