KR900000562B1 - 반도체집적회로의 신호전송회로 - Google Patents

반도체집적회로의 신호전송회로 Download PDF

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Publication number
KR900000562B1
KR900000562B1 KR1019850008244A KR850008244A KR900000562B1 KR 900000562 B1 KR900000562 B1 KR 900000562B1 KR 1019850008244 A KR1019850008244 A KR 1019850008244A KR 850008244 A KR850008244 A KR 850008244A KR 900000562 B1 KR900000562 B1 KR 900000562B1
Authority
KR
South Korea
Prior art keywords
signal
transmission line
line
input
circuit
Prior art date
Application number
KR1019850008244A
Other languages
English (en)
Korean (ko)
Other versions
KR860004463A (ko
Inventor
히로시 야수다
Original Assignee
가부시끼가이샤 도오시바
사바 쇼오이찌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 도오시바, 사바 쇼오이찌 filed Critical 가부시끼가이샤 도오시바
Publication of KR860004463A publication Critical patent/KR860004463A/ko
Application granted granted Critical
Publication of KR900000562B1 publication Critical patent/KR900000562B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Static Random-Access Memory (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1019850008244A 1984-11-14 1985-11-05 반도체집적회로의 신호전송회로 KR900000562B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-240208 1984-11-14
JP59240208A JPS61119060A (ja) 1984-11-14 1984-11-14 半導体集積回路の信号伝送路

Publications (2)

Publication Number Publication Date
KR860004463A KR860004463A (ko) 1986-06-23
KR900000562B1 true KR900000562B1 (ko) 1990-01-31

Family

ID=17056058

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850008244A KR900000562B1 (ko) 1984-11-14 1985-11-05 반도체집적회로의 신호전송회로

Country Status (5)

Country Link
US (1) US4687949A (de)
EP (1) EP0181600B1 (de)
JP (1) JPS61119060A (de)
KR (1) KR900000562B1 (de)
DE (1) DE3581784D1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63238713A (ja) * 1987-03-26 1988-10-04 Oki Electric Ind Co Ltd 遅延回路
KR920005863B1 (ko) * 1988-08-12 1992-07-23 산요덴끼 가부시끼가이샤 반도체 집적회로
DE3938459A1 (de) * 1989-11-20 1991-05-23 Philips Patentverwaltung Schaltungsanordnung zur kompensation von impulslaengenveraenderungen
DE4313053C1 (de) * 1993-04-21 1994-10-06 Siemens Ag Integrierte Halbleiteranordnung mit Verbindungsleitungen, die durch Dotierungsgebiete gegenüber parasitären Effekten unempfindlich sind
JP3283984B2 (ja) * 1993-12-28 2002-05-20 株式会社東芝 半導体集積回路装置
US5994946A (en) * 1996-10-31 1999-11-30 Metaflow Technologies, Inc. Alternating inverters for capacitive coupling reduction in transmission lines
JP3164066B2 (ja) * 1998-07-09 2001-05-08 日本電気株式会社 半導体装置
EP0977263A3 (de) 1998-07-31 2002-07-10 STMicroelectronics, Inc. Anordnung und Verfahren zur Reduzierung der Laufzeit in einem Leiter
US7109765B1 (en) * 1998-11-03 2006-09-19 Altera Corporation Programmable phase shift circuitry
DE102005038100A1 (de) * 2005-08-10 2007-02-15 Micronas Gmbh Monolithische Anordnung, insbesondere integrierte Schaltung, mit einer floatenden Elektrode

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56161668A (en) * 1980-05-16 1981-12-12 Hitachi Ltd Semiconductor device
US4389429A (en) * 1980-06-16 1983-06-21 Rockwell International Corporation Method of forming integrated circuit chip transmission line
JPS57194552A (en) * 1981-05-25 1982-11-30 Matsushita Electric Ind Co Ltd Signal transmission line

Also Published As

Publication number Publication date
EP0181600A3 (en) 1987-03-11
EP0181600B1 (de) 1991-02-20
EP0181600A2 (de) 1986-05-21
JPS61119060A (ja) 1986-06-06
US4687949A (en) 1987-08-18
DE3581784D1 (de) 1991-03-28
KR860004463A (ko) 1986-06-23

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