KR830007031A - Soldering method of wiring - Google Patents

Soldering method of wiring Download PDF

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Publication number
KR830007031A
KR830007031A KR1019810001539A KR810001539A KR830007031A KR 830007031 A KR830007031 A KR 830007031A KR 1019810001539 A KR1019810001539 A KR 1019810001539A KR 810001539 A KR810001539 A KR 810001539A KR 830007031 A KR830007031 A KR 830007031A
Authority
KR
South Korea
Prior art keywords
lead wires
solder
electronic component
wiring
bonding
Prior art date
Application number
KR1019810001539A
Other languages
Korean (ko)
Other versions
KR850000141B1 (en
Inventor
세이끼 나까니시
스스무 요시다
Original Assignee
히고 이찌로오
신닛뽄 덴끼 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히고 이찌로오, 신닛뽄 덴끼 가부시기가이샤 filed Critical 히고 이찌로오
Priority to KR1019810001539A priority Critical patent/KR850000141B1/en
Publication of KR830007031A publication Critical patent/KR830007031A/en
Application granted granted Critical
Publication of KR850000141B1 publication Critical patent/KR850000141B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

내용 없음No content

Description

배선체의 납땜 처리 방법Soldering method of wiring

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 종래의 2회 납땜 처리 방법에 있어서 납땜 접합장치의 개략 설명도.1 is a schematic explanatory diagram of a solder joint apparatus in a conventional two-time soldering process.

제2도는 본 발명의 납땜 처리 방법에 있어서의 납땜 접합장치의 개략 설명도.2 is a schematic explanatory diagram of a solder joint apparatus in the soldering treatment method of the present invention.

제3도는 제도의 처리에 있어서 프린트 기판을 사용한 경우의 납땜 디프 후의 배선체의 부분단면도.3 is a partial cross-sectional view of the wiring body after soldering deepening when a printed circuit board is used in the processing of drafting.

제4도는 제3도의 배선체를 완성한 상태의 부분단면도.4 is a partial cross-sectional view of a state in which the wiring body of FIG. 3 is completed.

제5도는 본 발명의 다른 구체적예로서 환형단자를 사용한 배선체에 있어서의 완성후의 부분단면도.5 is a partial cross-sectional view after completion of the wiring body using the annular terminal as another specific example of the present invention.

Claims (1)

다수의 삽통공을 설치한 회로부품의 보전지지체에 다수의 리이드선을 보유하는 전자부품을 삽착하여 임시적으로 고정하는 공정, 임시적으로 고정한 전자부품의 리이드선에 대하여 땜납 침지하는 공정, 납땜접합 고정된 전기한 리이드선의 불요부분을 절단하는 공정, 전기한 리이드선의 잔여부분을 재차 가열하여 피착된 납땜을 용융하여 전기한 리이드선에 대해 납땜 피착된 것을 수정하는 공정을 포함하여 전기한 보전 지지체가 다수의 환형단자를 소정위치로 배치한 납땜 비접합성의 금속기판이어서 전기한 전자부품의 자동적 납땜 접합을 가능하게 하는 것을 특징으로 하는 배선체의 납땜 처리방법.The process of inserting and temporarily fixing an electronic component having a plurality of lead wires to the holding member of a circuit component having a plurality of insertion holes, the process of solder immersing the lead wire of the temporarily fixed electronic component, the solder joint fixed A plurality of maintenance supports, including the steps of cutting the unnecessary portions of the lead wires described above, and heating the remaining portions of the lead wires again to melt the deposited solders and correcting the solder deposits on the lead wires. A soldering non-bonding metal substrate having an annular terminal arranged at a predetermined position to enable automatic solder bonding of electrical components. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019810001539A 1981-05-04 1981-05-04 Brazing soldering method for patch board KR850000141B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019810001539A KR850000141B1 (en) 1981-05-04 1981-05-04 Brazing soldering method for patch board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019810001539A KR850000141B1 (en) 1981-05-04 1981-05-04 Brazing soldering method for patch board

Publications (2)

Publication Number Publication Date
KR830007031A true KR830007031A (en) 1983-10-12
KR850000141B1 KR850000141B1 (en) 1985-02-27

Family

ID=19220855

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019810001539A KR850000141B1 (en) 1981-05-04 1981-05-04 Brazing soldering method for patch board

Country Status (1)

Country Link
KR (1) KR850000141B1 (en)

Also Published As

Publication number Publication date
KR850000141B1 (en) 1985-02-27

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