KR890015041A - 광전소자 및 광 도파관을 구비한 아티클 제조방법 - Google Patents

광전소자 및 광 도파관을 구비한 아티클 제조방법 Download PDF

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Publication number
KR890015041A
KR890015041A KR1019890002384A KR890002384A KR890015041A KR 890015041 A KR890015041 A KR 890015041A KR 1019890002384 A KR1019890002384 A KR 1019890002384A KR 890002384 A KR890002384 A KR 890002384A KR 890015041 A KR890015041 A KR 890015041A
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KR
South Korea
Prior art keywords
waveguide
substrate
optical
semiconductor
optical waveguide
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Application number
KR1019890002384A
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English (en)
Other versions
KR910005951B1 (ko
Inventor
앨런 액커맨 데이빗
알렉스 코스지 루이스
Original Assignee
엘리 와이스
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 엘리 와이스, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 엘리 와이스
Publication of KR890015041A publication Critical patent/KR890015041A/ko
Application granted granted Critical
Publication of KR910005951B1 publication Critical patent/KR910005951B1/ko

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

내용 없음.

Description

광전소자 및 광 도파관을 구비한 아티클 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 실시예의 아티클 도면.
제2도는 본 발명의 방법에 대한 실시예의 구성도.
제3도는 본 발명에 따라 구성된 광증폭기를 구성하는 광섬유 통신시스템의 부분도.

Claims (7)

  1. 기판(14)기판상에 광전 소자(11) 및 광 도파관(16)을 구비하여, a)소자 및 도파관이 소자에 도파관내로 또는 도파관에서 소자내로 방사 결합하기 적당한 상대 위치에 있도록 소자를 기판에 고착하는 단계와 b)소자에 전기적 접촉을 하기 위한 수단(15)을 제공하는 단계를 구비하는 아티클 제조방법에 있어서, 상기 소자가 포토루미네센스 할 수 있으며, 상기 방법은, c) 상기 단계 a)에 앞서, 상기 소자가 포토루미네센스에 의하여 전자기 방사를 방출하도록 소자를 펌프방사(25)로 노출하는 단계와, d) 상기 소자에 의하여 방출된 최소한의 방사를 검출하며, 만약 지시된다면, 상기 소자와 도파관 사이에 소정 정도의 광 결합이 발생하도록 소자 및 도파관의 상대적 위치를 조정하는 단계를 구비하는 것을 특징으로 하는 이티클 제조방법.
  2. 제1항에 있어서, 상기 기판이 Si본체로 구성된 상기 광 도파관이 Si본체상에 형성된 평면 도파관인 것을 특징으로 하는 아티클 제조방법.
  3. 제1항에 있어서, 상기 기판이 Si본체로 구성되며 상기 광 도파관이 Si본체에 부착된 광섬유인 것을 특징으로 하는 아티클 제조방법.
  4. 제1 내지 3항중 어느 한 항에 있어서, 상기 광전 소자가 반도체 레이저, 반도체 발광 다이오드, 반도체 광증폭기, 또는 반도체 방사 검출기인 것을 특징으로 하는 아티클 제조방법.
  5. 제1 내지 4항중 어느 한 항에 있어서, 상기 기판상에 상기 소자에 의해 방출된 방사를 검출하기 우한 검출수단을 제공하며 상기 도파관에 결합되는 것을 특징으로 하는 아티클 제조방법.
  6. 제1,2 또는 5항중 어느 한 항에 있어서, 상기 광전 소자가 반도체 레이저이며, 상기 아티클이 평면 도파관과 관련한 결합으로 Si본체에 부착된 광섬유를 구비하는 것을 특징으로 하는 아티클 제조방법.
  7. 제1 내지 6항중 어느 한 항에 있어서, 상기 광전 소자는 펌프 방사가 소자내로 전송될 수 있도록 소자내에 윈도우(13)를 가진 금속층(12)을 구비하는 것을 특징으로 하는 아티클 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019890002384A 1988-03-03 1989-02-28 광전 소자 및 광 도파관을 구비한 아티클 제조 방법 KR910005951B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US07/163,689 US4892374A (en) 1988-03-03 1988-03-03 Article comprising an opto-electronic device and an optical waveguide coupled thereto, and method of making the article
US163689 1988-03-03
US163,689 1988-03-03

Publications (2)

Publication Number Publication Date
KR890015041A true KR890015041A (ko) 1989-10-28
KR910005951B1 KR910005951B1 (ko) 1991-08-09

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Family Applications (1)

