KR890017801A - Semiconductor devices - Google Patents
Semiconductor devices Download PDFInfo
- Publication number
- KR890017801A KR890017801A KR1019890006560A KR890006560A KR890017801A KR 890017801 A KR890017801 A KR 890017801A KR 1019890006560 A KR1019890006560 A KR 1019890006560A KR 890006560 A KR890006560 A KR 890006560A KR 890017801 A KR890017801 A KR 890017801A
- Authority
- KR
- South Korea
- Prior art keywords
- wire
- semiconductor device
- ball
- semiconductor
- uneven surface
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45013—Cross-sectional shape being non uniform along the connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
내용 없음No content
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제 2 도, 제 3 도는 및 제 4 도는 각각 본 발명의 다른 실시예에 의한 와이어의 사시도. 제 5 도는 본 발명의 또다른 실시예에 의한 와이어본딩장치의 단면도. 제 6 도는 제 5 도에 예시된 장치로 형성된 와이어 표면형상의 모식도.2, 3 and 4 are perspective views of a wire according to another embodiment of the present invention, respectively. 5 is a cross-sectional view of a wire bonding apparatus according to another embodiment of the present invention. 6 is a schematic view of a wire surface shape formed by the apparatus illustrated in FIG.
Claims (6)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63046062A JPH01220919A (en) | 1988-02-29 | 1988-02-29 | Radio telephone set |
JP63-121778 | 1988-05-20 | ||
JP88-121778 | 1988-05-20 | ||
JP12177888 | 1988-05-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890017801A true KR890017801A (en) | 1989-12-18 |
KR930000162B1 KR930000162B1 (en) | 1993-01-09 |
Family
ID=26386176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019890006560A KR930000162B1 (en) | 1988-02-29 | 1989-05-17 | Radio telephone apparatus semiconductor device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR930000162B1 (en) |
-
1989
- 1989-05-17 KR KR1019890006560A patent/KR930000162B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR930000162B1 (en) | 1993-01-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
G160 | Decision to publish patent application | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20030107 Year of fee payment: 11 |
|
LAPS | Lapse due to unpaid annual fee |