KR840009318A - 보호피복 또는 부조상의 제조방법 - Google Patents
보호피복 또는 부조상의 제조방법 Download PDFInfo
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- KR840009318A KR840009318A KR1019840002691A KR840002691A KR840009318A KR 840009318 A KR840009318 A KR 840009318A KR 1019840002691 A KR1019840002691 A KR 1019840002691A KR 840002691 A KR840002691 A KR 840002691A KR 840009318 A KR840009318 A KR 840009318A
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/04—Chromates
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0387—Polyamides or polyimides
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S522/904—Monomer or polymer contains initiating group
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S522/908—Dental utility
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Abstract
내용 없음
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
Claims (10)
- 중합체를 기준으로 다음 일반식의 구성단위를 적어도 5mol% 이상 함유하는 방사선-감수성 단일중합체 또는 공중합체로 된 캐리어상에 입혀진 코팅위에 전부위에 걸쳐 광을 조사(照射)하여 보초코팅이 생성되게 하거나 또는 차광마스크하에 광을 조사하여 릴리이프상(relief image)이 생성되게 한 후, 비노출부를 현상제로 제거하는 것으로 구성된 캐리어(carrier) 위에 보초코팅 또는 릴리이프상을 만드는 방법.상기식에서 R은 헤테로원자 또는 방향족, 헤테고리 또는 고리지방족기가 개재될 수 있는 2가의 비치환 또는 치환된 지방족라디칼, 또는 비치환되거나 치환된 고리지방족 또는 방향족지방족라디칼, 또는 2개의 아릴핵이 지방족기를 통해 연결된 방향족라디칼, 또는 적어도 하나의 알킬, 사이클로알킬, 알콕시, 알콕시알킬, 알킬티오, 알킬티오알킬, 하이드록시알킬, 하이드록시알콕시, 하이드록시알킬티오 또는 아르알킬기에 의해 치환된 방향족라디칼이며 여기서 방향족라디칼의 2개의 인접 탄소원자는 알킬렌에 의해 치환되어 있으며, R′는 독립적으로 R과 동일한 의미를 가지며, q는 0 또는 1이며, 방향족라디칼 R은 q가 0인 경우 질소원자에 대해 양쪽 오르토 위치가 앞서 언급한 라디칼에 의해 또는 알킬렌에 의해 치환되지 않는다.
- 제1항에 있어서, 단일중합체 또는 공중합체가 구조식(Ⅰ)의 구성단위를 중합체를 기준으로 5~100몰% 함유하는 방법.
- 제1항에 있어서, 방향족라디칼상의 치환분이 1~20개의 탄소원자를 함유하는 방법.
- 제1항에 있어서, 지방족라디칼 R이 2~30개의 탄소원자를 함유하거나, 고리지방족라디칼 R이 5~8개의 환탄소원자를 함유하거나, 방향지방족라디칼 R이 7~30개의 탄소원자를 함유하거나 치환된 방향족라디칼 R이 7~30개의 탄소원자를 함유하는 방법.
- 제1항에 있어서, 지방족라디칼 R이 산소원자, NH, NRa또는,(Ra는 C1~C12알킬, 환탄소원자를 5 또는 6개 함유하는 사이클로알킬, 페닐 또는 벤질이며,는 양성자산의 음이온임) 사이클로헥실렌나프틸렌, 페닐렌 또는 히단토인이 개재될 수 있는 직쇄 또는 분리쇄 알킬렌이거나, 고리지방족라디칼 R이 5~7개의 환탄소원자를 가지며 알킬에 의해 치환되거나 비치환된 단일고리 또는 두고리 사이클로알킬렌이거나, 방향지방족라디칼 R이 비치환되었거나 또는 아릴 부위가 알킬에 의해 치환된 아르알킬렌이거나(알킬렌라디칼은 직쇄 또는 분리쇄일 수 있음), 또는 방향족라디칼 R이 알킬, 알콕시, 알콕시알킬, 트리메틸렌 또는 테트라메틸렌에 의해 치환된 탄화수소라디칼 또는 피리딘라디칼인 방법.