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KR1019890002384A KR910005951B1 (ko) 1988-03-03 1989-02-28 광전 소자 및 광 도파관을 구비한 아티클 제조 방법

Country Status (6)

Country Link
US (1) US4892374A (ko)
EP (1) EP0331336B1 (ko)
JP (1) JP2533637B2 (ko)
KR (1) KR910005951B1 (ko)
CA (1) CA1301900C (ko)
DE (1) DE68912790T2 (ko)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3833311A1 (de) * 1988-09-30 1990-04-19 Siemens Ag Optoelektronische sende- und empfangsvorrichtung
EP0419767B1 (de) * 1989-09-29 1993-11-24 Siemens Aktiengesellschaft Verfahren zur Herstellung eines Körpers aus Silizium
US5534442A (en) * 1991-05-10 1996-07-09 Northern Telecom Limited Process of providing uniform photoresist thickness on an opto-electronic device
US5194105A (en) * 1991-08-29 1993-03-16 American Telephone And Telegraph Company Placement and bonding technique for optical elements
US5315672A (en) * 1991-09-23 1994-05-24 Texas Instruments Incorporated Fiber optic chemical sensor
US5175781A (en) * 1991-10-11 1992-12-29 United Technologies Corporation Attaching optical fibers to integrated optic chips
US5217906A (en) * 1991-12-03 1993-06-08 At&T Bell Laboratories Method of manufacturing an article comprising an opto-electronic device
US5217568A (en) * 1992-02-03 1993-06-08 Motorola, Inc. Silicon etching process using polymeric mask, for example, to form V-groove for an optical fiber coupling
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
US5252823A (en) * 1992-09-28 1993-10-12 Rockwell International Corporation Combined light source and readout for fiber-optic sensors with reduced back-reflections
US6090635A (en) * 1992-11-17 2000-07-18 Gte Laboratories Incorporated Method for forming a semiconductor device structure having a laser portion
US5355386A (en) * 1992-11-17 1994-10-11 Gte Laboratories Incorporated Monolithically integrated semiconductor structure and method of fabricating such structure
US5321714A (en) * 1992-12-14 1994-06-14 Xerox Corporation Reflection suppression in semiconductor diode optical switching arrays
JP2546506B2 (ja) * 1993-07-27 1996-10-23 日本電気株式会社 光半導体素子と光導波路の結合構造およびその結合方法
WO1996000996A1 (en) * 1994-06-30 1996-01-11 The Whitaker Corporation Planar hybrid optical amplifier
US5480385A (en) * 1995-01-10 1996-01-02 Specialized Health Products, Inc. Self retracting medical needle apparatus and methods
EP0774684A3 (en) 1995-11-16 1998-04-22 Matsushita Electric Industrial Co., Ltd. Optical apparatus and method for producing the same
US5960259A (en) * 1995-11-16 1999-09-28 Matsushita Electric Industrial Co., Ltd. Optical apparatus and method for producing the same
JP2940602B2 (ja) * 1997-04-23 1999-08-25 日本電気株式会社 光部品固定基板
JP2985830B2 (ja) 1997-05-19 1999-12-06 日本電気株式会社 光モジュール及びその製造方法
US6327289B1 (en) 1997-09-02 2001-12-04 Matsushita Electric Industrial Co., Ltd. Wavelength-variable semiconductor laser, optical integrated device utilizing the same, and production method thereof
JP4129071B2 (ja) * 1998-03-20 2008-07-30 富士通株式会社 半導体部品および半導体実装装置
US6706546B2 (en) 1998-10-09 2004-03-16 Fujitsu Limited Optical reflective structures and method for making
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6690845B1 (en) 1998-10-09 2004-02-10 Fujitsu Limited Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making
US6611635B1 (en) * 1998-10-09 2003-08-26 Fujitsu Limited Opto-electronic substrates with electrical and optical interconnections and methods for making
US6445837B1 (en) * 1999-03-31 2002-09-03 Nu-Wave Photonics, Inc. Hybrid opto-electronic circuits and method of making
US6304695B1 (en) * 1999-05-17 2001-10-16 Chiaro Networks Ltd. Modulated light source
JP2001274528A (ja) 2000-01-21 2001-10-05 Fujitsu Ltd 薄膜デバイスの基板間転写方法
US6886994B2 (en) 2002-07-18 2005-05-03 Chiaro Networks Ltd. Optical assembly and method for manufacture thereof
US6865321B2 (en) * 2002-07-31 2005-03-08 Agilent Technologies, Inc. Optical systems and methods using coupling fixtures for aligning optical elements with planar waveguides
TW595137B (en) * 2003-03-11 2004-06-21 Delta Electronics Inc Active assembly apparatus of planer lightguide circuit
JP2004325999A (ja) * 2003-04-28 2004-11-18 Seiko Epson Corp 光ファイバ送受信モジュール及び電子機器
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
EP2151680A1 (de) * 2008-08-05 2010-02-10 F. Hoffmann-Roche AG Montageverfahren zur Herstellung eines Analysesystems
CN101852892B (zh) * 2009-03-30 2014-03-12 日立电线株式会社 光波导及光配线部件及光元件向光配线部件的安装方法
US9882073B2 (en) * 2013-10-09 2018-01-30 Skorpios Technologies, Inc. Structures for bonding a direct-bandgap chip to a silicon photonic device
US11181688B2 (en) 2009-10-13 2021-11-23 Skorpios Technologies, Inc. Integration of an unprocessed, direct-bandgap chip into a silicon photonic device
US11428880B2 (en) * 2020-07-31 2022-08-30 Openlight Photonics, Inc. Optical based placement of an optical compontent using a pick and place machine

