KR840006080A - 열저항성이 높은 중합체의 안전 구조형성용 광저항제 - Google Patents

열저항성이 높은 중합체의 안전 구조형성용 광저항제 Download PDF

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Publication number
KR840006080A
KR840006080A KR1019830004299A KR830004299A KR840006080A KR 840006080 A KR840006080 A KR 840006080A KR 1019830004299 A KR1019830004299 A KR 1019830004299A KR 830004299 A KR830004299 A KR 830004299A KR 840006080 A KR840006080 A KR 840006080A
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KR
South Korea
Prior art keywords
sheet
film
safety structure
polymer
photoresist
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Application number
KR1019830004299A
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English (en)
Inventor
클루그 루돌프 (외 3)
Original Assignee
엘빈 감스, 브리기테 나우만
메르크 파텐트 게젤샤프트 미트 베슈랭크터 하프퉁
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Application filed by 엘빈 감스, 브리기테 나우만, 메르크 파텐트 게젤샤프트 미트 베슈랭크터 하프퉁 filed Critical 엘빈 감스, 브리기테 나우만
Publication of KR840006080A publication Critical patent/KR840006080A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/18—Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to irradiated or oxidised macromolecules

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Formation Of Insulating Films (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

내용 없음

Description

열저항성이 높은 중합체의 안전 구조형성용 광저항제
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음

Claims (3)

  1. 비등점 180°이상인 조사반응성(radiation-reactive) 중합가능한 알릴화합물을 적어도 하나 포함하며, 여기서 알릴기는 산소, 유황 또는 질소원자를 통해 결합됨을 특징으로 하는, 높은 열저항성을 갖는 중합체의 안전구조을 형성하고, 카르복실기에 에스테르처럼 결합된 조사반응성 가용 전구체를 함유하는 광저항제 (photoresist).
  2. 비등점이 180℃이상이고, 알릴기가산소, 유황 및 질소원자를 통해 결합되는 조사반응성, 중합가능한 알릴화합물을 열저항성이 높은 중합체의 안전구조를 형성하고, 카르복실기에 에스테르처럼 결합된 조사반응성 라디칼을 운반하는 가용 중합체성 전구체를 함유하는 광정항제에 사용하는 방법.
  3. 제1항에 따른 광저항제를 사용함을 특징으로하여, 카르복실기에 에스테르처럼 결합된 조사반응성 라디칼을 운반하는 가용 중합체성 전구체를 함유하는 광저항제를 필름 또는 쉬이트(sheet)형태로 기체(substrate)에 적용하고, 필름또는 쉬이트를 건조하고, 조사반응성 필름 또는 쉬이트를 네가티브 오리지날 (negative original)을 통해 조사하고, 필름 또는 쉬이트의 비조사된 부분을 용해제거 또는 벗겨내고,적합한다면, 수득한 안전구조를 열처리하는 열저항성이 높은 중합체의 안전구조의 제조방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019830004299A 1982-09-13 1983-09-13 열저항성이 높은 중합체의 안전 구조형성용 광저항제 KR840006080A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3233912.7 1982-09-13
DE19823233912 DE3233912A1 (de) 1982-09-13 1982-09-13 Fotolacke zur ausbildung von reliefstrukturen aus hochwaermebestaendigen polymeren

Publications (1)

Publication Number Publication Date
KR840006080A true KR840006080A (ko) 1984-11-21

Family

ID=6173084

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830004299A KR840006080A (ko) 1982-09-13 1983-09-13 열저항성이 높은 중합체의 안전 구조형성용 광저항제

Country Status (6)

Country Link
US (1) US4540650A (ko)
EP (1) EP0103225B1 (ko)
JP (1) JPS5968733A (ko)
KR (1) KR840006080A (ko)
AT (1) ATE25433T1 (ko)
DE (2) DE3233912A1 (ko)

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DE3411714A1 (de) * 1984-03-29 1985-10-10 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimidazol- und polyimidazopyrrolon-reliefstrukturen
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DE3513779A1 (de) * 1985-04-17 1986-10-23 Merck Patent Gmbh, 6100 Darmstadt Stabilisierte loesungen strahlungsvernetzbarer polymervorstufen hochwaermebestaendiger polymere
JPS62257147A (ja) * 1986-04-30 1987-11-09 Nitto Boseki Co Ltd 新規な感光性樹脂組成物
JP2626696B2 (ja) * 1988-04-11 1997-07-02 チッソ株式会社 感光性重合体
JPH05326092A (ja) * 1992-05-27 1993-12-10 Yamaichi Electron Co Ltd Ｉｃパッケージ用ソケット
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6852814B2 (en) * 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US20030055121A1 (en) * 1996-09-10 2003-03-20 Dershem Stephen M. Thermosetting resin compositions containing maleimide and/or vinyl compounds
CN1253969A (zh) * 1998-07-02 2000-05-24 国家淀粉及化学投资控股公司 由烯丙基化酰胺化合物制备的电路元件
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US6265530B1 (en) 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
SG78377A1 (en) * 1998-07-02 2001-02-20 Nat Starch Chem Invest Method of making electronic component using reworkable adhesives
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
GB9816167D0 (en) * 1998-07-25 1998-09-23 Secr Defence Polymer production
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Also Published As

Publication number Publication date
DE3233912A1 (de) 1984-03-15
EP0103225A3 (en) 1985-01-16
DE3369742D1 (en) 1987-03-12
EP0103225A2 (de) 1984-03-21
EP0103225B1 (de) 1987-02-04
US4540650A (en) 1985-09-10
JPH052979B2 (ko) 1993-01-13
JPS5968733A (ja) 1984-04-18
ATE25433T1 (de) 1987-02-15

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