KR20250030475A - 접착제 조성물, 본딩 필름, 접착제 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름 - Google Patents

접착제 조성물, 본딩 필름, 접착제 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름 Download PDF

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Publication number
KR20250030475A
KR20250030475A KR1020257000837A KR20257000837A KR20250030475A KR 20250030475 A KR20250030475 A KR 20250030475A KR 1020257000837 A KR1020257000837 A KR 1020257000837A KR 20257000837 A KR20257000837 A KR 20257000837A KR 20250030475 A KR20250030475 A KR 20250030475A
Authority
KR
South Korea
Prior art keywords
adhesive composition
acid
carbon atoms
polyester
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257000837A
Other languages
English (en)
Korean (ko)
Inventor
마사루 안도
마사히로 토리이
아이 이와타
마코토 히라카와
Original Assignee
도아고세이가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도아고세이가부시키가이샤 filed Critical 도아고세이가부시키가이샤
Publication of KR20250030475A publication Critical patent/KR20250030475A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
KR1020257000837A 2022-07-06 2023-07-03 접착제 조성물, 본딩 필름, 접착제 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름 Pending KR20250030475A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022109188 2022-07-06
JPJP-P-2022-109188 2022-07-06
PCT/JP2023/024689 WO2024009969A1 (ja) 2022-07-06 2023-07-03 接着剤組成物、ボンディングフィルム、接着剤組成物層付き積層体、積層体、及び、電磁波シールドフィルム

Publications (1)

Publication Number Publication Date
KR20250030475A true KR20250030475A (ko) 2025-03-05

Family

ID=89453384

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257000837A Pending KR20250030475A (ko) 2022-07-06 2023-07-03 접착제 조성물, 본딩 필름, 접착제 조성물층 부착 적층체, 적층체 및 전자파 차폐 필름

Country Status (5)

Country Link
JP (1) JPWO2024009969A1 (https=)
KR (1) KR20250030475A (https=)
CN (1) CN119452058A (https=)
TW (1) TW202411390A (https=)
WO (1) WO2024009969A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034325A1 (ja) * 2024-08-07 2026-02-12 東亞合成株式会社 接着剤組成物、ボンディングフィルム、接着剤層付き積層体、電磁波シールド材及び積層体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3633274B2 (ja) * 1997-04-07 2005-03-30 日立化成工業株式会社 樹脂組成物及び接着フィルム
JP2001354938A (ja) * 2000-06-12 2001-12-25 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置
JP2009001793A (ja) * 2008-06-06 2009-01-08 Kaneka Corp 接着剤
KR101741292B1 (ko) * 2010-07-23 2017-05-29 다츠다 덴센 가부시키가이샤 접착제 조성물 및 접착 필름
CN103923585A (zh) * 2014-04-03 2014-07-16 新纶科技（常州）有限公司 一种导电粘接剂组合物和导电粘接膜
JP2015228457A (ja) * 2014-06-02 2015-12-17 デクセリアルズ株式会社 太陽電池用導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法
EP3165554A4 (en) * 2014-07-02 2018-02-28 Toyo Ink SC Holdings Co., Ltd. Heat-curable resin composition, polyamide, adhesive sheet, cured article, and printed wiring board
WO2022085563A1 (ja) * 2020-10-23 2022-04-28 東亞合成株式会社 樹脂組成物、ボンディングフィルム、樹脂組成物層付き積層体、積層体、及び、電磁波シールドフィルム

Also Published As

Publication number Publication date
CN119452058A (zh) 2025-02-14
TW202411390A (zh) 2024-03-16
WO2024009969A1 (ja) 2024-01-11
JPWO2024009969A1 (https=) 2024-01-11

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PA0105 International application

Patent event date: 20250109

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application