KR880009068A - 이미드 및 에폭시기를 기본으로 한 열경화성 조성물 - Google Patents

이미드 및 에폭시기를 기본으로 한 열경화성 조성물 Download PDF

Info

Publication number
KR880009068A
KR880009068A KR1019880000106A KR880000106A KR880009068A KR 880009068 A KR880009068 A KR 880009068A KR 1019880000106 A KR1019880000106 A KR 1019880000106A KR 880000106 A KR880000106 A KR 880000106A KR 880009068 A KR880009068 A KR 880009068A
Authority
KR
South Korea
Prior art keywords
epoxy resin
bisimide
diamine
formula
phenylene
Prior art date
Application number
KR1019880000106A
Other languages
English (en)
Other versions
KR950000068B1 (ko
Inventor
아르펭 르네
Original Assignee
모리스 트롤리에
롱-쁠랑쉬미
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모리스 트롤리에, 롱-쁠랑쉬미 filed Critical 모리스 트롤리에
Publication of KR880009068A publication Critical patent/KR880009068A/ko
Application granted granted Critical
Publication of KR950000068B1 publication Critical patent/KR950000068B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
    • C08G73/127—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/125—Unsaturated polyimide precursors the unsaturated precursors containing atoms other than carbon, hydrogen, oxygen or nitrogen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Polymerisation Methods In General (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Treatment Of Liquids With Adsorbents In General (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Epoxy Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Laminated Bodies (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)

Abstract

내용 없음.

Description

이미드 및 에폭시기를 기본으로 한 열경화성 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (5)

  1. 90 내지 200℃의 온도에서 N,N'-비스이미드, 디-1차 디아민 및 에폭시수지간의 반응 생성물로 이루어지며 상기 반응은 하기 점들로 정의됨을 특징으로 하는 열경화성 조성물 : (a) N,N'-비스이미드는 하기식의 생성물이다.
    상기 식에서 : 기호 Y는 H,CH3또는 Cl을 나타내며, 기호 A는 다음의 라디칼들로 구성된 군으로부터 선택되는 2가 라디칼이다: 시클로헥실렌, 페닐렌, 4-메틸-1,3-페닐렌, 2-메틸-1,3-페닐렌, 5-메틸-1,3-페닐렌, 2,5-디에틸-3-메틸-1,4-페닐렌 및 하기 식의 라디칼 :
    상기 식에서, T는 단일 원자가 결합이거나 기 :
    을 나타내며 기호 X는 상호 같거나 다른데 그 각각은 수소원자 또는 메틸, 에틸 또는 이소프로필 라디칼 임. (b) 디-1차 디아민은 하기식의 생성물이다 :
    상기식에서, 기호 B는 기호 A로 표시된 2가 라디칼들 중 하나인데, 이때 동일한 중합체내에 존재하는 기호 A 및 B는 상호 같거나 다를 수 있다. (c) 에폭시수지는 그 에폭시 당량이 100 내지 500이며 이는 에피클로로히드린과 다음으로 구성된 군으로 부터 선택되는 2가 페놀과의 반응으로 얻어지는 글리시딜 에테르로 이루어진다 : 2,2-비스(4-히드록시페닐) 프로판, 비스(4-히드록시페닐)-메탄, 비스(4-히드록시페닐)메틸페닐 메탄, 비스(4-히드록시페닐)톨릴 메탄, 레소르시놀, 히드로퀴논, 피로카테콜, 4,4'-디히드록시페닐, 이들 페놀류와 알데히드와의 축합 반응 생성물 및 이들 페놀류로부터 기원하는 방향족 핵상에 염소화 또는 브롬화된 유도체. (d) 식(I)의 N,N'-비스이미드와 식(II)의 디아민의 양은 비율:이 1.2/1 내지 20/1의 범위내가 되도록 하며; 에폭시수지의 양은 비스이미드+디아민+에폭시수지의 조합 혼합물 중량의 10 내지 40%이며 염소화 또는 브롬화 에폭시수지를 사용하는 경우에는 에폭시수지에 의하여 부여된 염소 또는 브롬의 양은 비스이미드+디아민+에폭시수지의 조합 혼합물의 중량에 대한 원소 염소 또는 원소브롬의 중량%로 표시하여 6%이하이다. (e) 상기 반응은, 분할된 고체상태의 식(I)의 N,N'-비스이미드, 용융상태의 식(II)의 디아민 및 액체 상태의 에폭시수지를 압출기 스크루우를 갖춘 믹서내에 따로따로 도입시키는 것으로 이루어진 연속 제조방 법에 따라 실시된다.
  2. 제1항에 있어서, 사용되는 믹서는 회전운동과 동시에 축방향으로 진동운동을 일으키는 차단날을 갖는 무한 스크루우로 이루어지며 이 스크루우의 차단날과 상호 작용하는 치차를 포함하는 통을 외피로 하고 있음을 특징으로 하는 열경화성 조성물.
  3. 제1항 및 2항 중 어느 하나에 있어서, 디아민(b)과 에폭시수지(c)는 비스이미드(a) 공급대역의 하류에 공급됨을 특징으로 하는 열경화성 조성물.
  4. 제1항 내지 3항 중 어느 하나에 있어서, 염소화 또는 브롬화 에폭시수지를 사용할때에 이는 그 자체로서 또는 비염소화 또는 비브롬화 에폭시수지와 혼합하여 사용하며, 사용되는 에폭시수지 또는 에폭시수지 혼합물에 의하여 부여된 염소 또는 브롬의 양은 비스이미드+디아민+에폭시수지의 조합 혼합물의 중량에 대한 원소염소 또는 원소브롬의 중량%로 표시하여 2 내지 4%의 범위 이내임을 특징으로 하는 열경화성 조성물.
  5. 제1항 내지 4항 중 어느 하나에 따른 열경화성 조성물을 160 내지 280℃의 온도로 가열시키는 것으로 이루어진 경화된 수지의 제조에의 용도.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880000106A 1987-01-09 1988-01-09 이미드 및 에폭시기를 기본으로 한 열경화성 조성물 KR950000068B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8700299A FR2609467B1 (fr) 1987-01-09 1987-01-09 Compositions thermodurcissables a base de groupements imide et epoxy
FR87/00299 1987-01-09

