TW202411390A - 黏著劑組成物、黏合薄膜、附有黏著劑組成物層的積層體、積層體、及電磁波屏蔽薄膜 - Google Patents

黏著劑組成物、黏合薄膜、附有黏著劑組成物層的積層體、積層體、及電磁波屏蔽薄膜 Download PDF

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Publication number
TW202411390A
TW202411390A TW112125058A TW112125058A TW202411390A TW 202411390 A TW202411390 A TW 202411390A TW 112125058 A TW112125058 A TW 112125058A TW 112125058 A TW112125058 A TW 112125058A TW 202411390 A TW202411390 A TW 202411390A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
polyester
acid
carbon atoms
resin
Prior art date
Application number
TW112125058A
Other languages
English (en)
Chinese (zh)
Inventor
安藤勝
鳥居雅弘
岩田愛
平川真
Original Assignee
日商東亞合成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東亞合成股份有限公司 filed Critical 日商東亞合成股份有限公司
Publication of TW202411390A publication Critical patent/TW202411390A/zh

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
TW112125058A 2022-07-06 2023-07-05 黏著劑組成物、黏合薄膜、附有黏著劑組成物層的積層體、積層體、及電磁波屏蔽薄膜 TW202411390A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-109188 2022-07-06
JP2022109188 2022-07-06

Publications (1)

Publication Number Publication Date
TW202411390A true TW202411390A (zh) 2024-03-16

Family

ID=89453384

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112125058A TW202411390A (zh) 2022-07-06 2023-07-05 黏著劑組成物、黏合薄膜、附有黏著劑組成物層的積層體、積層體、及電磁波屏蔽薄膜

Country Status (5)

Country Link
JP (1) JPWO2024009969A1 (https=)
KR (1) KR20250030475A (https=)
CN (1) CN119452058A (https=)
TW (1) TW202411390A (https=)
WO (1) WO2024009969A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026034325A1 (ja) * 2024-08-07 2026-02-12 東亞合成株式会社 接着剤組成物、ボンディングフィルム、接着剤層付き積層体、電磁波シールド材及び積層体

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3633274B2 (ja) * 1997-04-07 2005-03-30 日立化成工業株式会社 樹脂組成物及び接着フィルム
JP2001354938A (ja) * 2000-06-12 2001-12-25 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いた接着剤シート、半導体接続用基板ならびに半導体装置
JP2009001793A (ja) * 2008-06-06 2009-01-08 Kaneka Corp 接着剤
KR101741292B1 (ko) * 2010-07-23 2017-05-29 다츠다 덴센 가부시키가이샤 접착제 조성물 및 접착 필름
CN103923585A (zh) * 2014-04-03 2014-07-16 新纶科技(常州)有限公司 一种导电粘接剂组合物和导电粘接膜
JP2015228457A (ja) * 2014-06-02 2015-12-17 デクセリアルズ株式会社 太陽電池用導電性接着剤、太陽電池モジュール、及び太陽電池モジュールの製造方法
EP3165554A4 (en) * 2014-07-02 2018-02-28 Toyo Ink SC Holdings Co., Ltd. Heat-curable resin composition, polyamide, adhesive sheet, cured article, and printed wiring board
WO2022085563A1 (ja) * 2020-10-23 2022-04-28 東亞合成株式会社 樹脂組成物、ボンディングフィルム、樹脂組成物層付き積層体、積層体、及び、電磁波シールドフィルム

Also Published As

Publication number Publication date
CN119452058A (zh) 2025-02-14
WO2024009969A1 (ja) 2024-01-11
JPWO2024009969A1 (https=) 2024-01-11
KR20250030475A (ko) 2025-03-05

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