KR890017801A - Semiconductor devices - Google Patents

Semiconductor devices Download PDF

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Publication number
KR890017801A
KR890017801A KR1019890006560A KR890006560A KR890017801A KR 890017801 A KR890017801 A KR 890017801A KR 1019890006560 A KR1019890006560 A KR 1019890006560A KR 890006560 A KR890006560 A KR 890006560A KR 890017801 A KR890017801 A KR 890017801A
Authority
KR
South Korea
Prior art keywords
wire
semiconductor device
ball
semiconductor
uneven surface
Prior art date
Application number
KR1019890006560A
Other languages
Korean (ko)
Other versions
KR930000162B1 (en
Inventor
마꼬또 기따노
지까꼬 기따바야시
아사오 니시무라
히데오 미우라
아끼히로 야구찌
스에오 가와이
Original Assignee
미다 가쓰시게
가부시끼가이샤 히다찌세이사꾸쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63046062A external-priority patent/JPH01220919A/en
Application filed by 미다 가쓰시게, 가부시끼가이샤 히다찌세이사꾸쇼 filed Critical 미다 가쓰시게
Publication of KR890017801A publication Critical patent/KR890017801A/en
Application granted granted Critical
Publication of KR930000162B1 publication Critical patent/KR930000162B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45013—Cross-sectional shape being non uniform along the connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

내용 없음No content

Description

반도체 장치Semiconductor devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 2 도, 제 3 도는 및 제 4 도는 각각 본 발명의 다른 실시예에 의한 와이어의 사시도. 제 5 도는 본 발명의 또다른 실시예에 의한 와이어본딩장치의 단면도. 제 6 도는 제 5 도에 예시된 장치로 형성된 와이어 표면형상의 모식도.2, 3 and 4 are perspective views of a wire according to another embodiment of the present invention, respectively. 5 is a cross-sectional view of a wire bonding apparatus according to another embodiment of the present invention. 6 is a schematic view of a wire surface shape formed by the apparatus illustrated in FIG.

Claims (6)

반도체 소자의 여러장소와 리이드프레임의 여러장소를 각각 와이어에 의해 전기적으로 접속하고, 이들의 요소를 수시로 봉하여 막는 형의 반도체 장치에 있어서, 상기 각각 와이어의 상기 반도체 소자에 접속하는 측의 일부분이 요철표면인 것을 특징으로 하는 반도체 장치.In a semiconductor device of a type in which several places of a semiconductor element and several places of a lead frame are electrically connected to each other by wires, and those elements are frequently sealed and prevented, a portion of each side of the wires connected to the semiconductor elements is A semiconductor device comprising an uneven surface. 특허청구의 범위 제 1 항에 있어서, 상기 와이어는 금선인 반도체 장치.The semiconductor device according to claim 1, wherein the wire is a gold wire. 특허청구의 범위 제 1 항에 있어서, 상기 요철표면은 딤플가공으로 형성되어 있는 반도체 장치.The semiconductor device according to claim 1, wherein the uneven surface is formed by dimple processing. 특허청구의 범위 제 1 항에 있어서, 상기 와이어의 반도체 소자에 접속하는 부분은 볼로 되어있고, 상기 와이어의 요철면은 상기 볼의 상단에 적어도 0.2mm 이상 떨어져서 형성되어 있는 반도체 장치.The semiconductor device according to claim 1, wherein a portion of the wire connected to the semiconductor element is formed of a ball, and an uneven surface of the wire is formed at least 0.2 mm apart from an upper end of the ball. 특허청구의 범위 제 1 항에 있어서, 상기 요철면의 깊이는 와이어지름의 812%인 반도체 장치.The semiconductor device according to claim 1, wherein the depth of the uneven surface is 812% of the wire diameter. 반도체 소자와 리이드프레임을 위치맞춤한 후 상기 반도체 소자와 리이드프레임 사이에 와이어를 배선하고, 이들의 요소를 수지로 봉하여 막는 반도체 장치의 제조방법에 있어서, 상기 와이어배선의 단계는 상기 와이어의 일부를 클램프해서 와이어표면의 일부에 요철가공을 실행하고, 와이어에서의 요철가공부위보다 선단을 가열해서 볼형상으로 하고, 상기 볼을 반도체 소자 상면의 소정장소에 접착시키고, 이어서 상기 와이어를 리이드프레임의 소정위치까지 끌어서 상기 위치에서 와이어의 일부를 압착하고, 이상의 각 공정을 1회 내지 여러회 조합해서 이루어지는 것을 특징으로 하는 반도체 장치의 제조방법.In the method of manufacturing a semiconductor device in which a wire is connected between the semiconductor device and the lead frame after positioning the semiconductor device and the lead frame, and the elements are sealed with a resin, the step of wire wiring is a part of the wire. Clamps are applied to a portion of the surface of the wire, and the tip is heated to form a ball from the uneven portion of the wire, and the ball is bonded to a predetermined place on the upper surface of the semiconductor element. A method of manufacturing a semiconductor device, comprising: pressing a portion of a wire at a predetermined position by pressing it to a predetermined position, and combining each of the above steps one to several times. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019890006560A 1988-02-29 1989-05-17 Radio telephone apparatus semiconductor device KR930000162B1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP63046062A JPH01220919A (en) 1988-02-29 1988-02-29 Radio telephone set
JP12177888 1988-05-20
JP88-121778 1988-05-20
JP63-121778 1988-05-20

Publications (2)

Publication Number Publication Date
KR890017801A true KR890017801A (en) 1989-12-18
KR930000162B1 KR930000162B1 (en) 1993-01-09

Family

ID=26386176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019890006560A KR930000162B1 (en) 1988-02-29 1989-05-17 Radio telephone apparatus semiconductor device

Country Status (1)

Country Link
KR (1) KR930000162B1 (en)

Also Published As

Publication number Publication date
KR930000162B1 (en) 1993-01-09

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