KR890016887A - 도금전사(鍍金轉寫)에 의한 회로기판의 제법 - Google Patents

도금전사(鍍金轉寫)에 의한 회로기판의 제법 Download PDF

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Publication number
KR890016887A
KR890016887A KR1019880004795A KR880004795A KR890016887A KR 890016887 A KR890016887 A KR 890016887A KR 1019880004795 A KR1019880004795 A KR 1019880004795A KR 880004795 A KR880004795 A KR 880004795A KR 890016887 A KR890016887 A KR 890016887A
Authority
KR
South Korea
Prior art keywords
circuit
manufacturing
substrate
circuit board
plating transfer
Prior art date
Application number
KR1019880004795A
Other languages
English (en)
Other versions
KR910000571B1 (ko
Inventor
정호연
Original Assignee
정호연
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정호연 filed Critical 정호연
Priority to KR1019880004795A priority Critical patent/KR910000571B1/ko
Priority to JP63182765A priority patent/JPH01278794A/ja
Priority to GB8818477A priority patent/GB2217918A/en
Publication of KR890016887A publication Critical patent/KR890016887A/ko
Application granted granted Critical
Publication of KR910000571B1 publication Critical patent/KR910000571B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0117—Pattern shaped electrode used for patterning, e.g. plating or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

내용 없음

Description

도금전사(鍍金轉寫)에 의한 회로기판의 제법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도(A)는 본 발명의 판재에 흑연층을 형성한 평면예시도, (a)는 동 단면도, 제 3 도(C)는 본 발명의 흑연회로에 도금으로 금속회로를 적층형성한 평면예시도, (c)는 동 단면도, 제 4 도(D)는 본 발명의 도금회로에 접착제를 도포한 평면예시도, (d)는 동 단면도.

Claims (1)

  1. 판재의 표면에 견고한 흑연층을 적층형성하고 적층된 흑연층의 표면에 절연성 잉크로 스크린 인쇄법에 의하여 네가티브형의 회로를 인쇄하여서 흑여회로가 형성된 모판을 제조하는 제 1 공정과 모판에 형성된 흑연회로에 전기적 도금으로 금속회로를 적층형성하고 금속회로 표면에만 열경화성 접착제층을 적층형성하여 기판과 모판의 금속회로를 맞대고 가열압착하여서 모판으로부터 금속회로를 기판에 전착하는 제 2 공정의 결합으로 회로기판을 제조함을 특징으로 한 도금전사에 의한 회로기판의 제법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880004795A 1988-04-27 1988-04-27 도금전사(鍍金轉寫)에 의한 회로기판의 제법 KR910000571B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1019880004795A KR910000571B1 (ko) 1988-04-27 1988-04-27 도금전사(鍍金轉寫)에 의한 회로기판의 제법
JP63182765A JPH01278794A (ja) 1988-04-27 1988-07-21 メッキ転写による回路基版の製造方法
GB8818477A GB2217918A (en) 1988-04-27 1988-08-03 Method of manufacturing printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019880004795A KR910000571B1 (ko) 1988-04-27 1988-04-27 도금전사(鍍金轉寫)에 의한 회로기판의 제법

Publications (2)

Publication Number Publication Date
KR890016887A true KR890016887A (ko) 1989-11-30
KR910000571B1 KR910000571B1 (ko) 1991-01-26

Family

ID=19273905

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880004795A KR910000571B1 (ko) 1988-04-27 1988-04-27 도금전사(鍍金轉寫)에 의한 회로기판의 제법

Country Status (3)

Country Link
JP (1) JPH01278794A (ko)
KR (1) KR910000571B1 (ko)
GB (1) GB2217918A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1116299A (en) * 1967-04-05 1968-06-06 United Carr Inc Method of preparing printed circuits
US4401521A (en) * 1980-11-28 1983-08-30 Asahi Kasei Kogyo Kabushiki Kaisha Method for manufacturing a fine-patterned thick film conductor structure
IL73386A0 (en) * 1984-01-09 1985-01-31 Stauffer Chemical Co Transfer laminate and method of forming an electrical circuit pattern therewith
EP0185998A1 (en) * 1984-12-14 1986-07-02 Dynamics Research Corporation Interconnection circuits made from transfer electroforming

Also Published As

Publication number Publication date
GB2217918A (en) 1989-11-01
JPH01278794A (ja) 1989-11-09
KR910000571B1 (ko) 1991-01-26
GB8818477D0 (en) 1988-09-07

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