JPWO2024157672A1 - - Google Patents
Info
- Publication number
- JPWO2024157672A1 JPWO2024157672A1 JP2023578927A JP2023578927A JPWO2024157672A1 JP WO2024157672 A1 JPWO2024157672 A1 JP WO2024157672A1 JP 2023578927 A JP2023578927 A JP 2023578927A JP 2023578927 A JP2023578927 A JP 2023578927A JP WO2024157672 A1 JPWO2024157672 A1 JP WO2024157672A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
- C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023007806 | 2023-01-23 | ||
| PCT/JP2023/045659 WO2024157672A1 (ja) | 2023-01-23 | 2023-12-20 | 可溶性高分子化合物、可溶性高分子化合物の製造方法、樹脂組成物、樹脂組成物フィルム、硬化膜、および電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024157672A1 true JPWO2024157672A1 (https=) | 2024-08-02 |
Family
ID=91970423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023578927A Pending JPWO2024157672A1 (https=) | 2023-01-23 | 2023-12-20 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024157672A1 (https=) |
| KR (1) | KR20250135766A (https=) |
| CN (1) | CN120569428A (https=) |
| TW (1) | TW202446835A (https=) |
| WO (1) | WO2024157672A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2551214B2 (ja) * | 1990-08-06 | 1996-11-06 | 信越化学工業株式会社 | 硬化性樹脂溶液組成物及びその製造方法並びに電子部品用保護膜 |
| JPH04351667A (ja) * | 1991-05-29 | 1992-12-07 | Shin Etsu Chem Co Ltd | 硬化性樹脂組成物及び電子部品用保護膜 |
| US10435510B2 (en) | 2013-02-07 | 2019-10-08 | Kaneka Corporation | Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate |
| JP6070589B2 (ja) | 2014-01-24 | 2017-02-01 | 信越化学工業株式会社 | シランカップリング剤及びその製造方法、プライマー組成物並びに塗料組成物 |
| JP6437293B2 (ja) * | 2014-12-10 | 2018-12-12 | ユニチカ株式会社 | メタルベース基板 |
| US12545784B2 (en) | 2019-09-24 | 2026-02-10 | Toray Industries, Inc. | Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device |
| JP7173103B2 (ja) * | 2020-03-31 | 2022-11-16 | 住友ベークライト株式会社 | 感光性樹脂組成物、電子デバイスの製造方法および電子デバイス |
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2023
- 2023-12-20 CN CN202380091612.3A patent/CN120569428A/zh active Pending
- 2023-12-20 WO PCT/JP2023/045659 patent/WO2024157672A1/ja not_active Ceased
- 2023-12-20 KR KR1020257015756A patent/KR20250135766A/ko active Pending
- 2023-12-20 JP JP2023578927A patent/JPWO2024157672A1/ja active Pending
-
2024
- 2024-01-04 TW TW113100331A patent/TW202446835A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250135766A (ko) | 2025-09-15 |
| WO2024157672A1 (ja) | 2024-08-02 |
| CN120569428A (zh) | 2025-08-29 |
| TW202446835A (zh) | 2024-12-01 |