Publications (2)

Publication Number Publication Date
KR880009068A true KR880009068A (ko) 1988-09-14
KR950000068B1 KR950000068B1 (ko) 1995-01-09

Family

ID=9346874

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019880000106A KR950000068B1 (ko) 1987-01-09 1988-01-09 이미드 및 에폭시기를 기본으로 한 열경화성 조성물

Country Status (14)

Country Link
US (2) US4996285A (ko)
EP (1) EP0277887B1 (ko)
JP (1) JPS63179922A (ko)
KR (1) KR950000068B1 (ko)
AT (1) ATE62915T1 (ko)
BR (1) BR8800041A (ko)
CA (1) CA1302610C (ko)
DE (1) DE3862475D1 (ko)
DK (1) DK7088A (ko)
ES (1) ES2021862B3 (ko)
FI (1) FI880091A (ko)
FR (1) FR2609467B1 (ko)
NO (1) NO169448C (ko)
PT (1) PT86515B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5015674A (en) * 1988-08-05 1991-05-14 Mitsui Toatsu Chemicals, Inc. Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide
FR2645540B1 (fr) * 1989-04-10 1991-06-14 Rhone Poulenc Chimie Polymeres a groupements imide a base de maleimides dont un bismaleimide siloxane et de diamines aromatiques et leur procede de preparation
FR2645539B1 (fr) * 1989-04-10 1991-06-14 Rhone Poulenc Chimie Polymeres a groupements imides faits a partir de diamines encombrees
FR2653130B1 (fr) * 1989-10-16 1992-01-03 Rhone Poulenc Chimie Polymeres a groupements imides faits a partir de diamines encombrees.
US5043368A (en) * 1990-12-28 1991-08-27 General Electric Company Polyetherimide/epoxy chopped fiber reinforced laminates and the preparation thereof
US5378740A (en) * 1992-04-30 1995-01-03 The Dexter Corporation Waterborne epoxy derivative composition
US5246751A (en) * 1992-05-18 1993-09-21 The Dow Chemical Company Poly(hydroxy ether imides) as barrier packaging materials
US5856425A (en) * 1997-10-10 1999-01-05 Occidental Chemical Corporation Dispensable resin paste
AR024361A1 (es) 1999-06-15 2002-10-02 Dow Chemical Co Proceso y aparato para preparar una composicion utilizando un reactor continuo y mezclador en serie
JP5497660B2 (ja) * 2007-12-17 2014-05-21 ランクセス・ドイチュランド・ゲーエムベーハー 硬化系およびそれによって得られるコーティング
EP2085416A1 (en) * 2008-01-24 2009-08-05 Flexsys Holding B.V. Epoxy curing system and coatings obtained thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR956605A (ko) * 1943-07-24 1950-02-02
US4374214A (en) * 1971-11-19 1983-02-15 General Electric Company Imide containing blends and polymeric compositions prepared therefrom
FR2165722B1 (ko) * 1971-12-27 1974-08-30 Rhone Poulenc Sa
FR2201313B1 (ko) * 1972-10-02 1975-01-03 Rhone Poulenc Sa
FR2204655B1 (ko) * 1972-10-31 1976-01-30 Rhone Poulenc Ind Fr
FR2259860B1 (ko) * 1974-02-04 1976-12-03 Rhone Poulenc Ind
US4288359A (en) * 1977-11-04 1981-09-08 E. I. Du Pont De Nemours And Company Epoxy imide compositions
US4283521A (en) * 1979-02-14 1981-08-11 Trw Inc. Curable aromatic epoxy-polyimide and cycloaliphatic epoxy-polyimide compositions
JPS5628215A (en) * 1979-08-17 1981-03-19 Hitachi Chem Co Ltd Preparation of imide prepolymer
JPS56115322A (en) * 1980-02-14 1981-09-10 Hitachi Chem Co Ltd Preparation of thermosetting maleimide prepolymer
JPS5749621A (en) * 1980-09-09 1982-03-23 Hitachi Ltd Preparation of heat-resistant resin
US4510272A (en) * 1983-03-16 1985-04-09 Avco Corporation Bis-maleimide-epoxy compositions and prepregs
US4579916A (en) * 1983-11-15 1986-04-01 Ciba-Geigy Corporation Curable mixtures containing an epoxide resin, an imide and a curing catalyst