- 제5항에 있어서, 방향족라디칼이 하기 구조식을 가지며단일치환의 경우엔 하나의 라디칼 R4가 C1_6알킬이고 나머지 라디칼 R4이 수소이며, 디-트리, 또는 테트라-치환의 경우엔, 2개의 라디칼 R4가 알킬이고 나머지 라디칼 R4가 수소원자 또는 C1_6알킬이거나 또는 디-트리-테트라-치환의 경우 페닐환상에 있는 2개의 인접한 라디칼 R4가 트리메틸렌 또는 테트라메틸렌이고 나머지 R4가 수소원자 또는 C1_6알킬이며, Y가 O,S,NH,CO 또는 CH2이며, R5가 수소원자, C1_5알킬이며, R6가 C1_5알킬이며, Z가 직접 결합을 나타내거나 또는 O,S,SO,SO2,CO,,NR7,CONH,NH,R7SiR8,R7OSiOR8,C1_6알킬렌, C2_6알케닐렌 또는 알킬리덴, 페닐렌 또는 페닐디옥시이며 여기서 R7과 R8가 각기 독립적으로 C1_6알킬 또는 페닐이며 j가 1~10인 방법.
- 제1항에 있어서, 단일중합체 또는 공중합체가 폴리이미드, 폴리아미드, 포화폴리에스테르, 폴리카보네이트, 폴리아미드-이미드, 폴리에스테르-아미드폴리실옥산, 불포화폴리에스테르, 에폭시수지, 방향족폴리에테르, 방향족 폴리에테르-케톤, 방향족 폴리에테르-설폰, 방향족폴리케톤, 방향족폴리티오에테르 및 이들 중합체의 혼합물로 구성된 군으로부터 선택되는 방법.
- 제7항에 있어서, 중합체가 q가 0인 구조식(I)의 반복되는 구성요소를 함유하는 폴리이미드이거나 또는 q가 0인 구조식(I)의 반복되는 구성요소와 구조식(Ⅱ)의 반복되는 구성요소를 함유하는 코폴리이미드인 방법.상기식에서 A는 4가 유기라디칼이며 R10은 2가 유기라디칼이다.
- 제7항에 있어서, 중합체가 유기디아민, 디카르복실산, w-아미노카르복실산, q가 1이며 아민기 또는 카르복실기가 R 및 R1기에 결합된 구조식(I)의 구성요소를 함유한 디카르복실산 또는 디아민 및 단량체 혼합물로 된 폴리아미드 또는 코폴리아미드인 방법.
- 제7항에 있어서, 중합체가 유기디올, 디카르복실산, 하이드록시카르복실산, q가 1이며 하이드록시 또는 카르복실기가 R 및 R′기에 결합되어 있는 구조식(I)의 구성요소를 함유한 디카르복실산 또는 디올 및 단량체 혼합물로 된 폴리에스테르 또는 코폴리에스테르인 방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH83-2690 | 1983-05-18 | ||
CH2690/83-0 | 1983-05-18 | ||
CH269083 | 1983-05-18 | ||
CH556983 | 1983-10-12 | ||
CH83-5569 | 1983-10-12 |
Publications (2)
Publication Number | Publication Date |
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KR840009318A true KR840009318A (ko) | 1984-12-26 |
KR920008723B1 KR920008723B1 (ko) | 1992-10-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1019840002691A KR920008723B1 (ko) | 1983-05-18 | 1984-05-17 | 보호용 피복물 또는 릴리이프상의 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4657832A (ko) |
EP (1) | EP0134752B1 (ko) |
KR (1) | KR920008723B1 (ko) |
CA (1) | CA1256759A (ko) |
DE (1) | DE3469073D1 (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0162017B1 (de) * | 1984-05-17 | 1991-08-21 | Ciba-Geigy Ag | Homo- und Copolymere, Verfahren zu deren Vernetzung und derenVerwendung |
US4698295A (en) * | 1984-11-16 | 1987-10-06 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives |
US4914181A (en) * | 1984-11-16 | 1990-04-03 | Ciba-Geigy Corporation | Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives |
EP0200680A3 (de) * | 1985-04-11 | 1988-10-05 | Ciba-Geigy Ag | Beschichtetes Material und dessen Verwendung |
US4696890A (en) * | 1985-04-11 | 1987-09-29 | Ciba-Geigy Corporation | Processes for preparing protective coatings and relief structures |
US4786569A (en) * | 1985-09-04 | 1988-11-22 | Ciba-Geigy Corporation | Adhesively bonded photostructurable polyimide film |
US4847359A (en) * | 1986-06-30 | 1989-07-11 | Ciba-Geigy Corporation | Diamino-9,10-dihydroanthracenes and polyamide acid (esters) and polyimides derived therefrom |
DE3767392D1 (de) * | 1986-07-08 | 1991-02-21 | Ciba Geigy Ag | Beschichtetes material enthaltend eine strahlungsempfindliche polyimidschicht mit speziellen diaminodiphenylmethaneinheiten. |
US4717393A (en) * | 1986-10-27 | 1988-01-05 | E. I. Du Pont De Nemours And Company | Polyimide gas separation membranes |
