KR890017786A - 반도체용 플라스틱 패키지의 제조방법 및 그 장치 - Google Patents

반도체용 플라스틱 패키지의 제조방법 및 그 장치 Download PDF

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KR890017786A
KR890017786A KR1019890006716A KR890006716A KR890017786A KR 890017786 A KR890017786 A KR 890017786A KR 1019890006716 A KR1019890006716 A KR 1019890006716A KR 890006716 A KR890006716 A KR 890006716A KR 890017786 A KR890017786 A KR 890017786A
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South Korea
Prior art keywords
molding
heating
temperature
semiconductor
plastic package
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KR1019890006716A
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KR920009914B1 (ko
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쇼조 나까무라
아이조 가네다
시게하루 쯔노다
아끼오 하세베
마사오 미따니
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미다 가쓰시게
가부시끼가이샤 히다찌세이가꾸쇼
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Publication of KR890017786A publication Critical patent/KR890017786A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C45/1468—Plants therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/7207—Heating or cooling of the moulded articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

내용 없음

Description

반도체용 플라스틱 패키지의 제조방법 및 그 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 1실시예의 반도체용 플라스틱 패키지의 제조를 위한 장치의 구성을 도시한 불럭도. 제 3 도 A 내지 D는 각각 제 1 도에 도시한 트랜스퍼 프레스의 동작을 도시한 도면. 제 4 도 A 및 B는 각각 제 1실시예에 따른 성형품의 온도변화와 응력변화를 도시한 그래프. 제 5 도는 수지의 글라스 전이온도와 경계면의 잔류응력의 관계를 도시한 그래프.

Claims (7)

  1. 성형의 캐비티내에 반도체칩을 배치하는 공정, 온도 T1에서 수지를 성형하여 상기 반도체칩을 내장하는 성형물을 성형하는 공정, 상기 성형하는 공정 직후에, 가열에 의해 상기 성형물을 상기 수지의 글라스 전이 온도 Tg 보다 높은 온도 T2에서 소정의 시간동안 1차 경화로써 유지하는 공정, 상기 유지하는 공정 직후에, 다시 가열에 의해 상기 성형 물을 상기 수지의 글라스 전이오도 Tg와 동일한 온도 T3에서 소정의 시간동안 2차 경화로써 유지하는 공정과, 상기 성형물을 자연적으로 냉각하는 공정을 포함하는 반도체용 플라스틱 패키지의 제조방법.
  2. 성형의 캐비티내에 반도체칩을 배치하는 공정, 온도 T1에서 수지를 성형하여 상기 반도체칩을 내장하는 성형물을 성형하는 공정, 상기 성형하는 공정 직후에, 가열에 의해 상기 성형물을 상기 수지의 글라스 전이농도 Tg 보다 높은 온도 T2에서 소정의 시간동안 1차 경화로써 유지하는 공정과, 상기 성형물을 자연적으로 냉각하는 공정을 포함하는 반도체용 플라스틱 패키지의 제조방법.
  3. 특허청구의 범위 제 1 항에 있어서, 온도 T2는 성형온도 T1과 동일하거나 보다 높은 반도체용 플라스틱 패키지의 제조방법.
  4. 특허청구의 범위 제 3 항에 있어서, 상기 유지하는 공정내의 가열은 적외선 가열에 의해 행해지는 반도체용 플라스틱 패키지의 제조방법.
  5. 특허청구의 범위 제 4 항에 있어서, 상기 적외선가열은 원적외선 가열인 반도체용 플라스틱 패키지의 제조방법.
  6. 특허청구의 범위 제 5 항에 있어서, 원적외선가열로 사용되는 원적외광선의 파장은 0.5㎛ 내지 50㎛인 반도체용 플라스틱 패키지의 제조방법.
  7. 수지를 성형하여 반도체칩을 내장하는 성형물을 성형하기 위한 성형기(10), 상기 성형물을 순차적으로 수납하고 2차 경화되도록 가열하는 가열실(40), 상기 성형물을 상기 성형기(10)에서 상기 가열실(40)으로 순차적으로 전송하는 전송기(20), 상기 전송시(20)에 인접하고, 상기 전송기(20)상에 전송된 상기 성형물을 1차 경화하도록 가열하기 위한 가열수단(30) 및 상기 가열실에서 전송된 상기 성형물이 자연냉각되는 냉각단(50)을 포함하는 반도체용 플라스틱 패키지의 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890006716A 1988-05-25 1989-05-19 플라스틱 패키지내의 반도체칩 내장방법 KR920009914B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63-128077 1988-05-25
JP63128077A JP2684677B2 (ja) 1988-05-25 1988-05-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR890017786A true KR890017786A (ko) 1989-12-18
KR920009914B1 KR920009914B1 (ko) 1992-11-06