Also Published As

Publication number Publication date
NO880033D0 (no) 1988-01-06
CA1302610C (fr) 1992-06-02
ES2021862B3 (es) 1991-11-16
FR2609467B1 (fr) 1989-06-09
EP0277887B1 (fr) 1991-04-24
US5075410A (en) 1991-12-24
FR2609467A1 (fr) 1988-07-15
NO169448B (no) 1992-03-16
FI880091A (fi) 1988-07-10
DK7088A (da) 1988-07-10
JPS63179922A (ja) 1988-07-23
NO880033L (no) 1988-07-11
DK7088D0 (da) 1988-01-08
KR950000068B1 (ko) 1995-01-09
US4996285A (en) 1991-02-26
NO169448C (no) 1992-06-24
PT86515B (pt) 1991-12-31
ATE62915T1 (de) 1991-05-15
EP0277887A1 (fr) 1988-08-10
FI880091A0 (fi) 1988-01-08
BR8800041A (pt) 1988-08-02
PT86515A (fr) 1988-02-01
DE3862475D1 (de) 1991-05-29

Similar Documents

Publication Publication Date Title
US3920768A (en) Arylimide-epoxy resin composites
KR880009068A (ko) 이미드 및 에폭시기를 기본으로 한 열경화성 조성물
EP0033394B1 (en) Molding composition consisting of poly(arylether) resins and polyetherimide resins
GB1140961A (en) Polymeric mixtures
JPH0693103A (ja) エポキシ樹脂用強化剤としての高モジュラス・シリコーン
KR870006114A (ko) 이미드를 함유하는 안정한 조성물
US4582886A (en) Heat curable epoxy resin compositions and epoxy resin curing agents
Rao Polyether sulfones
US5262507A (en) High modulus silicones as toughening agents for epoxy resins
EP0170065B1 (en) Molded electrical device, molded circuit board substrate and molded chip carrier
US3742089A (en) Curable compositions of maleimide substituted aromatic material
KR920019865A (ko) 전기 적층판용 에폭시 수지 조성물
US4980427A (en) Toughened bismaleimide resin systems
KR0139001B1 (ko) 방향족 디아민 경화제를 포함하는 에폭시 수지 조성물
KR900006401A (ko) 장애된 디아민으로부터 제조된 이미드기 함유 중합체
JPH05339341A (ja) エポキシ樹脂組成物
Ashok Kumar et al. Preparation and characterization of siliconized epoxy/bismaleimide (N, N′‐bismaleimido‐4, 4′‐diphenyl methane) intercrosslinked matrices for engineering applications
EP0262513A1 (en) Polyimides and method for making
KR900006438A (ko) 에폭시 수지 조성물
KR890000558A (ko) 이미드기를 함유한 디아민-프리(Free) 중합체
KR880005198A (ko) 에폭시 수지 및 에폭시 또는 펜옥시 수지의 혼합물 및 그의 경화 생성물
RU2221816C2 (ru) Эпоксидный олигомер для связующей композиции, способ его получения и способ получения связующей композиции на его основе
KR880005195A (ko) 폴리에테르이미드/에폭시이미드 수지 조성물 및 그의 제조방법
Arnold Structure-property behavior of polyimide homopolymers, copolymers, and blends
Jagadeesh et al. New tetrafunctional epoxy resin system with increased shelf life

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20021220

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee