KR870001547B1 - 무전해 도금욕 재생방법 및 그 재생장치 - Google Patents

무전해 도금욕 재생방법 및 그 재생장치 Download PDF

Info

Publication number
KR870001547B1
KR870001547B1 KR8201949A KR820001949A KR870001547B1 KR 870001547 B1 KR870001547 B1 KR 870001547B1 KR 8201949 A KR8201949 A KR 8201949A KR 820001949 A KR820001949 A KR 820001949A KR 870001547 B1 KR870001547 B1 KR 870001547B1
Authority
KR
South Korea
Prior art keywords
copper
plating bath
electroless
chelating agent
exchange membrane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR8201949A
Other languages
English (en)
Korean (ko)
Other versions
KR830010223A (ko
Inventor
히데오 혼마
요시아끼 스즈끼
야스히로 마쓰모도
Original Assignee
엔도오 이사오
간또오 가세이 고오교오 가부시기 가이샤
나까무라 미노루
가부시기 가이샤 화시리티이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔도오 이사오, 간또오 가세이 고오교오 가부시기 가이샤, 나까무라 미노루, 가부시기 가이샤 화시리티이 filed Critical 엔도오 이사오
Publication of KR830010223A publication Critical patent/KR830010223A/ko
Application granted granted Critical
Publication of KR870001547B1 publication Critical patent/KR870001547B1/ko
Expired legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
KR8201949A 1982-03-13 1982-05-04 무전해 도금욕 재생방법 및 그 재생장치 Expired KR870001547B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP82-39869 1982-03-13
JP57039869A JPS58157959A (ja) 1982-03-13 1982-03-13 無電解めつき浴の再生方法およびそれに使用する装置
JP39869 1982-03-13
JP82-67364 1982-04-23

Publications (2)

Publication Number Publication Date
KR830010223A KR830010223A (ko) 1983-12-26
KR870001547B1 true KR870001547B1 (ko) 1987-09-02

Family

ID=12564974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR8201949A Expired KR870001547B1 (ko) 1982-03-13 1982-05-04 무전해 도금욕 재생방법 및 그 재생장치

Country Status (2)

Country Link
JP (1) JPS58157959A (enrdf_load_stackoverflow)
KR (1) KR870001547B1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8177956B2 (en) * 2008-03-12 2012-05-15 Micyus Nicole J Method of electrolytically dissolving nickel into electroless nickel plating solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH573126A5 (enrdf_load_stackoverflow) * 1974-06-07 1976-02-27 Bbc Brown Boveri & Cie
JPS5223530A (en) * 1975-08-17 1977-02-22 Inoue Japax Res Treating method of chemical copper plating solution
JPS565965A (en) * 1979-06-27 1981-01-22 Hitachi Ltd Treatment of chemical copper plating waste liquor

Also Published As

Publication number Publication date
JPS58157959A (ja) 1983-09-20
JPS639020B2 (enrdf_load_stackoverflow) 1988-02-25
KR830010223A (ko) 1983-12-26

Similar Documents

Publication Publication Date Title
EP0088852B1 (en) A process for regenerating electroless plating bath and a regenerating apparatus of electroless plating bath
US3470044A (en) Electrolytic regeneration of spent ammonium persulfate etchants
EP0071443A1 (en) Device for waste water treatment
US5478448A (en) Process and apparatus for regenerating an aqueous solution containing metal ions and sulfuric acid
CA2236393C (en) Method and device for regenerating tin-plating solutions
US5804057A (en) Method of removing metal salts from solution by electrolysis an electrode closely associated with an ion exchange resin
HK1048145A1 (en) Method and device for the regulation of the concentration of metal ions in an electrolyte and use thereof
CN101284692A (zh) 印制线路板生产工艺中化学沉铜洗涤废水的处理方法
US4906340A (en) Process for electroplating metals
US4144149A (en) Method for working up aqueous residues from metallizing baths
DE602004009572T2 (de) Verfahren zur regeneration von eisenhaltigen ätzlösungen zur verwendung beim ätzen oder beizen von kupfer oder kupferlegierungen und vorrichtung zur durchführung des verfahrens
DE102007040005A1 (de) Verfahren zum Abscheiden funktioneller Schichten aus einem Galvanikbad
KR870001547B1 (ko) 무전해 도금욕 재생방법 및 그 재생장치
DE2713392C2 (de) Verfahren zum Herstellen von Metallkomplexlösungen
US4734175A (en) Process for regenerating an electroless copper plating bath
USRE34191E (en) Process for electroplating metals
CA1214748A (en) Process for nickel electroreplenishment for nickel refinery electrolyte
JPH06272096A (ja) シアン化物を有していない銅メッキ浴の精製
US4416745A (en) Process for recovering nickel from spent electroless nickel plating solutions
CN113666477A (zh) 一种破络添加剂、棕化废液回收处理方法及回收装置
US3640805A (en) Removal of nitrate contamination from nickel-plating solutions
Melling Treatment of ammoniacal copper etchants
KR20010043597A (ko) 기판의 구리 도금 방법
JPS634634B2 (enrdf_load_stackoverflow)
CN114032558B (zh) 一种从化学镀镍废液中电解制取NiP微米颗粒的方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1605 Publication of application before grant of patent

St.27 status event code: A-2-2-Q10-Q13-nap-PG1605

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 19980903

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 19980903

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000