KR900001668B1 - 수지봉합형 반도체장치 - Google Patents

수지봉합형 반도체장치 Download PDF

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Publication number
KR900001668B1
KR900001668B1 KR1019860006270A KR860006270A KR900001668B1 KR 900001668 B1 KR900001668 B1 KR 900001668B1 KR 1019860006270 A KR1019860006270 A KR 1019860006270A KR 860006270 A KR860006270 A KR 860006270A KR 900001668 B1 KR900001668 B1 KR 900001668B1
Authority
KR
South Korea
Prior art keywords
resin
semiconductor device
sealed semiconductor
resin sealing
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019860006270A
Other languages
English (en)
Korean (ko)
Other versions
KR870003559A (ko
Inventor
히로시 마츠모토
다카오 에모토
도시히로 가토
신지로 고지마
Original Assignee
가부시끼가이샤 도오시바
와타리 스기이찌로
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도오시바, 와타리 스기이찌로 filed Critical 가부시끼가이샤 도오시바
Publication of KR870003559A publication Critical patent/KR870003559A/ko
Application granted granted Critical
Publication of KR900001668B1 publication Critical patent/KR900001668B1/ko
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1019860006270A 1985-09-30 1986-07-30 수지봉합형 반도체장치 Expired KR900001668B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP60-214852 1985-09-30
JP60214852A JPS6276659A (ja) 1985-09-30 1985-09-30 樹脂封止型半導体装置
JP160-214852 1985-09-30

Publications (2)

Publication Number Publication Date
KR870003559A KR870003559A (ko) 1987-04-18
KR900001668B1 true KR900001668B1 (ko) 1990-03-17

Family

ID=16662612

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860006270A Expired KR900001668B1 (ko) 1985-09-30 1986-07-30 수지봉합형 반도체장치

Country Status (2)

Country Link
JP (1) JPS6276659A (https=)
KR (1) KR900001668B1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3035403B2 (ja) * 1992-03-09 2000-04-24 富士通株式会社 半導体装置

Also Published As

Publication number Publication date
KR870003559A (ko) 1987-04-18
JPH0357623B2 (https=) 1991-09-02
JPS6276659A (ja) 1987-04-08

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