US4767191A (en) * | 1986-11-14 | 1988-08-30 | U.S. Philips Corporation | Display cell |
US4851506A (en) * | 1986-12-29 | 1989-07-25 | Ciba-Geigy Corporation | Photostructurable polyimide mixtures |
US4927736A (en) * | 1987-07-21 | 1990-05-22 | Hoechst Celanese Corporation | Hydroxy polyimides and high temperature positive photoresists therefrom |
US4925912A (en) * | 1987-12-15 | 1990-05-15 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
US5102959A (en) * | 1987-12-15 | 1992-04-07 | Ciba-Geigy Corporation | Auto-photocrosslinkable copolyimides and polyimide compositions |
DE3833437A1 (de) * | 1988-10-01 | 1990-04-05 | Basf Ag | Strahlungsempfindliche gemische und deren verwendung |
DE3833438A1 (de) * | 1988-10-01 | 1990-04-05 | Basf Ag | Strahlungsempfindliche gemische und deren verwendung |
EP0378156A3 (en) * | 1989-01-09 | 1992-02-26 | Nitto Denko Corporation | Positively photosensitive polyimide composition |
EP0381620A3 (de) * | 1989-02-01 | 1992-01-02 | Ciba-Geigy Ag | Verfahren zur Herstellung von vernetzten Produkten und neue Polymere |
US5169494A (en) * | 1989-03-27 | 1992-12-08 | Matsushita Electric Industrial Co., Ltd. | Fine pattern forming method |
AT392974B (de) * | 1989-07-13 | 1991-07-25 | Chemiefaser Lenzing Ag | Mischpolyimide sowie verfahren zu ihrer herstellung |
US5288588A (en) * | 1989-10-27 | 1994-02-22 | Nissan Chemical Industries Ltd. | Positive photosensitive polyimide resin composition comprising an o-quinone diazide as a photosensitive compound |
US5229257A (en) * | 1990-04-30 | 1993-07-20 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polymide polymer compositions |
US5091289A (en) * | 1990-04-30 | 1992-02-25 | International Business Machines Corporation | Process for forming multi-level coplanar conductor/insulator films employing photosensitive polyimide polymer compositions |
US5427862A (en) * | 1990-05-08 | 1995-06-27 | Amoco Corporation | Photocurable polyimide coated glass fiber |
CA2040994A1 (en) * | 1990-05-08 | 1991-11-09 | David D. Ngo | Photoimageable polyimide coating |
DE59108347D1 (de) * | 1990-10-02 | 1996-12-19 | Ciba Geigy Ag | Lösliche Polyimide |
EP0506368B1 (en) * | 1991-03-26 | 2002-09-04 | Fujitsu Limited | Organic functional thin film, fabrication and use thereof |
DE59304881D1 (de) * | 1992-10-15 | 1997-02-06 | Ciba Geigy Ag | Polymerisierbare photochrome Napthacendione, Polymere dieser Monomeren, Verfahren zu deren Herstellung, und deren Verwendung |
US5317082A (en) * | 1992-12-22 | 1994-05-31 | Amoco Corporation | Photodefinable optical waveguides |
US6462107B1 (en) | 1997-12-23 | 2002-10-08 | The Texas A&M University System | Photoimageable compositions and films for printed wiring board manufacture |
WO2004003602A1 (en) * | 2002-06-27 | 2004-01-08 | Pirelli & C. S.P.A. | Polymide optical waveguides and method for the preparation thereof |
KR100981830B1 (ko) * | 2005-09-22 | 2010-09-13 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 네거티브형 감광성 수지 조성물, 패턴 형성방법 및전자부품 |
