KR870006158A - 접착제 조성물 및 동 접착제를 이용한 접착방법 - Google Patents

접착제 조성물 및 동 접착제를 이용한 접착방법 Download PDF

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Publication number
KR870006158A
KR870006158A KR860011173A KR860011173A KR870006158A KR 870006158 A KR870006158 A KR 870006158A KR 860011173 A KR860011173 A KR 860011173A KR 860011173 A KR860011173 A KR 860011173A KR 870006158 A KR870006158 A KR 870006158A
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South Korea
Prior art keywords
adhesive composition
copolyimide
bonding method
formula
acid
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Application number
KR860011173A
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English (en)
Inventor
마리아기 폴
곤잘레스 세르쥬
라빌루드 구이
실리용 베르나르
Original Assignee
원본미기재
쌍트르 데뛰드 데 마트리오 오르가니크 뿌르 테크놀로지 아방세
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Application filed by 원본미기재, 쌍트르 데뛰드 데 마트리오 오르가니크 뿌르 테크놀로지 아방세 filed Critical 원본미기재
Publication of KR870006158A publication Critical patent/KR870006158A/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)

Abstract

내용 없음

Description

접착제 조성물 및 동 접착제를 이용한 접착방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (9)

  1. 다음(a),(b),으로된것을 특징으로 하는 접착제 조성물.
    (a) 일반 구조식이 다음과 같은 방향족 화합물 최소한 한 종류와,
    다음과 같은 구조식의 1차디아민 최소한 한 종류와,
    H2N-R-NH2(1)
    다음과 같은 구조식의 1차 디아민 최소한 한 종류가,
    H2N-R1"-O-(-R'-O-)n-R2"-NH2(2)
    반응해서 제조된 에테르가 있는 방향족 지방족 코폴리이미드(Arylaliphatic copolyimides).
    전체 1차 디아민 중 구조식(1)의 디아민은 30∼90몰%이고, 구조식(2)의 디아민은 10∼70몰%이다.
    식중 Ar은 하나 흑은 여러개의 환(cycle)으로 구성된 4가의 방향족 라디칼(aronmtic radical)이고, 이 네개의 원자가는 각각 다른 탄소원자에 존재하고, 두개의 원자는 하나에 대해서 다른 하나가 오르트(ortho) 위치에 있다.
    X와 Y는 각각 수소원자이거나, 탄화수소 라디칼;
    R,R',R1˝,R2˝는 2가인 유기라디칼이고, 이 두 개의 원자가는 분자내에서 가각 다른 탄소 원자에 존재하고;
    n은 0이거나 정수이고;
    (b) 분자내에 작용기가 1개 이상 있는 최소한 한 종류의 에폭시수지 :
  2. 제1항에 있어서, 코폴리이미드의 제조에 사용되는 화합물(3)이 벤즈히드롤데트라카르복실산(Ben-zhydroltetracarboxylic acid)이거나 이 산의 에스테트인 접착제 조성물.
  3. 제1항에 있어서, 코폴리이미드의 제조에 사용되는 화합물(3)이 벤조페논테트라카르복실산(Benzophe-none tetracarboxylic acid)이거나 이 산의 에스테르인 접착제 조성물.
  4. 제1항 내지 제3항중의 한항에 있어서, 코폴리이미드의 제조반응이 80∼400℃의 온도에서 실시되는 것으로 특징되는 접착제 조성물.
  5. 제1항 내지 제4항중의 한항에 있어서, 조성물이 코폴리이미드 100중량부당 에폭시 수지 1∼30중량부를 포함하는 것을 특징으로 하는 접착제 조성물.
  6. 제1항 내지 제5항중의 한항에 있어서, 조성물중 코폴리이미드가 N-메틸퍼롤리돈(N-methylpyr-rolidone) 리터 당 고분자 5g의 농도로 해서 30℃에서 측정한 고유점도(inherent viscosity)가 0.2∼0.8dl/g인 것을 특징으로 하는 접착제 조성물.
  7. 두 기질(substrate)을 부착하기 위해서 두 기질 사이에 청구범위 1∼6항중의 한 항의 조성물을 배치하고, 두 기질사이의 접촉을 유지한 채로 이 제품을 100∼300℃의 온도에서 가열해서 접착하는 방법.
  8. 제7항에 있어서, 접착방법중 가열온도를 100∼200℃로 시행하는 접착방법.
  9. 제7항과 제8항중의 한항에 있어서, 금속 박판 위에 고분자 필름을 부착시키는 것을 특징으로 하는 접착 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR860011173A 1985-12-24 1986-12-24 접착제 조성물 및 동 접착제를 이용한 접착방법 KR870006158A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR85-19277 1985-12-24
FR8519277A FR2592050B1 (fr) 1985-12-24 1985-12-24 Copolyimides arylaliphatiques a enchainements ether, leur preparation, leurs melanges ou produits de reaction avec des resines epoxydes et leur utilisation pour la fabrication de materiaux composites flexibles