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3808549A (en) * 1972-03-30 1974-04-30 Corning Glass Works Optical waveguide light source
US4084130A (en) * 1974-01-18 1978-04-11 Texas Instruments Incorporated Laser for integrated optical circuits
US4119363A (en) * 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
GB1544241A (en) * 1976-05-11 1979-04-19 Standard Telephones Cables Ltd Injection laser mount
US4186994A (en) * 1978-04-21 1980-02-05 Bell Telephone Laboratories, Incorporated Arrangement for coupling between an electrooptic device and an optical fiber
FR2426347A1 (fr) * 1978-05-18 1979-12-14 Thomson Csf Source laser a semi-conducteur et son procede de fabrication
US4210923A (en) * 1979-01-02 1980-07-01 Bell Telephone Laboratories, Incorporated Edge illuminated photodetector with optical fiber alignment
US4349906A (en) * 1979-09-18 1982-09-14 Xerox Corporation Optically controlled integrated current diode lasers
FR2466866A1 (fr) * 1979-10-05 1981-04-10 Thomson Csf Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede
US4296998A (en) * 1979-12-17 1981-10-27 Bell Telephone Laboratories, Incorporated Encapsulated light source with coupled fiberguide
JPS5788770A (en) * 1980-11-21 1982-06-02 Hitachi Ltd Photo semiconductor device
JPS57198678A (en) * 1981-05-30 1982-12-06 Fujitsu Ltd Optical semiconductor device
US4500165A (en) * 1982-04-02 1985-02-19 Codenoll Technology Corporation Method and apparatus for aligning optical fibers
JPS59143109A (ja) * 1983-02-04 1984-08-16 Sumitomo Electric Ind Ltd 光集積回路
FR2546311B1 (fr) * 1983-05-17 1986-03-28 France Etat Procede et dispositif de connexion entre une fibre optique et un composant d'optique integree comportant un guide d'onde
US4647331A (en) * 1983-07-29 1987-03-03 Motorola, Inc. Method for assembling an electro-optical device
FR2562271B1 (fr) * 1984-03-29 1986-07-18 Telecommunications Sa Connecteur d'une fibre optique et d'un photo-element, recepteur ou emetteur, et procede de positionnement de ceux-ci
JPS6161506U (ko) * 1984-09-26 1986-04-25
JPS61122613A (ja) * 1984-11-20 1986-06-10 Fujitsu Ltd 光分波素子
JPS6242109A (ja) * 1985-08-20 1987-02-24 Oki Electric Ind Co Ltd 光半導体素子と光フアイバの結合器
JPS6273437A (ja) * 1985-09-26 1987-04-04 Mitsubishi Electric Corp 光学式ヘツド装置
JPS63115109A (ja) * 1986-10-31 1988-05-19 Kuraray Co Ltd 光結合器
JPS63188608U (ko) * 1987-05-25 1988-12-02

Also Published As

Publication number Publication date
EP0331336A2 (en) 1989-09-06
CA1301900C (en) 1992-05-26
DE68912790T2 (de) 1994-05-19
EP0331336A3 (en) 1991-01-23
DE68912790D1 (de) 1994-03-17
JP2533637B2 (ja) 1996-09-11
EP0331336B1 (en) 1994-02-02
JPH01255810A (ja) 1989-10-12
KR910005951B1 (ko) 1991-08-09
US4892374A (en) 1990-01-09

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