US20100159217A1 (en) * | 2006-06-20 | 2010-06-24 | Hitachi Chemical Dupont Microsystems, Ltd | Negative-type photosensitive resin composition, method for forming patterns, and electronic parts |
EP2133743B1 (en) * | 2007-03-12 | 2018-01-24 | Hitachi Chemical DuPont Microsystems, Ltd. | Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part |
JP5316417B2 (ja) * | 2007-10-29 | 2013-10-16 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
US10196537B2 (en) | 2013-03-15 | 2019-02-05 | The Sherwin-Williams Company | Dirt pick-up resistant composition |
CN109777177B (zh) | 2013-03-15 | 2022-03-15 | 宣伟投资管理有限公司 | 耐沾污性的水基组合物 |
WO2019232051A1 (en) * | 2018-05-29 | 2019-12-05 | Swimc Llc | Water-based compositions with long term gloss retention |
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US3325450A (en) * | 1965-05-12 | 1967-06-13 | Gen Electric | Polysiloxaneimides and their production |
US3666709A (en) * | 1968-12-14 | 1972-05-30 | Shawa Densen Denran Kk A K A S | Solvent soluble aromatic polymides and production thereof |
US3634304A (en) * | 1969-05-21 | 1972-01-11 | Showa Densen Kk | Novel polyimides and compositions thereof that are soluble in phenolic solvents |
US3926638A (en) * | 1971-11-18 | 1975-12-16 | Sun Chemical Corp | Photopolymerizable compositions comprising monocarboxyl-substituted benzophenone reaction products |
US3759913A (en) * | 1972-09-11 | 1973-09-18 | Minnesota Mining & Mfg | Polyimide polymers of benzophenone tetracarboxylic dianhydrides and saturated aliphatic diamines |
GB2053941B (en) * | 1979-05-11 | 1983-11-16 | Minnesota Mining & Mfg | Curing of polyamic acids or salts thereof by ultraviolet exposure |
US4331705A (en) * | 1979-05-11 | 1982-05-25 | Minnesota Mining And Manufacturing Company | Curing of polyamic acids or salts thereof by ultraviolet exposure |
JPS5691714A (en) * | 1979-12-27 | 1981-07-24 | Shiyouichi Yamaura | Frame of selling table |
DE3007445A1 (de) * | 1980-02-28 | 1981-09-10 | Toyo Boseki K.K., Osaka | Verfahren zur herstellung von geformten gegenstaenden aus polymerem material und diese gegenstaende |
JPS56121203A (en) * | 1980-02-29 | 1981-09-24 | Toyo Boseki | Electric article |
US4578166A (en) * | 1980-02-29 | 1986-03-25 | Toyo Boseki Kabushiki Kaisha | Process of actinic irradiation of shaped polyester imide containing benzophenone tetracarboxylic diimide group and cross-linked product |
GB2092164B (en) * | 1980-12-17 | 1984-12-05 | Hitachi Ltd | Loght or radiation-sensitive polymer composition |
-
1984
- 1984-05-10 US US06/608,754 patent/US4657832A/en not_active Expired - Lifetime
- 1984-05-14 EP EP84810231A patent/EP0134752B1/de not_active Expired
- 1984-05-14 DE DE8484810231T patent/DE3469073D1/de not_active Expired
- 1984-05-16 CA CA000454406A patent/CA1256759A/en not_active Expired
- 1984-05-17 KR KR1019840002691A patent/KR920008723B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE3469073D1 (en) | 1988-03-03 |
EP0134752A1 (de) | 1985-03-20 |
US4657832A (en) | 1987-04-14 |
EP0134752B1 (de) | 1988-01-27 |
CA1256759A (en) | 1989-07-04 |
KR920008723B1 (ko) | 1992-10-08 |
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