Publications (1)

Publication Number Publication Date
KR870006158A true KR870006158A (ko) 1987-07-09

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KR860011173A KR870006158A (ko) 1985-12-24 1986-12-24 접착제 조성물 및 동 접착제를 이용한 접착방법

Country Status (7)

Country Link
US (1) US5093202A (ko)
EP (1) EP0232655B1 (ko)
JP (1) JPS62177066A (ko)
KR (1) KR870006158A (ko)
CN (1) CN86108964A (ko)
DE (1) DE3665068D1 (ko)
FR (1) FR2592050B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970049455A (ko) * 1995-12-01 1997-07-29 디. 엘. 스미쓰 홀/짝수의 1-비트 가산기 셀을 구비하는 가산기

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2621042B1 (fr) * 1987-09-25 1990-01-12 Etu Materiaux Organ Techn Cent Compositions de polyimides gravables en milieu basique
DE69304086T2 (de) * 1992-01-07 1997-04-03 Hitachi Chemical Co Ltd Polyimide, ritzehärtbare Harzzusammensetzungen mit den Polyimide, Formkörper auf die Harzzusammensetzungen und Verfahren zur Herstellung von deren Polyimiden
US5300812A (en) * 1992-12-09 1994-04-05 General Electric Company Plasticized polyetherimide adhesive composition and usage
AU744290B2 (en) * 1997-08-26 2002-02-21 Ranbar Electrical Materials, Inc. Varnish compositions, methods of making and components made therefrom
WO2001051580A1 (fr) * 2000-01-13 2001-07-19 Nitto Denko Corporation Feuille adhesive poreuse, plaquette a semi-conducteurs munie de la feuille adhesive poreuse, et procede de fabrication associe
JP4534418B2 (ja) * 2002-11-14 2010-09-01 日立化成工業株式会社 接着フィルム及びその用途
US7595141B2 (en) * 2004-10-26 2009-09-29 Az Electronic Materials Usa Corp. Composition for coating over a photoresist pattern
FR2980203B1 (fr) * 2011-09-20 2014-12-26 Rhodia Operations Copolyimides thermoplastiques
FR2980201B1 (fr) 2011-09-20 2014-10-24 Rhodia Operations Polyimides thermoplastiques
JP6252482B2 (ja) * 2012-10-11 2017-12-27 日立化成株式会社 粘着剤組成物、積層体及び剥離方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1037374A (en) * 1964-07-14 1966-07-27 British Nylon Spinners Ltd Polyimides and a process for their manufacture
US4075420A (en) * 1975-08-28 1978-02-21 Burroughs Corporation Cover layer for flexible circuits
US4118535A (en) * 1975-11-03 1978-10-03 General Electric Company Novel polyetheramide-imide epoxy resin blends
US4346182A (en) * 1981-04-14 1982-08-24 International Harvester Company Polyimides

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970049455A (ko) * 1995-12-01 1997-07-29 디. 엘. 스미쓰 홀/짝수의 1-비트 가산기 셀을 구비하는 가산기

Also Published As

Publication number Publication date
FR2592050A1 (fr) 1987-06-26
CN86108964A (zh) 1987-08-12
EP0232655B1 (fr) 1989-08-16
EP0232655A1 (fr) 1987-08-19
DE3665068D1 (en) 1989-09-21
FR2592050B1 (fr) 1988-01-08
JPS62177066A (ja) 1987-08-03
US5093202A (en) 1992-03-03

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