KR20250135766A - 가용성 고분자 화합물, 가용성 고분자 화합물의 제조 방법, 수지 조성물, 수지 조성물 필름, 경화막, 및 전자부품 - Google Patents

가용성 고분자 화합물, 가용성 고분자 화합물의 제조 방법, 수지 조성물, 수지 조성물 필름, 경화막, 및 전자부품

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Publication number
KR20250135766A
KR20250135766A KR1020257015756A KR20257015756A KR20250135766A KR 20250135766 A KR20250135766 A KR 20250135766A KR 1020257015756 A KR1020257015756 A KR 1020257015756A KR 20257015756 A KR20257015756 A KR 20257015756A KR 20250135766 A KR20250135766 A KR 20250135766A
Authority
KR
South Korea
Prior art keywords
resin composition
polymer compound
soluble polymer
chemical formula
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257015756A
Other languages
English (en)
Korean (ko)
Inventor
케이고 카토
카즈유키 마츠무라
요시코 타테오카
Original Assignee
도레이 카부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20250135766A publication Critical patent/KR20250135766A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020257015756A 2023-01-23 2023-12-20 가용성 고분자 화합물, 가용성 고분자 화합물의 제조 방법, 수지 조성물, 수지 조성물 필름, 경화막, 및 전자부품 Pending KR20250135766A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023007806 2023-01-23
JPJP-P-2023-007806 2023-01-23
PCT/JP2023/045659 WO2024157672A1 (ja) 2023-01-23 2023-12-20 可溶性高分子化合物、可溶性高分子化合物の製造方法、樹脂組成物、樹脂組成物フィルム、硬化膜、および電子部品

Publications (1)

Publication Number Publication Date
KR20250135766A true KR20250135766A (ko) 2025-09-15

Family

ID=91970423

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257015756A Pending KR20250135766A (ko) 2023-01-23 2023-12-20 가용성 고분자 화합물, 가용성 고분자 화합물의 제조 방법, 수지 조성물, 수지 조성물 필름, 경화막, 및 전자부품

Country Status (5)

Country Link
JP (1) JPWO2024157672A1 (https=)
KR (1) KR20250135766A (https=)
CN (1) CN120569428A (https=)
TW (1) TW202446835A (https=)
WO (1) WO2024157672A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015137271A (ja) 2014-01-24 2015-07-30 信越化学工業株式会社 シランカップリング剤及びその製造方法、プライマー組成物並びに塗料組成物
JP2019007020A (ja) 2013-02-07 2019-01-17 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体およびフレキシブルデバイス、並びに積層体の製造方法
WO2021059843A1 (ja) 2019-09-24 2021-04-01 東レ株式会社 樹脂組成物、樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2551214B2 (ja) * 1990-08-06 1996-11-06 信越化学工業株式会社 硬化性樹脂溶液組成物及びその製造方法並びに電子部品用保護膜
JPH04351667A (ja) * 1991-05-29 1992-12-07 Shin Etsu Chem Co Ltd 硬化性樹脂組成物及び電子部品用保護膜
JP6437293B2 (ja) * 2014-12-10 2018-12-12 ユニチカ株式会社 メタルベース基板
JP7173103B2 (ja) * 2020-03-31 2022-11-16 住友ベークライト株式会社 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019007020A (ja) 2013-02-07 2019-01-17 株式会社カネカ アルコキシシラン変性ポリアミド酸溶液、それを用いた積層体およびフレキシブルデバイス、並びに積層体の製造方法
JP2015137271A (ja) 2014-01-24 2015-07-30 信越化学工業株式会社 シランカップリング剤及びその製造方法、プライマー組成物並びに塗料組成物
WO2021059843A1 (ja) 2019-09-24 2021-04-01 東レ株式会社 樹脂組成物、樹脂組成物フィルム、硬化膜、これらを用いた中空構造体、および半導体装置

Also Published As

Publication number Publication date
WO2024157672A1 (ja) 2024-08-02
CN120569428A (zh) 2025-08-29
JPWO2024157672A1 (https=) 2024-08-02
TW202446835A (zh) 2024-12-01

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