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KR1019890006716A KR920009914B1 (ko) 1988-05-25 1989-05-19 플라스틱 패키지내의 반도체칩 내장방법

Country Status (4)

Country Link
US (1) US5110515A (ko)
JP (1) JP2684677B2 (ko)
KR (1) KR920009914B1 (ko)
DE (1) DE3916785C2 (ko)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2504607B2 (ja) * 1990-06-14 1996-06-05 株式会社東芝 半導体製造装置及び製造方法
DE4314284A1 (de) * 1993-04-30 1994-11-03 Telefunken Microelectron Verfahren zum Bestimmen von mechanischen Grenzflächeneigenschaften bei integrierten Schaltkreisen
US6007316A (en) * 1993-07-22 1999-12-28 Towa Corporation Apparatus for molding resin to seal electronic parts
TW257745B (ko) * 1993-07-22 1995-09-21 Towa Kk
US5622731A (en) * 1993-09-10 1997-04-22 Fierkens; Richard H. J. Automatic post mold curing apparatus for use in providing encapsulated semiconductor chips and method therefor
US5478517A (en) * 1994-02-28 1995-12-26 Gennum Corporation Method for molding IC chips
KR100377981B1 (ko) * 1994-06-07 2003-05-27 텍사스 인스트루먼츠 인코포레이티드 성형화합물큐어링방법
US6265464B1 (en) * 1997-03-14 2001-07-24 The Dow Chemical Company Postcure treatment for reaction injection molded polyurethanes
US6306331B1 (en) 1999-03-24 2001-10-23 International Business Machines Corporation Ultra mold for encapsulating very thin packages
EP1787521A4 (en) * 2004-08-11 2009-06-24 Fuji Oil Co Ltd FAT-OIL COMPOSITIONS FOR PREVENTING THE MIGRATION OF WATER IN FOODSTUFFS AND FOODS MANUFACTURED THEREFROM
JP4687273B2 (ja) * 2005-06-23 2011-05-25 住友電気工業株式会社 電子部品の実装方法
NL2000356C2 (nl) * 2006-12-05 2008-06-06 Fico Bv Werkwijze en inrichting voor het omhullen van elektronische componenten waarbij het omhulmateriaal wordt gekoeld.
JP2010179401A (ja) * 2009-02-05 2010-08-19 Toshiba Corp 半導体装置の製造方法および半導体装置
JP5652027B2 (ja) * 2010-07-15 2015-01-14 株式会社リコー プラスチック成形品、プラスチック成形品の成形方法、および該プラスチック成形品を有する光走査装置
JP5693160B2 (ja) * 2010-11-09 2015-04-01 キヤノン株式会社 複合光学素子の製造方法、製造装置、及び応力除去方法
US9662812B2 (en) * 2012-02-14 2017-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for molding integrated circuits

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4017495A (en) * 1975-10-23 1977-04-12 Bell Telephone Laboratories, Incorporated Encapsulation of integrated circuits
JPS571234A (en) * 1980-06-04 1982-01-06 Hitachi Ltd Method for resin molding
DE3163054D1 (en) * 1980-06-05 1984-05-17 Toshiba Kk Resin encapsulation type semiconductor device
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5886714A (ja) * 1981-11-19 1983-05-24 松下電器産業株式会社 薄膜コンデンサの製造方法
JPS6153321A (ja) * 1984-08-23 1986-03-17 Toshiba Corp 半導体封止用エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPH0643924B2 (ja) * 1986-02-07 1994-06-08 株式会社日立製作所 複合材料の熱応力の測定方法
US4842800A (en) * 1987-10-01 1989-06-27 General Electric Company Method of encapsulating electronic devices

Also Published As

Publication number Publication date
JPH01297831A (ja) 1989-11-30
KR920009914B1 (ko) 1992-11-06
US5110515A (en) 1992-05-05
DE3916785C2 (de) 1995-11-16
JP2684677B2 (ja) 1997-12-03
DE3916785A1 (de) 1989-11-30

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